| |
 |
|
Class Information
Number: 257/E23.024
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Wire-like arrangements or pins or rods (epo)
Description: This subclass is indented under subclass E23.023. This subclass is substantially the same in scope as ECLA classification H01L23/49.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7602059 |
Lead pin, circuit, semiconductor device, and method of forming lead pin |
Oct. 13, 2009 |
| 7569428 |
Method for manufacturing semiconductor device, semiconductor device and apparatus comprising same |
Aug. 4, 2009 |
| 7569877 |
System and method based on field-effect transistors for addressing nanometer-scale devices |
Aug. 4, 2009 |
| 7557454 |
Assemblies with bond pads of two or more semiconductor devices electrically connected to the same surface of a plurality of leads |
Jul. 7, 2009 |
| 7547626 |
Semiconductor package and method of forming wire loop of semiconductor package |
Jun. 16, 2009 |
| 7541222 |
Wire sweep resistant semiconductor package and manufacturing method therefor |
Jun. 2, 2009 |
| 7535113 |
Reduced inductance in ball grid array packages |
May. 19, 2009 |
| 7531895 |
Integrated circuit package and method of manufacture thereof |
May. 12, 2009 |
| 7528467 |
IC substrate with over voltage protection function |
May. 5, 2009 |
| 7521812 |
Method of wire bonding over active area of a semiconductor circuit |
Apr. 21, 2009 |
| 7501709 |
BGA package with wiring schemes having reduced current loop paths to improve cross talk control and characteristic impedance |
Mar. 10, 2009 |
| 7495342 |
Angled flying lead wire bonding process |
Feb. 24, 2009 |
| 7479697 |
Resilient carrier assembly for an integrated circuit |
Jan. 20, 2009 |
| 7468560 |
Semiconductor device with micro connecting elements and method for producing the same |
Dec. 23, 2008 |
| 7462557 |
Semiconductor component and method for contracting said semiconductor component |
Dec. 9, 2008 |
| 7456479 |
Method for fabricating a probing pad of an integrated circuit chip |
Nov. 25, 2008 |
| 7453156 |
Wire bond interconnection |
Nov. 18, 2008 |
| 7436074 |
Chip package without core and stacked chip package structure thereof |
Oct. 14, 2008 |
| 7420286 |
Reduced inductance in ball grid array packages |
Sep. 2, 2008 |
| 7335977 |
Semiconductor chip mounting arrangement |
Feb. 26, 2008 |
| 7326594 |
Connecting a plurality of bond pads and/or inner leads with a single bond wire |
Feb. 5, 2008 |
| 7309916 |
Semiconductor package and method for its manufacture |
Dec. 18, 2007 |
| 7309648 |
Low profile, chip-scale package and method of fabrication |
Dec. 18, 2007 |
| 7268438 |
Semiconductor element including a wet prevention film |
Sep. 11, 2007 |
| 7262124 |
Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus |
Aug. 28, 2007 |
| 7253505 |
IC substrate with over voltage protection function |
Aug. 7, 2007 |
| 7250686 |
Semiconductor device, method for designing the same and recording medium that can be read by computer in which program for designing semiconductor device is recorded |
Jul. 31, 2007 |
| 7239024 |
Semiconductor package with recess for die |
Jul. 3, 2007 |
| 7227240 |
Semiconductor device with wire bond inductor and method |
Jun. 5, 2007 |
| 7217995 |
Apparatus for stacking electrical components using insulated and interconnecting via |
May. 15, 2007 |
| 7211888 |
Encapsulation of pin solder for maintaining accuracy in pin position |
May. 1, 2007 |
| 7205673 |
Reduce or eliminate IMC cracking in post wire bonded dies by doping aluminum used in bond pads during Cu/Low-k BEOL processing |
Apr. 17, 2007 |
| 7199477 |
Multi-tiered lead package for an integrated circuit |
Apr. 3, 2007 |
| 7157790 |
Single die stitch bonding |
Jan. 2, 2007 |
| 7109586 |
System for reducing or eliminating semiconductor device wire sweep |
Sep. 19, 2006 |
| 7071090 |
Semiconductor element having protruded bump electrodes |
Jul. 4, 2006 |
| 7064566 |
Probe card assembly and kit |
Jun. 20, 2006 |
| 7061257 |
Probe card assembly |
Jun. 13, 2006 |
| 7029949 |
Method for fabricating encapsulated semiconductor components having conductive vias |
Apr. 18, 2006 |
| 6984885 |
Semiconductor device having densely stacked semiconductor chips |
Jan. 10, 2006 |
| 6972496 |
Chip-scaled package having a sealed connection wire |
Dec. 6, 2005 |
| 6964915 |
Method of fabricating encapsulated semiconductor components by etching |
Nov. 15, 2005 |
| 6958530 |
Rectification chip terminal structure |
Oct. 25, 2005 |
| 6956283 |
Encapsulants for protecting MEMS devices during post-packaging release etch |
Oct. 18, 2005 |
| 6956174 |
Tip structures |
Oct. 18, 2005 |
| 6937037 |
Probe card assembly for contacting a device with raised contact elements |
Aug. 30, 2005 |
| 6913468 |
Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods |
Jul. 5, 2005 |
| 6908784 |
Method for fabricating encapsulated semiconductor components |
Jun. 21, 2005 |
| 6897569 |
Apparatus for implementing selected functionality on an integrated circuit device in an electronic device |
May. 24, 2005 |
| 6885106 |
Stacked microelectronic assemblies and methods of making same |
Apr. 26, 2005 |
|
|
|
