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Class Information
Number: 257/E23.028
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Bases or plates or solder therefor (epo) > Characterized by material (epo)
Description: This subclass is indented under subclass E23.026. This subclass is substantially the same in scope as ECLA classification H01L23/492M.

Sub-classes under this class:

Class Number Class Name Patents
257/E23.03 Carbon (epo) 33
257/E23.029 Semiconductor (epo) 11

Patents under this class:
1 2

Patent Number Title Of Patent Date Issued
8637392 Solder interconnect with non-wettable sidewall pillars and methods of manufacture Jan. 28, 2014
8513796 Package structure, fabricating method thereof, and package-on-package device thereby Aug. 20, 2013
8471386 Junction body, semiconductor module, and manufacturing method for junction body Jun. 25, 2013
8350371 Semiconductor device and method of manufacturing semiconductor device Jan. 8, 2013
8324719 Electronic package system Dec. 4, 2012
8288868 Substrate bonding method and semiconductor device Oct. 16, 2012
8269345 Bump I/O contact for semiconductor device Sep. 18, 2012
8247836 Nickel tin bonding system with barrier layer for semiconductor wafers and devices Aug. 21, 2012
7944050 Integrated circuit device and a method of making the integrated circuit device May. 17, 2011
7829910 Light emitting device and method of fabricating light emitting device Nov. 9, 2010
7754343 Ternary alloy column grid array Jul. 13, 2010
7750484 Semiconductor device with flip-chip connection that uses gallium or indium as bonding material Jul. 6, 2010
7714449 Semiconductor device with bonding pad support structure May. 11, 2010
7705458 Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing same Apr. 27, 2010
7618844 Method of packaging and interconnection of integrated circuits Nov. 17, 2009
7402910 Solder, microelectromechanical component and device, and a process for producing a component or device Jul. 22, 2008
7189630 Layer sequence for producing a composite material for electromechanical components Mar. 13, 2007
6417564 Semiconductor element with metal layer Jul. 9, 2002
6268659 Semiconductor body with layer of solder material comprising chromium Jul. 31, 2001
6056186 Method for bonding a ceramic to a metal with a copper-containing shim May. 2, 2000
5905938 Method of manufacturing a semiconductor substrate material May. 18, 1999
5777388 Semiconductor device of the type sealed in glass having a silver-copper bonding layer between slugs and connection conductors Jul. 7, 1998
5760473 Semiconductor package having a eutectic bonding layer Jun. 2, 1998
5731635 Semiconductor device having a carrier and a multilayer metallization Mar. 24, 1998
5635764 Surface treated structure for solder joint Jun. 3, 1997
5614291 Semiconductor device and method of manufacturing the same Mar. 25, 1997
5439638 Method of making flowable tungsten/copper composite powder Aug. 8, 1995
5182628 Semiconductor device having particular solder interconnection arrangement Jan. 26, 1993
5134463 Stress relief layer providing high thermal conduction for a semiconductor device Jul. 28, 1992
5106009 Methods of joining components Apr. 21, 1992
5068156 Semiconductor package Nov. 26, 1991
5031822 Methods of joining components Jul. 16, 1991
5008735 Packaged diode for high temperature operation Apr. 16, 1991
4954870 Semiconductor device Sep. 4, 1990
4921158 Brazing material May. 1, 1990
4837928 Method of producing a jumper chip for semiconductor devices Jun. 13, 1989
4758874 Diode and metal stud therefor Jul. 19, 1988
4748493 Diode and metal stud therefor May. 31, 1988
4746055 Method and connecting material for the metallic joining of parts May. 24, 1988
4745036 Jumper chip for semiconductor devices May. 17, 1988
4734755 Alternating load stable switchable semiconductor device Mar. 29, 1988
4692788 Semiconductor device with solder overflow prevention geometry Sep. 8, 1987
4631805 Semiconductor device including plateless package fabrication method Dec. 30, 1986
4620215 Integrated circuit packaging systems with double surface heat dissipation Oct. 28, 1986
4610843 Low-alloy (Ni-Sn-Ti) copper alloy Sep. 9, 1986
4591484 Lead materials for semiconductor devices May. 27, 1986
4546374 Semiconductor device including plateless package Oct. 8, 1985
4532539 Solid-state diode-rectifier and heat sink structure Jul. 30, 1985
4521801 Semiconductor device with composite lead wire Jun. 4, 1985
4504849 Semiconductor devices and a solder for use in such devices Mar. 12, 1985

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