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Class Information
Number: 257/E23.027
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Bases or plates or solder therefor (epo) > Having heterogeneous or anisotropic structure (epo)
Description: This subclass is indented under subclass E26.026. This subclass is substantially the same in scope as ECLA classification H01L23/492H.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7538419 |
Stacked-type chip package structure |
May. 26, 2009 |
| 7459789 |
Bonding method of flexible film and display bonded thereby |
Dec. 2, 2008 |
| 7446403 |
Carrier structure stacking system and method |
Nov. 4, 2008 |
| 7265449 |
Tape circuit substrate, semiconductor chip package including the same, and liquid crystal display device including the semiconductor chip package |
Sep. 4, 2007 |
| 7245015 |
Display apparatus |
Jul. 17, 2007 |
| 7183191 |
Method for fabricating a chip scale package using wafer level processing |
Feb. 27, 2007 |
| 6774492 |
Chip package assembly having chip package mounted on printed circuit board |
Aug. 10, 2004 |
| 6653725 |
Chip package and method of manufacturing the same |
Nov. 25, 2003 |
| 5990548 |
Plate type member for semiconductor device package and package |
Nov. 23, 1999 |
| 5975922 |
Device containing directionally conductive composite medium |
Nov. 2, 1999 |
| 5932339 |
Anisotropically electricity conductive film comprising thermosetting adhesive agent and electrically conductive particles |
Aug. 3, 1999 |
| 5914156 |
Method for coating a carbonaceous material with a molybdenum carbide coating |
Jun. 22, 1999 |
| 5905938 |
Method of manufacturing a semiconductor substrate material |
May. 18, 1999 |
| 5879530 |
Anisotropic conductive film for microconnections |
Mar. 9, 1999 |
| 5854093 |
Direct attachment of silicon chip to circuit carrier |
Dec. 29, 1998 |
| 5834115 |
Metal and carbonaceous materials composites |
Nov. 10, 1998 |
| 5807766 |
Process for attaching a silicon chip to a circuit board using a block of encapsulated wires and the block of wires manufactured by the process |
Sep. 15, 1998 |
| 5681647 |
Anisotropic conductive film for microconnections |
Oct. 28, 1997 |
| 5675122 |
Sealable electronics packages |
Oct. 7, 1997 |
| 5506452 |
Power semiconductor component with pressure contact |
Apr. 9, 1996 |
| 5437921 |
Electronic components mounting base material |
Aug. 1, 1995 |
| 5433260 |
Sealable electronics packages and methods of producing and sealing such packages |
Jul. 18, 1995 |
| 5376825 |
Integrated circuit package for flexible computer system alternative architectures |
Dec. 27, 1994 |
| 5155302 |
Electronic device interconnection techniques |
Oct. 13, 1992 |
| 5100740 |
Direct bonded symmetric-metallic-laminate/substrate structures |
Mar. 31, 1992 |
| 5089439 |
Process for attaching large area silicon-backed chips to gold-coated surfaces |
Feb. 18, 1992 |
| 5033970 |
Self-mounted chip carrier |
Jul. 23, 1991 |
| 4820376 |
Fabrication of CPI layers |
Apr. 11, 1989 |
| 4650107 |
Method for the bubble-free joining of a large-area semiconductor component by means of soldering to a component part serving as substrate |
Mar. 17, 1987 |
| 4574299 |
Thyristor packaging system |
Mar. 4, 1986 |
| 4482912 |
Stacked structure having matrix-fibered composite layers and a metal layer |
Nov. 13, 1984 |
| 4427993 |
Thermal stress relieving bimetallic plate |
Jan. 24, 1984 |
| 4401728 |
Composite material |
Aug. 30, 1983 |
| 4385310 |
Structured copper strain buffer |
May. 24, 1983 |
| 4315591 |
Method for thermo-compression diffusion bonding a structured copper strain buffer to each side of a substrateless semiconductor device wafer |
Feb. 16, 1982 |
| 4290080 |
Method of making a strain buffer for a semiconductor device |
Sep. 15, 1981 |
| 3969754 |
Semiconductor device having supporting electrode composite structure of metal containing fibers |
Jul. 13, 1976 |
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