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Class Information
Number: 257/E23.027
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Bases or plates or solder therefor (epo) > Having heterogeneous or anisotropic structure (epo)
Description: This subclass is indented under subclass E26.026. This subclass is substantially the same in scope as ECLA classification H01L23/492H.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8704354 Package on package structures and methods for forming the same Apr. 22, 2014
8482125 Conductive sidewall for microbumps Jul. 9, 2013
8466545 Stackable semiconductor package Jun. 18, 2013
8377750 Integrated circuit packaging system with multiple row leads and method of manufacture thereof Feb. 19, 2013
8269351 Multi-chip stack package structure Sep. 18, 2012
8269345 Bump I/O contact for semiconductor device Sep. 18, 2012
8269352 Multi-chip stack package structure Sep. 18, 2012
8048766 Integrated circuit on high performance chip Nov. 1, 2011
7968914 Multi-component electrical module Jun. 28, 2011
7939369 3D integration structure and method using bonded metal planes May. 10, 2011
7911057 Bumpless flip-chip assembly with a complaint interposer contractor Mar. 22, 2011
7847385 Stacked die structure with an underlying copper-topped die Dec. 7, 2010
7799591 Semiconductor device and method for manufacturing the same Sep. 21, 2010
7708050 Composite material, having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods May. 4, 2010
7700495 Thin film transistor device and method of manufacturing the same, and liquid crystal display device Apr. 20, 2010
7538419 Stacked-type chip package structure May. 26, 2009
7459789 Bonding method of flexible film and display bonded thereby Dec. 2, 2008
7446403 Carrier structure stacking system and method Nov. 4, 2008
7265449 Tape circuit substrate, semiconductor chip package including the same, and liquid crystal display device including the semiconductor chip package Sep. 4, 2007
7245015 Display apparatus Jul. 17, 2007
7183191 Method for fabricating a chip scale package using wafer level processing Feb. 27, 2007
6774492 Chip package assembly having chip package mounted on printed circuit board Aug. 10, 2004
6653725 Chip package and method of manufacturing the same Nov. 25, 2003
5990548 Plate type member for semiconductor device package and package Nov. 23, 1999
5975922 Device containing directionally conductive composite medium Nov. 2, 1999
5932339 Anisotropically electricity conductive film comprising thermosetting adhesive agent and electrically conductive particles Aug. 3, 1999
5914156 Method for coating a carbonaceous material with a molybdenum carbide coating Jun. 22, 1999
5905938 Method of manufacturing a semiconductor substrate material May. 18, 1999
5879530 Anisotropic conductive film for microconnections Mar. 9, 1999
5854093 Direct attachment of silicon chip to circuit carrier Dec. 29, 1998
5834115 Metal and carbonaceous materials composites Nov. 10, 1998
5807766 Process for attaching a silicon chip to a circuit board using a block of encapsulated wires and the block of wires manufactured by the process Sep. 15, 1998
5681647 Anisotropic conductive film for microconnections Oct. 28, 1997
5675122 Sealable electronics packages Oct. 7, 1997
5506452 Power semiconductor component with pressure contact Apr. 9, 1996
5437921 Electronic components mounting base material Aug. 1, 1995
5433260 Sealable electronics packages and methods of producing and sealing such packages Jul. 18, 1995
5376825 Integrated circuit package for flexible computer system alternative architectures Dec. 27, 1994
5155302 Electronic device interconnection techniques Oct. 13, 1992
5100740 Direct bonded symmetric-metallic-laminate/substrate structures Mar. 31, 1992
5089439 Process for attaching large area silicon-backed chips to gold-coated surfaces Feb. 18, 1992
5033970 Self-mounted chip carrier Jul. 23, 1991
4820376 Fabrication of CPI layers Apr. 11, 1989
4650107 Method for the bubble-free joining of a large-area semiconductor component by means of soldering to a component part serving as substrate Mar. 17, 1987
4574299 Thyristor packaging system Mar. 4, 1986
4482912 Stacked structure having matrix-fibered composite layers and a metal layer Nov. 13, 1984
4427993 Thermal stress relieving bimetallic plate Jan. 24, 1984
4401728 Composite material Aug. 30, 1983
4385310 Structured copper strain buffer May. 24, 1983
4315591 Method for thermo-compression diffusion bonding a structured copper strain buffer to each side of a substrateless semiconductor device wafer Feb. 16, 1982

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