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Class Information
Number: 257/E23.023
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo)
Description: This subclass is indented under subclass E23.01. This subclass is substantially the same in scope as ECLA classification H01L23/488.

Sub-classes under this class:

Class Number Class Name Patents
257/E23.026 Bases or plates or solder therefor (epo) 132
257/E23.031 Lead frames or other flat leads (epo) 509
257/E23.06 Leads, i.e., metallizations or lead frames on insulating substrates, e.g., chip carriers (epo) 256
257/E23.024 Wire-like arrangements or pins or rods (epo) 295

Patents under this class:
1 2 3 4 5 6 7 8

Patent Number Title Of Patent Date Issued
8703543 Vertical sensor assembly method Apr. 22, 2014
8704352 Semiconductor device having a liquid cooling module Apr. 22, 2014
8704364 Reducing stress in multi-die integrated circuit structures Apr. 22, 2014
8703508 Method for wafer-level testing diced multi-chip stacked packages Apr. 22, 2014
8692384 Semiconductor device with through silicon via and alignment mark Apr. 8, 2014
8686547 Stack die structure for stress reduction and facilitation of electromagnetic shielding Apr. 1, 2014
8686571 Bonding layer structure and method for wafer to wafer bonding Apr. 1, 2014
8680688 Stack package having flexible conductors Mar. 25, 2014
8674505 Integrated circuit packaging with ball grid array having differential pitch to enhance thermal performance Mar. 18, 2014
8674477 Semiconductor package with embedded spiral inductor Mar. 18, 2014
8673762 Solder, soldering method, and semiconductor device Mar. 18, 2014
8669653 Semiconductor device having electronic component in through part, electronic device, and manufacturing method of semiconductor Mar. 11, 2014
8664773 Mounting structure of semiconductor package component and manufacturing method therefor Mar. 4, 2014
8643180 Semiconductor device Feb. 4, 2014
8637779 Electronic component including micro balls Jan. 28, 2014
8637986 Semiconductor device and method for manufacturing thereof Jan. 28, 2014
8633575 IC package with integrated electrostatic discharge protection Jan. 21, 2014
8633600 Device and method for manufacturing a device Jan. 21, 2014
8618652 Forming functionalized carrier structures with coreless packages Dec. 31, 2013
8604625 Semiconductor device having conductive pads to prevent solder reflow Dec. 10, 2013
8604627 Semiconductor device Dec. 10, 2013
8598707 Solder alloy and semiconductor device Dec. 3, 2013
8598719 Semiconductor element mounting board Dec. 3, 2013
8598720 Semiconductor device and manufacturing method thereof Dec. 3, 2013
8592995 Method and structure for adhesion of intermetallic compound (IMC) on Cu pillar bump Nov. 26, 2013
8592986 High melting point soldering layer alloyed by transient liquid phase and fabrication method for the same, and semiconductor device Nov. 26, 2013
8586857 Combined diode, lead assembly incorporating an expansion joint Nov. 19, 2013
8587119 Conductive feature for semiconductor substrate and method of manufacture Nov. 19, 2013
8581423 Double solid metal pad with reduced area Nov. 12, 2013
8581401 Mechanisms for forming copper pillar bumps using patterned anodes Nov. 12, 2013
8569885 Stacked semiconductor packages and related methods Oct. 29, 2013
8571229 Semiconductor device Oct. 29, 2013
8564113 Electrostatic chucking of an insulator handle substrate Oct. 22, 2013
8564139 Semiconductor devices including protected barrier layers Oct. 22, 2013
8564140 Mono-acid hybrid conductive composition and method Oct. 22, 2013
8558400 Semiconductor packages and methods of fabricating the same Oct. 15, 2013
8552547 Electronic device package and method for forming the same Oct. 8, 2013
8551814 Method of fabricating a semiconductor device that limits damage to elements of the semiconductor device that are exposed during processing Oct. 8, 2013
8552568 Methods for forming three-dimensional memory devices, and related structures Oct. 8, 2013
8536702 Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods Sep. 17, 2013
8530345 Electrical contact alignment posts Sep. 10, 2013
8524593 Arrangement for solder bump formation on wafers Sep. 3, 2013
8524595 Semiconductor package structures Sep. 3, 2013
8519537 3D semiconductor package interposer with die cavity Aug. 27, 2013
8513108 Apparatus, system, and method for wireless connection in integrated circuit packages Aug. 20, 2013
8508022 Ultra thin package for electric acoustic sensor chip of micro electro mechanical system Aug. 13, 2013
8497578 Terminal face contact structure and method of making same Jul. 30, 2013
8487424 Routable array metal integrated circuit package fabricated using partial etching process Jul. 16, 2013
8487437 Electronic device package and method for fabricating the same Jul. 16, 2013
8471386 Junction body, semiconductor module, and manufacturing method for junction body Jun. 25, 2013

1 2 3 4 5 6 7 8

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