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Class Information
Number: 257/E23.025
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Wire-like arrangements or pins or rods (epo) > Characterized by materials of wires or their coatings (epo)
Description: This subclass is indented under subclass E23.024. This subclass is substantially the same in scope as ECLA classification H01L23/49M.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7535014 |
Integrally gated carbon nanotube field ionizer device and method of manufacture therefor |
May. 19, 2009 |
| 7495342 |
Angled flying lead wire bonding process |
Feb. 24, 2009 |
| 7470581 |
Electromagnetic waveguide |
Dec. 30, 2008 |
| 7459789 |
Bonding method of flexible film and display bonded thereby |
Dec. 2, 2008 |
| 7314781 |
Device packages having stable wirebonds |
Jan. 1, 2008 |
| 7250686 |
Semiconductor device, method for designing the same and recording medium that can be read by computer in which program for designing semiconductor device is recorded |
Jul. 31, 2007 |
| 7215031 |
Multi chip package |
May. 8, 2007 |
| 7214553 |
Process for the localized growth of nanotubes and process for fabricating a self-aligned cathode using the nanotube growth process |
May. 8, 2007 |
| 7205673 |
Reduce or eliminate IMC cracking in post wire bonded dies by doping aluminum used in bond pads during Cu/Low-k BEOL processing |
Apr. 17, 2007 |
| 7098144 |
Iridium oxide nanotubes and method for forming same |
Aug. 29, 2006 |
| 7061257 |
Probe card assembly |
Jun. 13, 2006 |
| 7049214 |
Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors |
May. 23, 2006 |
| 7019391 |
NANO IC packaging |
Mar. 28, 2006 |
| 6996147 |
Methods of fabricating nanostructures and nanowires and devices fabricated therefrom |
Feb. 7, 2006 |
| 6991147 |
Insulated bonding wire tool for microelectronic packaging |
Jan. 31, 2006 |
| 6953992 |
Electronic component with at least one semiconductor chip and method for its manufacture |
Oct. 11, 2005 |
| 6913468 |
Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods |
Jul. 5, 2005 |
| 6903440 |
Electronic component of a high frequency current suppression type and bonding wire for the same |
Jun. 7, 2005 |
| 6897569 |
Apparatus for implementing selected functionality on an integrated circuit device in an electronic device |
May. 24, 2005 |
| 6896170 |
Wire bonder for ball bonding insulated wire and method of using same |
May. 24, 2005 |
| 6894398 |
Insulated bond wire assembly for integrated circuits |
May. 17, 2005 |
| 6882051 |
Nanowires, nanostructures and devices fabricated therefrom |
Apr. 19, 2005 |
| 6858472 |
Method for implementing selected functionality on an integrated circuit device |
Feb. 22, 2005 |
| 6838893 |
Probe card assembly |
Jan. 4, 2005 |
| 6825512 |
Micromachined sensor with insulating protection of connections |
Nov. 30, 2004 |
| 6822340 |
Low capacitance coupling wire bonded semiconductor device |
Nov. 23, 2004 |
| 6818840 |
Method for manufacturing raised electrical contact pattern of controlled geometry |
Nov. 16, 2004 |
| 6777319 |
Microelectronic spring contact repair |
Aug. 17, 2004 |
| 6770822 |
High frequency device packages and methods |
Aug. 3, 2004 |
| 6759311 |
Fan out of interconnect elements attached to semiconductor wafer |
Jul. 6, 2004 |
| 6741085 |
Contact carriers (tiles) for populating larger substrates with spring contacts |
May. 25, 2004 |
| 6698646 |
Room temperature gold wire bonding |
Mar. 2, 2004 |
| 6700199 |
Gold-silver bonding wire for semiconductor device |
Mar. 2, 2004 |
| 6674177 |
Apparatus for implementing selected functionality on an integrated circuit device |
Jan. 6, 2004 |
| 6669489 |
Interposer, socket and assembly for socketing an electronic component and method of making and using same |
Dec. 30, 2003 |
| 6670214 |
Insulated bonding wire for microelectronic packaging |
Dec. 30, 2003 |
| 6655023 |
Method and apparatus for burning-in semiconductor devices in wafer form |
Dec. 2, 2003 |
| 6653170 |
Semiconductor chip assembly with elongated wire ball bonded to chip and electrolessly plated to support circuit |
Nov. 25, 2003 |
| 6635560 |
Method for implementing selected functionality on an integrated circuit device |
Oct. 21, 2003 |
| 6635961 |
Electronic component of a high frequency current suppression type and bonding wire for the same |
Oct. 21, 2003 |
| 6617692 |
Apparatus for implementing selected functionality on an integrated circuit device |
Sep. 9, 2003 |
| 6608390 |
Wirebonded semiconductor package structure and method of manufacture |
Aug. 19, 2003 |
| 6538214 |
Method for manufacturing raised electrical contact pattern of controlled geometry |
Mar. 25, 2003 |
| 6515373 |
Cu-pad/bonded/Cu-wire with self-passivating Cu-alloys |
Feb. 4, 2003 |
| 6492593 |
Gold wire for semiconductor element connection and semiconductor element connection method |
Dec. 10, 2002 |
| 6472764 |
Method and apparatus for implementing selected functionality on an integrated circuit device |
Oct. 29, 2002 |
| 6469260 |
Wiring boards, semiconductor devices and their production processes |
Oct. 22, 2002 |
| 6426565 |
Electronic package and method of making same |
Jul. 30, 2002 |
| 6388272 |
W/WC/TAC ohmic and rectifying contacts on SiC |
May. 14, 2002 |
| 6351040 |
Method and apparatus for implementing selected functionality on an integrated circuit device |
Feb. 26, 2002 |
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