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Class Information
Number: 257/E23.026
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Bases or plates or solder therefor (epo)
Description: This subclass is indented under subclass E23.023. This subclass is substantially the same in scope as ECLA classification H01L23/492.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7601612 |
Method for forming solder joints for a flip chip assembly |
Oct. 13, 2009 |
| 7595553 |
Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus |
Sep. 29, 2009 |
| 7569920 |
Electronic component having at least one vertical semiconductor power transistor |
Aug. 4, 2009 |
| 7554172 |
Multi-directional multiplexing radius convergence electrode |
Jun. 30, 2009 |
| 7550845 |
Ball grid array package with separated stiffener layer |
Jun. 23, 2009 |
| 7492043 |
Power module flip chip package |
Feb. 17, 2009 |
| 7414319 |
Semiconductor chip assembly with metal containment wall and solder terminal |
Aug. 19, 2008 |
| 7411297 |
Microfeature devices and methods for manufacturing microfeature devices |
Aug. 12, 2008 |
| 7388293 |
Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions |
Jun. 17, 2008 |
| 7338891 |
Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof |
Mar. 4, 2008 |
| 7298039 |
Electronic circuit device |
Nov. 20, 2007 |
| 7298049 |
Submount for mounting semiconductor device |
Nov. 20, 2007 |
| 7242085 |
Semiconductor device including a semiconductor chip mounted on a metal base |
Jul. 10, 2007 |
| 7170183 |
Wafer level stacked package |
Jan. 30, 2007 |
| 7053299 |
Flange for integrated circuit package |
May. 30, 2006 |
| 7038917 |
Low loss, high density array interconnection |
May. 2, 2006 |
| 7030496 |
Semiconductor device having aluminum and metal electrodes and method for manufacturing the same |
Apr. 18, 2006 |
| 7030476 |
Rectifier diode device |
Apr. 18, 2006 |
| 7002244 |
Semiconductor device |
Feb. 21, 2006 |
| 6992384 |
High performance multi-chip flip chip package |
Jan. 31, 2006 |
| 6984883 |
Semiconductor power module |
Jan. 10, 2006 |
| 6958530 |
Rectification chip terminal structure |
Oct. 25, 2005 |
| 6930397 |
Surface mounted package with die bottom spaced from support board |
Aug. 16, 2005 |
| 6927479 |
Method of manufacturing a semiconductor package for a die larger than a die pad |
Aug. 9, 2005 |
| 6894377 |
Rectification chip terminal structure |
May. 17, 2005 |
| 6882040 |
Semiconductor device |
Apr. 19, 2005 |
| 6882057 |
Quad flat no-lead chip carrier |
Apr. 19, 2005 |
| 6879033 |
Semiconductor device |
Apr. 12, 2005 |
| 6873039 |
Methods of making microelectronic packages including electrically and/or thermally conductive element |
Mar. 29, 2005 |
| 6867367 |
Package for integrated circuit die |
Mar. 15, 2005 |
| 6864579 |
Carrier with a metal area and at least one chip configured on the metal area |
Mar. 8, 2005 |
| 6853066 |
Semiconductor device |
Feb. 8, 2005 |
| 6836023 |
Structure of integrated trace of chip package |
Dec. 28, 2004 |
| 6835580 |
Direct chip attach structure and method |
Dec. 28, 2004 |
| 6813154 |
Reversible heat sink packaging assembly for an integrated circuit |
Nov. 2, 2004 |
| 6812553 |
Electrically isolated and thermally conductive double-sided pre-packaged component |
Nov. 2, 2004 |
| 6784540 |
Semiconductor device package with improved cooling |
Aug. 31, 2004 |
| 6740969 |
Electronic device |
May. 25, 2004 |
| 6734044 |
Multiple leadframe laminated IC package |
May. 11, 2004 |
| 6696321 |
High performance multi-chip flip chip package |
Feb. 24, 2004 |
| 6627991 |
High performance multi-chip flip package |
Sep. 30, 2003 |
| 6593527 |
Integrated circuit assembly with bar bond attachment |
Jul. 15, 2003 |
| 6489678 |
High performance multi-chip flip chip package |
Dec. 3, 2002 |
| 6462413 |
LDMOS transistor heatsink package assembly and manufacturing method |
Oct. 8, 2002 |
| 6294403 |
High performance flip chip package |
Sep. 25, 2001 |
| 6254423 |
Power diode terminal holder mounting arrangement |
Jul. 3, 2001 |
| 6133634 |
High performance flip chip package |
Oct. 17, 2000 |
| 5736786 |
Power module with silicon dice oriented for improved reliability |
Apr. 7, 1998 |
| 5639990 |
Solid printed substrate and electronic circuit package using the same |
Jun. 17, 1997 |
| 5424579 |
Semiconductor device having low floating inductance |
Jun. 13, 1995 |
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