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Class Information
Number: 257/E23.028
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Bases or plates or solder therefor (epo) > Characterized by material (epo)
Description: This subclass is indented under subclass E23.026. This subclass is substantially the same in scope as ECLA classification H01L23/492M.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618844 |
Method of packaging and interconnection of integrated circuits |
Nov. 17, 2009 |
| 7402910 |
Solder, microelectromechanical component and device, and a process for producing a component or device |
Jul. 22, 2008 |
| 7189630 |
Layer sequence for producing a composite material for electromechanical components |
Mar. 13, 2007 |
| 6417564 |
Semiconductor element with metal layer |
Jul. 9, 2002 |
| 6268659 |
Semiconductor body with layer of solder material comprising chromium |
Jul. 31, 2001 |
| 6056186 |
Method for bonding a ceramic to a metal with a copper-containing shim |
May. 2, 2000 |
| 5905938 |
Method of manufacturing a semiconductor substrate material |
May. 18, 1999 |
| 5777388 |
Semiconductor device of the type sealed in glass having a silver-copper bonding layer between slugs and connection conductors |
Jul. 7, 1998 |
| 5760473 |
Semiconductor package having a eutectic bonding layer |
Jun. 2, 1998 |
| 5731635 |
Semiconductor device having a carrier and a multilayer metallization |
Mar. 24, 1998 |
| 5635764 |
Surface treated structure for solder joint |
Jun. 3, 1997 |
| 5614291 |
Semiconductor device and method of manufacturing the same |
Mar. 25, 1997 |
| 5439638 |
Method of making flowable tungsten/copper composite powder |
Aug. 8, 1995 |
| 5182628 |
Semiconductor device having particular solder interconnection arrangement |
Jan. 26, 1993 |
| 5134463 |
Stress relief layer providing high thermal conduction for a semiconductor device |
Jul. 28, 1992 |
| 5106009 |
Methods of joining components |
Apr. 21, 1992 |
| 5068156 |
Semiconductor package |
Nov. 26, 1991 |
| 5031822 |
Methods of joining components |
Jul. 16, 1991 |
| 5008735 |
Packaged diode for high temperature operation |
Apr. 16, 1991 |
| 4954870 |
Semiconductor device |
Sep. 4, 1990 |
| 4921158 |
Brazing material |
May. 1, 1990 |
| 4837928 |
Method of producing a jumper chip for semiconductor devices |
Jun. 13, 1989 |
| 4758874 |
Diode and metal stud therefor |
Jul. 19, 1988 |
| 4748493 |
Diode and metal stud therefor |
May. 31, 1988 |
| 4746055 |
Method and connecting material for the metallic joining of parts |
May. 24, 1988 |
| 4745036 |
Jumper chip for semiconductor devices |
May. 17, 1988 |
| 4734755 |
Alternating load stable switchable semiconductor device |
Mar. 29, 1988 |
| 4692788 |
Semiconductor device with solder overflow prevention geometry |
Sep. 8, 1987 |
| 4631805 |
Semiconductor device including plateless package fabrication method |
Dec. 30, 1986 |
| 4620215 |
Integrated circuit packaging systems with double surface heat dissipation |
Oct. 28, 1986 |
| 4610843 |
Low-alloy (Ni-Sn-Ti) copper alloy |
Sep. 9, 1986 |
| 4591484 |
Lead materials for semiconductor devices |
May. 27, 1986 |
| 4546374 |
Semiconductor device including plateless package |
Oct. 8, 1985 |
| 4532539 |
Solid-state diode-rectifier and heat sink structure |
Jul. 30, 1985 |
| 4521801 |
Semiconductor device with composite lead wire |
Jun. 4, 1985 |
| 4504849 |
Semiconductor devices and a solder for use in such devices |
Mar. 12, 1985 |
| 4503089 |
Method for producing semiconductor devices |
Mar. 5, 1985 |
| 4500904 |
Semiconductor device |
Feb. 19, 1985 |
| 4480261 |
Contact structure for a semiconductor substrate on a mounting body |
Oct. 30, 1984 |
| 4465742 |
Gold-plated electronic components |
Aug. 14, 1984 |
| 4451972 |
Method of making electronic chip with metalized back including a surface stratum of solder |
Jun. 5, 1984 |
| 4450208 |
Composite article for a semiconductor device |
May. 22, 1984 |
| 4424527 |
Bonding pad metallization for semiconductor devices |
Jan. 3, 1984 |
| 4402004 |
High current press pack semiconductor device having a mesa structure |
Aug. 30, 1983 |
| 4383886 |
Method of manufacturing a semiconductor element |
May. 17, 1983 |
| 4366117 |
Copper alloy for use as lead material for semiconductor devices |
Dec. 28, 1982 |
| 4358784 |
Clad molybdenum disks for alloyed diode |
Nov. 9, 1982 |
| 4357162 |
Solder composition |
Nov. 2, 1982 |
| 4352120 |
Semiconductor device using SiC as supporter of a semiconductor element |
Sep. 28, 1982 |
| 4349585 |
Gold-plated electronic components and process for production thereof |
Sep. 14, 1982 |
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