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Class Information
Number:
257/E23.029
Name:
Active solid-state devices (e.g., transistors, solid-state diodes)
>
Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo)
>
Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo)
>
Consisting of soldered or bonded constructions (epo)
>
Bases or plates or solder therefor (epo)
>
Characterized by material (epo)
> Semiconductor (epo)
Description:
This subclass is indented under subclass E23.028. This subclass is substantially the same in scope as ECLA classification H01L23/492M2.
Patents under this class:
Patent Number
Title Of Patent
Date Issued
7443032
Memory device with chemical vapor deposition of titanium for titanium silicide contacts
Oct. 28, 2008
5365405
Multi-chip module
Nov. 15, 1994
4885630
High power multi-layer semiconductive switching device having multiple parallel contacts with improved forward voltage drop
Dec. 5, 1989
4680619
Semiconductor device having silicon conductor tracks connected by a metal silicide track
Jul. 14, 1987
4646126
Semiconductor device
Feb. 24, 1987
4476483
Semiconductor device having a doped amorphous silicon adhesive layer
Oct. 9, 1984
4352120
Semiconductor device using SiC as supporter of a semiconductor element
Sep. 28, 1982
4261781
Process for forming compound semiconductor bodies
Apr. 14, 1981
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