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Class Information
Number: 257/E23.025
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Wire-like arrangements or pins or rods (epo) > Characterized by materials of wires or their coatings (epo)
Description: This subclass is indented under subclass E23.024. This subclass is substantially the same in scope as ECLA classification H01L23/49M.

Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8653668 Copper bonding wire for semiconductor device and bonding structure thereof Feb. 18, 2014
8618656 Flexible semiconductor package apparatus having a responsive bendable conductive wire member and a manufacturing the same Dec. 31, 2013
8618677 Wirebonded semiconductor package Dec. 31, 2013
8587133 Semiconductor device Nov. 19, 2013
8581417 Semiconductor device stack with bonding layer and wire retaining member Nov. 12, 2013
8415797 Gold wire for semiconductor element connection Apr. 9, 2013
8395261 Semiconductor device Mar. 12, 2013
8334596 Semiconductor device including coupling ball with layers of aluminum and copper alloys Dec. 18, 2012
8269355 Flexible contactless wire bonding structure and methodology for semiconductor device Sep. 18, 2012
8237276 Bump structure and fabrication method thereof Aug. 7, 2012
8212349 Semiconductor package having chip using copper process Jul. 3, 2012
8120139 Void isolated III-nitride device Feb. 21, 2012
8110931 Wafer and semiconductor package Feb. 7, 2012
8105932 Mixed wire semiconductor lead frame package Jan. 31, 2012
8093729 Electrically conductive interconnect system and method Jan. 10, 2012
8084870 Semiconductor devices and electrical parts manufacturing using metal coated wires Dec. 27, 2011
8076779 Reduction of macro level stresses in copper/low-K wafers Dec. 13, 2011
8053906 Semiconductor package and method for processing and bonding a wire Nov. 8, 2011
7927905 Method of producing microsprings having nanowire tip structures Apr. 19, 2011
7897417 Hybrid nanocomposite semiconductor material, and method of producing inorganic semiconductor therefor Mar. 1, 2011
7863759 Package structure and method for chip with two arrays of bonding pads on BGA substrate for preventing gold bonding wires from collapse Jan. 4, 2011
7843062 Thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperature Nov. 30, 2010
7830008 Gold wire for connecting semiconductor chip Nov. 9, 2010
7732935 Wiring board, electronic circuit board, electronic apparatus and manufacturing method of electronic circuit board Jun. 8, 2010
7709401 Method of making thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperature May. 4, 2010
7663221 Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same Feb. 16, 2010
7535014 Integrally gated carbon nanotube field ionizer device and method of manufacture therefor May. 19, 2009
7495342 Angled flying lead wire bonding process Feb. 24, 2009
7470581 Electromagnetic waveguide Dec. 30, 2008
7459789 Bonding method of flexible film and display bonded thereby Dec. 2, 2008
7314781 Device packages having stable wirebonds Jan. 1, 2008
7250686 Semiconductor device, method for designing the same and recording medium that can be read by computer in which program for designing semiconductor device is recorded Jul. 31, 2007
7214553 Process for the localized growth of nanotubes and process for fabricating a self-aligned cathode using the nanotube growth process May. 8, 2007
7215031 Multi chip package May. 8, 2007
7205673 Reduce or eliminate IMC cracking in post wire bonded dies by doping aluminum used in bond pads during Cu/Low-k BEOL processing Apr. 17, 2007
7098144 Iridium oxide nanotubes and method for forming same Aug. 29, 2006
7061257 Probe card assembly Jun. 13, 2006
7049214 Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors May. 23, 2006
7019391 NANO IC packaging Mar. 28, 2006
6996147 Methods of fabricating nanostructures and nanowires and devices fabricated therefrom Feb. 7, 2006
6991147 Insulated bonding wire tool for microelectronic packaging Jan. 31, 2006
6953992 Electronic component with at least one semiconductor chip and method for its manufacture Oct. 11, 2005
6913468 Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods Jul. 5, 2005
6903440 Electronic component of a high frequency current suppression type and bonding wire for the same Jun. 7, 2005
6896170 Wire bonder for ball bonding insulated wire and method of using same May. 24, 2005
6897569 Apparatus for implementing selected functionality on an integrated circuit device in an electronic device May. 24, 2005
6894398 Insulated bond wire assembly for integrated circuits May. 17, 2005
6882051 Nanowires, nanostructures and devices fabricated therefrom Apr. 19, 2005
6858472 Method for implementing selected functionality on an integrated circuit device Feb. 22, 2005
6838893 Probe card assembly Jan. 4, 2005

1 2 3 4

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