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Class Information
Number: 257/E23.024
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Wire-like arrangements or pins or rods (epo)
Description: This subclass is indented under subclass E23.023. This subclass is substantially the same in scope as ECLA classification H01L23/49.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.025 Characterized by materials of wires or their coatings (epo) 158


Patents under this class:
1 2 3 4 5 6

Patent Number Title Of Patent Date Issued
8710666 Semiconductor device and method for fabricating the same Apr. 29, 2014
8710679 Electrode structure and its manufacturing method, and semiconductor module Apr. 29, 2014
8680663 Methods and apparatus for package on package devices with reduced strain Mar. 25, 2014
8680688 Stack package having flexible conductors Mar. 25, 2014
8659144 Power and ground planes in package substrate Feb. 25, 2014
8642393 Package on package devices and methods of forming same Feb. 4, 2014
8637394 Integrated circuit package system with flex bump Jan. 28, 2014
8637975 Semiconductor device having lead wires connecting bonding pads formed on opposite sides of a core region forming a shield area Jan. 28, 2014
8618650 Flange package for a semiconductor device Dec. 31, 2013
8609525 Integrated circuit packaging system with interconnects and method of manufacture thereof Dec. 17, 2013
8610274 Die structure, die arrangement and method of processing a die Dec. 17, 2013
8604627 Semiconductor device Dec. 10, 2013
8592310 Methods of manufacturing a semiconductor device Nov. 26, 2013
8586417 Isostress grid array and method of fabrication thereof Nov. 19, 2013
8575766 Microelectronic assembly with impedance controlled wirebond and conductive reference element Nov. 5, 2013
8571229 Semiconductor device Oct. 29, 2013
8558368 Bi-directional, reverse blocking battery switch Oct. 15, 2013
8552570 Wiring board, semiconductor device, and method for manufacturing wiring board and semiconductor device Oct. 8, 2013
8552550 Semiconductor device Oct. 8, 2013
8546948 Silicon structure having bonding pad Oct. 1, 2013
8536710 Semiconductor device and manufacturing method thereof Sep. 17, 2013
8530985 Chip package and method for forming the same Sep. 10, 2013
8518744 Method of manufacturing semiconductor device Aug. 27, 2013
8519527 Isostress grid array and method of fabrication thereof Aug. 27, 2013
8508028 Chip package and method for forming the same Aug. 13, 2013
8502368 Multi-chip package with offset die stacking Aug. 6, 2013
8497585 Chip package Jul. 30, 2013
8492786 Light emitting device package and lighting system Jul. 23, 2013
8487424 Routable array metal integrated circuit package fabricated using partial etching process Jul. 16, 2013
8476726 Semiconductor device and method of manufacturing the semiconductor device Jul. 2, 2013
8455304 Routable array metal integrated circuit package fabricated using partial etching process Jun. 4, 2013
8432043 Stacked wire bonded semiconductor package with low profile bond line Apr. 30, 2013
8432028 Integrated circuit packaging system with package-on-package and method of manufacture thereof Apr. 30, 2013
8426983 Semiconductor device Apr. 23, 2013
8404520 Package-on-package assembly with wire bond vias Mar. 26, 2013
8373279 Die package Feb. 12, 2013
8357998 Wirebonded semiconductor package Jan. 22, 2013
8338937 Flange package for a semiconductor device Dec. 25, 2012
8319332 Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts Nov. 27, 2012
8288873 Stack package having flexible conductors Oct. 16, 2012
8283780 Surface mount semiconductor device Oct. 9, 2012
8278768 Semiconductor device including wires connecting electrodes to an inner lead Oct. 2, 2012
8269356 Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates Sep. 18, 2012
8258616 Semiconductor dice having a shielded area created under bond wires connecting pairs of bonding pads Sep. 4, 2012
8253259 Microelectronic assembly with impedance controlled wirebond and reference wirebond Aug. 28, 2012
8237276 Bump structure and fabrication method thereof Aug. 7, 2012
8232634 Semiconductor device having a pin mounted heat sink Jul. 31, 2012
8217520 System-in-package packaging for minimizing bond wire contamination and yield loss Jul. 10, 2012
8217517 Semiconductor device provided with wire that electrically connects printed wiring board and semiconductor chip each other Jul. 10, 2012
8203219 Electrically enhanced wirebond package Jun. 19, 2012

1 2 3 4 5 6










 
 
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