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Class Information
Number: 257/E23.021
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of lead-in layers inseparably applied to semiconductor body (epo) > Consisting of layered constructions comprising conductive layers and insulating layers, e.g., planar contacts (epo) > Bump or ball contacts (epo)
Description: This subclass is indented under subclass E23.019. This subclass is substantially the same in scope as ECLA classification H01L23/485B.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6921715 |
Semiconductor package and method of fabricating same |
Jul. 26, 2005 |
| 6921716 |
Wafer bumping process |
Jul. 26, 2005 |
| 6921860 |
Microelectronic component assemblies having exposed contacts |
Jul. 26, 2005 |
| 6919232 |
Process for producing a semiconductor chip |
Jul. 19, 2005 |
| 6919264 |
Method for the solder-stop structuring of elevations on wafers |
Jul. 19, 2005 |
| 6916687 |
Bump process for flip chip package |
Jul. 12, 2005 |
| 6917105 |
Integrating chip scale packaging metallization into integrated circuit die structures |
Jul. 12, 2005 |
| 6917106 |
Selective ball-limiting metallurgy etching processes for fabrication of electroplated tin bumps |
Jul. 12, 2005 |
| 6917113 |
Lead-free alloys for column/ball grid arrays, organic interposers and passive component assembly |
Jul. 12, 2005 |
| 6917118 |
Semiconductor device |
Jul. 12, 2005 |
| 6917119 |
Low fabrication cost, high performance, high reliability chip scale package |
Jul. 12, 2005 |
| 6913468 |
Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods |
Jul. 5, 2005 |
| 6914333 |
Wafer level package incorporating dual compliant layers and method for fabrication |
Jul. 5, 2005 |
| 6911722 |
Resin-molded semiconductor device having posts with bumps |
Jun. 28, 2005 |
| 6908311 |
Connection terminal and a semiconductor device including at least one connection terminal |
Jun. 21, 2005 |
| 6908784 |
Method for fabricating encapsulated semiconductor components |
Jun. 21, 2005 |
| 6908842 |
Bumping process |
Jun. 21, 2005 |
| 6909181 |
Light signal processing system |
Jun. 21, 2005 |
| 6909182 |
Spherical semiconductor device and method for fabricating the same |
Jun. 21, 2005 |
| 6909194 |
Electronic assembly having semiconductor component with polymer support member and method of fabrication |
Jun. 21, 2005 |
| 6905915 |
Semiconductor device and method of manufacturing the same, and electronic instrument |
Jun. 14, 2005 |
| 6905954 |
Method for producing a semiconductor device and corresponding semiconductor device |
Jun. 14, 2005 |
| 6906417 |
Ball grid array utilizing solder balls having a core material covered by a metal layer |
Jun. 14, 2005 |
| 6906422 |
Microelectronic elements with deformable leads |
Jun. 14, 2005 |
| 6906429 |
Semiconductor device and method of fabricating the same |
Jun. 14, 2005 |
| 6902098 |
Solder pads and method of making a solder pad |
Jun. 7, 2005 |
| 6902995 |
Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad |
Jun. 7, 2005 |
| 6903451 |
Chip scale packages manufactured at wafer level |
Jun. 7, 2005 |
| 6900538 |
Integrating chip scale packaging metallization into integrated circuit die structures |
May. 31, 2005 |
| 6900654 |
Method and apparatus for evaluating a known good die using both wire bond and flip-chip interconnects |
May. 31, 2005 |
| 6900110 |
Chip scale package with compliant leads |
May. 31, 2005 |
| 6897088 |
Method for connecting circuit devices |
May. 24, 2005 |
| 6897091 |
Semiconductor device and manufacturing method thereof |
May. 24, 2005 |
| 6897141 |
Solder terminal and fabricating method thereof |
May. 24, 2005 |
| 6897142 |
Formation of solder balls having resin member as reinforcement |
May. 24, 2005 |
| 6897568 |
Electronic component with flexible contacting pads and method for producing the electronic component |
May. 24, 2005 |
| 6893904 |
Stereolithographic methods of fabricating semiconductor devices having protective layers thereon through which contact pads are exposed |
May. 17, 2005 |
| 6893952 |
Methods of forming a ball grid array including a non-conductive polymer core and a silver or silver alloy outer layer |
May. 17, 2005 |
| 6894387 |
Semiconductor element having protruded bump electrodes |
May. 17, 2005 |
| 6894390 |
Soft error resistant semiconductor device |
May. 17, 2005 |
| 6894394 |
Semiconductor device, circuit board, electronic apparatus, and method for manufacturing semiconductor device |
May. 17, 2005 |
| 6890793 |
Method for producing a semiconductor die package using leadframe with locating holes |
May. 10, 2005 |
| 6891255 |
Microelectronic packages having an array of resilient leads |
May. 10, 2005 |
| 6891274 |
Under-bump-metallurgy layer for improving adhesion |
May. 10, 2005 |
| 6887777 |
Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement |
May. 3, 2005 |
| 6887787 |
Method for fabricating semiconductor components with conductors having wire bondable metalization layers |
May. 3, 2005 |
| 6888242 |
Color contacts for a semiconductor package |
May. 3, 2005 |
| 6881612 |
Method of bonding a semiconductor element to a substrate |
Apr. 19, 2005 |
| 6881654 |
Solder bump structure and laser repair process for memory device |
Apr. 19, 2005 |
| 6882049 |
Support ring for use with a contact pad and semiconductor device components including the same |
Apr. 19, 2005 |
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