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Class Information
Number: 257/E23.021
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of lead-in layers inseparably applied to semiconductor body (epo) > Consisting of layered constructions comprising conductive layers and insulating layers, e.g., planar contacts (epo) > Bump or ball contacts (epo)
Description: This subclass is indented under subclass E23.019. This subclass is substantially the same in scope as ECLA classification H01L23/485B.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7411296 |
Method, system, and apparatus for gravity assisted chip attachment |
Aug. 12, 2008 |
| 7407878 |
Method of providing solder bumps on a substrate using localized heating |
Aug. 5, 2008 |
| 7407877 |
Self-coplanarity bumping shape for flip-chip |
Aug. 5, 2008 |
| 7400041 |
Compliant multi-composition interconnects |
Jul. 15, 2008 |
| 7399694 |
Semiconductor device and a manufacturing method of the same |
Jul. 15, 2008 |
| 7397121 |
Semiconductor chip with post-passivation scheme formed over passivation layer |
Jul. 8, 2008 |
| 7397117 |
Chip package with die and substrate |
Jul. 8, 2008 |
| 7393719 |
Increased stand-off height integrated circuit assemblies, systems, and methods |
Jul. 1, 2008 |
| 7391112 |
Capping copper bumps |
Jun. 24, 2008 |
| 7391110 |
Apparatus for providing capacitive decoupling between on-die power and ground conductors |
Jun. 24, 2008 |
| 7391106 |
Stack type package |
Jun. 24, 2008 |
| 7390732 |
Method for producing a semiconductor device with pyramidal bump electrodes bonded onto pad electrodes arranged on a semiconductor chip |
Jun. 24, 2008 |
| 7387910 |
Method of bonding solder pads of flip-chip package |
Jun. 17, 2008 |
| 7385288 |
Electronic packaging using conductive interproser connector |
Jun. 10, 2008 |
| 7382049 |
Chip package and bump connecting structure thereof |
Jun. 3, 2008 |
| 7378734 |
Stacked contact bump |
May. 27, 2008 |
| 7375434 |
Semiconductor chip with flexible contacts at a face |
May. 20, 2008 |
| 7375433 |
Semiconductor device packaging substrate and semiconductor device packaging structure |
May. 20, 2008 |
| 7375431 |
Solder bump formation in electronics packaging |
May. 20, 2008 |
| 7375429 |
Integrated circuit component and mounting method thereof |
May. 20, 2008 |
| 7375428 |
Flip-chip bonding structure using multi chip module-deposited substrate |
May. 20, 2008 |
| 7368821 |
BGA semiconductor chip package and mounting structure thereof |
May. 6, 2008 |
| 7368817 |
Bump-on-lead flip chip interconnection |
May. 6, 2008 |
| 7368374 |
Super high density module with integrated wafer level packages |
May. 6, 2008 |
| 7364998 |
Method for forming high reliability bump structure |
Apr. 29, 2008 |
| 7364943 |
Method of bonding a microelectronic die to a substrate and arrangement to carry out method |
Apr. 29, 2008 |
| 7361996 |
Semiconductor device having tin-based solder layer and method for manufacturing the same |
Apr. 22, 2008 |
| 7361993 |
Terminal pad structures and methods of fabricating same |
Apr. 22, 2008 |
| 7358618 |
Semiconductor device and manufacturing method thereof |
Apr. 15, 2008 |
| 7358608 |
Semiconductor device having chip size package with improved strength |
Apr. 15, 2008 |
| 7355285 |
Structure of mounting electronic component |
Apr. 8, 2008 |
| 7355280 |
Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument |
Apr. 8, 2008 |
| 7352054 |
Semiconductor device having conducting portion of upper and lower conductive layers |
Apr. 1, 2008 |
| 7351649 |
Recording head unit and method of producing the same |
Apr. 1, 2008 |
| 7348664 |
Semiconductor apparatus having a cooling apparatus that compressively engages a semiconductor device |
Mar. 25, 2008 |
| 7348269 |
Manufacturing method of semiconductor device, semiconductor device, circuit board, electro-optic device, and electronic apparatus |
Mar. 25, 2008 |
| 7335988 |
Use of palladium in IC manufacturing with conductive polymer bump |
Feb. 26, 2008 |
| 7332821 |
Compressible films surrounding solder connectors |
Feb. 19, 2008 |
| 7332801 |
Electronic device |
Feb. 19, 2008 |
| 7332430 |
Method for improving the mechanical properties of BOC module arrangements |
Feb. 19, 2008 |
| 7329951 |
Solder bumps in flip-chip technologies |
Feb. 12, 2008 |
| 7329950 |
RFIC die and package |
Feb. 12, 2008 |
| 7327032 |
Semiconductor package accomplishing fan-out structure through wire bonding |
Feb. 5, 2008 |
| 7327031 |
Semiconductor device and method of manufacturing the same |
Feb. 5, 2008 |
| 7327030 |
Apparatus and method incorporating discrete passive components in an electronic package |
Feb. 5, 2008 |
| 7326638 |
Method for manufacturing semiconductor device |
Feb. 5, 2008 |
| 7325302 |
Method of forming an interconnection element |
Feb. 5, 2008 |
| 7323780 |
Electrical interconnection structure formation |
Jan. 29, 2008 |
| 7323779 |
Semiconductor device |
Jan. 29, 2008 |
| 7319265 |
Semiconductor chip assembly with precision-formed metal pillar |
Jan. 15, 2008 |
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