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Class Information
Number: 257/E23.026
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Bases or plates or solder therefor (epo)
Description: This subclass is indented under subclass E23.023. This subclass is substantially the same in scope as ECLA classification H01L23/492.

Sub-classes under this class:

Class Number Class Name Patents
257/E23.028 Characterized by material (epo) 80
257/E23.027 Having heterogeneous or anisotropic structure (epo) 52

Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8614512 Solder ball contact susceptible to lower stress Dec. 24, 2013
8552543 Semiconductor package Oct. 8, 2013
8513806 Laminated high melting point soldering layer formed by TLP bonding and fabrication method for the same, and semiconductor device Aug. 20, 2013
8471386 Junction body, semiconductor module, and manufacturing method for junction body Jun. 25, 2013
8415780 Package carrier and manufacturing method thereof Apr. 9, 2013
8378504 Microelectronic package with self-heating interconnect Feb. 19, 2013
8350371 Semiconductor device and method of manufacturing semiconductor device Jan. 8, 2013
8334589 Power block and power semiconductor module using same Dec. 18, 2012
8309395 Method of fabricating a high-temperature compatible power semiconductor module Nov. 13, 2012
8294257 Power block and power semiconductor module using same Oct. 23, 2012
8269345 Bump I/O contact for semiconductor device Sep. 18, 2012
8211752 Device and method including a soldering process Jul. 3, 2012
8159072 Rectification chip terminal structure Apr. 17, 2012
8148253 Electronic component soldering structure and electronic component soldering method Apr. 3, 2012
8143729 Autoclave capable chip-scale package Mar. 27, 2012
8129834 Integral metal structure with conductive post portions Mar. 6, 2012
8119450 Interconnecting a chip and a substrate by bonding pure metal bumps and pure metal spots Feb. 21, 2012
8101514 Semiconductor device having elastic solder bump to prevent disconnection Jan. 24, 2012
8093728 Connection by fitting together two soldered inserts Jan. 10, 2012
8063485 Electronics package with integrated lugs for cooling attachment Nov. 22, 2011
8063490 Semiconductor device including semiconductor constituent Nov. 22, 2011
8039971 Electronic circuit arrangement Oct. 18, 2011
8022556 Electrical component having a reduced substrate area Sep. 20, 2011
7989951 Die assemblies Aug. 2, 2011
7960834 Electronic element that includes multilayered bonding interface between first electrode having aluminum-containing surface and second electrode composed of metal nanoparticle sintered body Jun. 14, 2011
7951701 Semiconductor device having elastic solder bump to prevent disconnection May. 31, 2011
7855430 Electronic components on trenched substrates and method of forming same Dec. 21, 2010
7825524 QFN housing having optimized connecting surface geometry Nov. 2, 2010
7799612 Process applying die attach film to singulated die Sep. 21, 2010
7786564 Semiconductor device and method for manufacturing semiconductor device Aug. 31, 2010
7777301 Electronic components on trenched substrates and method of forming same Aug. 17, 2010
7772692 Semiconductor device with cooling member Aug. 10, 2010
7759793 Semiconductor device having elastic solder bump to prevent disconnection Jul. 20, 2010
7759775 High current semiconductor power device SOIC package Jul. 20, 2010
7745930 Semiconductor device packages with substrates for redistributing semiconductor device electrodes Jun. 29, 2010
7732937 Semiconductor package with mold lock vent Jun. 8, 2010
7732894 Electronic components on trenched substrates and method of forming same Jun. 8, 2010
7727813 Method for making a device including placing a semiconductor chip on a substrate Jun. 1, 2010
7723158 Method for producing and cleaning surface-mountable bases with external contacts May. 25, 2010
7713859 Tin-silver solder bumping in electronics manufacture May. 11, 2010
7705443 Semiconductor device with lead frame including conductor plates arranged three-dimensionally Apr. 27, 2010
7663242 Thermal interface material and solder preforms Feb. 16, 2010
7648856 Methods for attaching microfeature dies to external devices Jan. 19, 2010
7601612 Method for forming solder joints for a flip chip assembly Oct. 13, 2009
7595553 Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus Sep. 29, 2009
7569920 Electronic component having at least one vertical semiconductor power transistor Aug. 4, 2009
7554172 Multi-directional multiplexing radius convergence electrode Jun. 30, 2009
7550845 Ball grid array package with separated stiffener layer Jun. 23, 2009
7492043 Power module flip chip package Feb. 17, 2009
7414319 Semiconductor chip assembly with metal containment wall and solder terminal Aug. 19, 2008

1 2 3

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