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Class Information
Number: 257/E23.023
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo)
Description: This subclass is indented under subclass E23.01. This subclass is substantially the same in scope as ECLA classification H01L23/488.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7622801 |
Thin planar semiconductor device |
Nov. 24, 2009 |
| 7619305 |
Semiconductor package-on-package (POP) device avoiding crack at solder joints of micro contacts during package stacking |
Nov. 17, 2009 |
| 7619306 |
Semiconductor device having projecting electrode formed by electrolytic plating, and manufacturing method thereof |
Nov. 17, 2009 |
| 7612444 |
Semiconductor package with flow controller |
Nov. 3, 2009 |
| 7612457 |
Semiconductor device including a stress buffer |
Nov. 3, 2009 |
| 7608921 |
Multi-layer semiconductor package |
Oct. 27, 2009 |
| 7601612 |
Method for forming solder joints for a flip chip assembly |
Oct. 13, 2009 |
| 7589413 |
Semiconductor device comprising a vertical semiconductor component and method for producing the same |
Sep. 15, 2009 |
| 7582552 |
Electronic apparatus with busbar assembly and electronic component mounted thereon by soldering |
Sep. 1, 2009 |
| 7566649 |
Compressible films surrounding solder connectors |
Jul. 28, 2009 |
| 7560802 |
Electrical connections in substrates |
Jul. 14, 2009 |
| 7554198 |
Flexible joint methodology to attach a die on an organic substrate |
Jun. 30, 2009 |
| 7538021 |
Removing dry film resist residues using hydrolyzable membranes |
May. 26, 2009 |
| 7535112 |
Semiconductor constructions comprising multi-level patterns of radiation-imageable material |
May. 19, 2009 |
| 7531383 |
Array quad flat no-lead package and method of forming same |
May. 12, 2009 |
| 7531426 |
Approach to high temperature wafer processing |
May. 12, 2009 |
| 7528474 |
Stacked semiconductor package assembly having hollowed substrate |
May. 5, 2009 |
| 7453155 |
Method for fabricating a flip chip package |
Nov. 18, 2008 |
| 7446405 |
Wafer level chip scale package (WLCSP) with high reliability against thermal stress |
Nov. 4, 2008 |
| 7411297 |
Microfeature devices and methods for manufacturing microfeature devices |
Aug. 12, 2008 |
| 7393719 |
Increased stand-off height integrated circuit assemblies, systems, and methods |
Jul. 1, 2008 |
| 7387910 |
Method of bonding solder pads of flip-chip package |
Jun. 17, 2008 |
| 7375429 |
Integrated circuit component and mounting method thereof |
May. 20, 2008 |
| 7371676 |
Method for fabricating semiconductor components with through wire interconnects |
May. 13, 2008 |
| 7368810 |
Invertible microfeature device packages |
May. 6, 2008 |
| 7368758 |
Method for hermetically housing optical components, and optical components produced according to said method |
May. 6, 2008 |
| 7368324 |
Method of manufacturing self-supporting contacting structures |
May. 6, 2008 |
| 7364943 |
Method of bonding a microelectronic die to a substrate and arrangement to carry out method |
Apr. 29, 2008 |
| 7358618 |
Semiconductor device and manufacturing method thereof |
Apr. 15, 2008 |
| 7355280 |
Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument |
Apr. 8, 2008 |
| 7332806 |
Thin, thermally enhanced molded package with leadframe having protruding region |
Feb. 19, 2008 |
| 7332821 |
Compressible films surrounding solder connectors |
Feb. 19, 2008 |
| 7327031 |
Semiconductor device and method of manufacturing the same |
Feb. 5, 2008 |
| 7314817 |
Microelectronic device interconnects |
Jan. 1, 2008 |
| 7309647 |
Method of mounting an electroless nickel immersion gold flip chip package |
Dec. 18, 2007 |
| 7298047 |
Electronic circuit device |
Nov. 20, 2007 |
| 7298049 |
Submount for mounting semiconductor device |
Nov. 20, 2007 |
| 7273806 |
Forming of high aspect ratio conductive structure using injection molded solder |
Sep. 25, 2007 |
| 7268438 |
Semiconductor element including a wet prevention film |
Sep. 11, 2007 |
| 7247514 |
Semiconductor device and method for producing the same |
Jul. 24, 2007 |
| 7245011 |
Prevention of contamination on bonding pads of wafer during SMT |
Jul. 17, 2007 |
| 7245024 |
Electronic assembly with reduced leakage current |
Jul. 17, 2007 |
| 7235871 |
Stacked microelectronic dies |
Jun. 26, 2007 |
| 7233072 |
Electronic part and surface treatment method of the same |
Jun. 19, 2007 |
| 7230320 |
Electronic circuit device with reduced breaking and cracking |
Jun. 12, 2007 |
| 7227268 |
Placement of sacrificial solder balls underneath the PBGA substrate |
Jun. 5, 2007 |
| 7221045 |
Flat chip semiconductor device and manufacturing method thereof |
May. 22, 2007 |
| 7215030 |
Lead-free semiconductor package |
May. 8, 2007 |
| 7211902 |
Method of forming a bonding pad structure |
May. 1, 2007 |
| 7208347 |
Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours |
Apr. 24, 2007 |
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