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Class Information
Number: 257/E23.022
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of lead-in layers inseparably applied to semiconductor body (epo) > Consisting of layered constructions comprising conductive layers and insulating layers, e.g., planar contacts (epo) > Overhang structure (epo)
Description: This subclass is indented under subclass E23.019. This subclass is substantially the same in scope as ECLA classification H01L23/485H.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7573137 |
Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices |
Aug. 11, 2009 |
| 7566575 |
Mounting circuit and method for producing semiconductor-chip-mounting circuit |
Jul. 28, 2009 |
| 7518250 |
Semiconductor device and a method for manufacturing of the same |
Apr. 14, 2009 |
| 7468316 |
Low fabrication cost, fine pitch and high reliability solder bump |
Dec. 23, 2008 |
| 7462932 |
Manufacture of mountable capped chips |
Dec. 9, 2008 |
| 7459795 |
Method to build a wirebond probe card in a many at a time fashion |
Dec. 2, 2008 |
| 7239019 |
Selectively converted inter-layer dielectric |
Jul. 3, 2007 |
| 7218008 |
Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
May. 15, 2007 |
| 7211900 |
Thin semiconductor package including stacked dies |
May. 1, 2007 |
| 5834849 |
High density integrated circuit pad structures |
Nov. 10, 1998 |
| 5786625 |
Moisture resistant semiconductor device |
Jul. 28, 1998 |
| 5643805 |
Process for producing a bipolar device |
Jul. 1, 1997 |
| 5619069 |
Bipolar device and production thereof |
Apr. 8, 1997 |
| 4839715 |
Chip contacts without oxide discontinuities |
Jun. 13, 1989 |
| 4809055 |
Semiconductor device having an electrode and a method of manufacturing the same |
Feb. 28, 1989 |
| 4337115 |
Method of forming electrodes on the surface of a semiconductor substrate |
Jun. 29, 1982 |
| 4272561 |
Hybrid process for SBD metallurgies |
Jun. 9, 1981 |
| 4035206 |
Method of manufacturing a semiconductor device having a pattern of conductors |
Jul. 12, 1977 |
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