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Browse by Category: Main > Physics
Class Information
Number: 257/E23.022
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of lead-in layers inseparably applied to semiconductor body (epo) > Consisting of layered constructions comprising conductive layers and insulating layers, e.g., planar contacts (epo) > Overhang structure (epo)
Description: This subclass is indented under subclass E23.019. This subclass is substantially the same in scope as ECLA classification H01L23/485H.










Patents under this class:

Patent Number Title Of Patent Date Issued
8659174 Semiconductor device Feb. 25, 2014
8659175 Integrated circuit package system with offset stack Feb. 25, 2014
8525273 Integrated circuit devices including device isolation structures and methods of fabricating the same Sep. 3, 2013
8373279 Die package Feb. 12, 2013
8330253 Semiconductor device Dec. 11, 2012
8237258 Semiconductor module including a semiconductor device, a device mounting board, and a protecting layer therebetween Aug. 7, 2012
8232634 Semiconductor device having a pin mounted heat sink Jul. 31, 2012
8227900 Semiconductor device Jul. 24, 2012
8063495 Semiconductor device Nov. 22, 2011
8058727 Standing chip scale package Nov. 15, 2011
8030767 Bump structure with annular support Oct. 4, 2011
8030782 Metal-metal bonding of compliant interconnect Oct. 4, 2011
7989936 Microelectronic device with integrated energy source Aug. 2, 2011
7969003 Bump structure having a reinforcement member Jun. 28, 2011
7919837 Semiconductor device with sealed semiconductor chip Apr. 5, 2011
7892963 Integrated circuit packaging system and method of manufacture thereof Feb. 22, 2011
7884486 Chip-stacked package structure and method for manufacturing the same Feb. 8, 2011
7723840 Integrated circuit package system with contoured die May. 25, 2010
7701039 Semiconductor devices and in-process semiconductor devices having conductor filled vias Apr. 20, 2010
7679189 Display device and manufacturing method of the same Mar. 16, 2010
7635606 Wafer level package with cavities for active devices Dec. 22, 2009
7573137 Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices Aug. 11, 2009
7566575 Mounting circuit and method for producing semiconductor-chip-mounting circuit Jul. 28, 2009
7518250 Semiconductor device and a method for manufacturing of the same Apr. 14, 2009
7468316 Low fabrication cost, fine pitch and high reliability solder bump Dec. 23, 2008
7462932 Manufacture of mountable capped chips Dec. 9, 2008
7459795 Method to build a wirebond probe card in a many at a time fashion Dec. 2, 2008
7239019 Selectively converted inter-layer dielectric Jul. 3, 2007
7218008 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument May. 15, 2007
7211900 Thin semiconductor package including stacked dies May. 1, 2007
5834849 High density integrated circuit pad structures Nov. 10, 1998
5786625 Moisture resistant semiconductor device Jul. 28, 1998
5643805 Process for producing a bipolar device Jul. 1, 1997
5619069 Bipolar device and production thereof Apr. 8, 1997
4839715 Chip contacts without oxide discontinuities Jun. 13, 1989
4809055 Semiconductor device having an electrode and a method of manufacturing the same Feb. 28, 1989
4337115 Method of forming electrodes on the surface of a semiconductor substrate Jun. 29, 1982
4272561 Hybrid process for SBD metallurgies Jun. 9, 1981
4035206 Method of manufacturing a semiconductor device having a pattern of conductors Jul. 12, 1977











 
 
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