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Class Information
Number: 257/E23.021
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of lead-in layers inseparably applied to semiconductor body (epo) > Consisting of layered constructions comprising conductive layers and insulating layers, e.g., planar contacts (epo) > Bump or ball contacts (epo)
Description: This subclass is indented under subclass E23.019. This subclass is substantially the same in scope as ECLA classification H01L23/485B.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618886 |
Semiconductor device and method of manufacturing the same |
Nov. 17, 2009 |
| 7615866 |
Contact surrounded by passivation and polymide and method therefor |
Nov. 10, 2009 |
| 7612456 |
Electronic device, semiconductor device using same, and method for manufacturing semiconductor device |
Nov. 3, 2009 |
| 7612450 |
Semiconductor package including dummy board and method of fabricating the same |
Nov. 3, 2009 |
| 7612449 |
Optimized power delivery to high speed, high pin-count devices |
Nov. 3, 2009 |
| 7611925 |
Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument |
Nov. 3, 2009 |
| 7608480 |
Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion |
Oct. 27, 2009 |
| 7605477 |
Stacked integrated circuit assembly |
Oct. 20, 2009 |
| 7601627 |
Method for reduction of soft error rates in integrated circuits |
Oct. 13, 2009 |
| 7601626 |
Method for manufacturing semiconductor device, and method and structure for implementing semiconductor device |
Oct. 13, 2009 |
| 7598613 |
Flip chip bonding structure |
Oct. 6, 2009 |
| 7598612 |
Semiconductor device and manufacturing method thereof |
Oct. 6, 2009 |
| 7592710 |
Bond pad structure for wire bonding |
Sep. 22, 2009 |
| 7589426 |
Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom |
Sep. 15, 2009 |
| 7582968 |
Wiring board with a protective film greater in heights than bumps |
Sep. 1, 2009 |
| 7579693 |
Mounting structure of ball grid array |
Aug. 25, 2009 |
| 7579692 |
Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument |
Aug. 25, 2009 |
| 7579684 |
Methods for packing microfeature devices and microfeature devices formed by such methods |
Aug. 25, 2009 |
| 7579681 |
Super high density module with integrated wafer level packages |
Aug. 25, 2009 |
| 7572725 |
Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods |
Aug. 11, 2009 |
| 7569935 |
Pillar-to-pillar flip-chip assembly |
Aug. 4, 2009 |
| 7569922 |
Semiconductor device having a bonding wire and method for manufacturing the same |
Aug. 4, 2009 |
| 7569920 |
Electronic component having at least one vertical semiconductor power transistor |
Aug. 4, 2009 |
| 7569905 |
Systems and methods for electrical contacts to arrays of vertically aligned nanorods |
Aug. 4, 2009 |
| 7566661 |
Electroless treatment of noble metal barrier and adhesion layer |
Jul. 28, 2009 |
| 7566649 |
Compressible films surrounding solder connectors |
Jul. 28, 2009 |
| 7566575 |
Mounting circuit and method for producing semiconductor-chip-mounting circuit |
Jul. 28, 2009 |
| 7560814 |
Semiconductor device that improves electrical connection reliability |
Jul. 14, 2009 |
| 7560802 |
Electrical connections in substrates |
Jul. 14, 2009 |
| 7559139 |
Method for manufacturing a probe unit |
Jul. 14, 2009 |
| 7554206 |
Microelectronic packages and methods therefor |
Jun. 30, 2009 |
| 7554201 |
Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same |
Jun. 30, 2009 |
| 7554197 |
High frequency IC package and method for fabricating the same |
Jun. 30, 2009 |
| 7550855 |
Vertically spaced plural microsprings |
Jun. 23, 2009 |
| 7550830 |
Stacked semiconductor package having fan-out structure through wire bonding |
Jun. 23, 2009 |
| 7547624 |
Semiconductor device and method of producing the same |
Jun. 16, 2009 |
| 7545036 |
Semiconductor device that suppresses variations in high frequency characteristics of circuit elements |
Jun. 9, 2009 |
| 7544598 |
Semiconductor device and method of manufacturing the same |
Jun. 9, 2009 |
| 7538435 |
Wafer structure and bumping process |
May. 26, 2009 |
| 7538430 |
Semiconductor device and a method of manufacturing the same |
May. 26, 2009 |
| 7538429 |
Method of enabling solder deposition on a substrate and electronic package formed thereby |
May. 26, 2009 |
| 7538417 |
Semiconductor device with signal line having decreased characteristic impedance |
May. 26, 2009 |
| 7538021 |
Removing dry film resist residues using hydrolyzable membranes |
May. 26, 2009 |
| 7531894 |
Method of electrically connecting a microelectronic component |
May. 12, 2009 |
| 7528487 |
Semiconductor device having insulating material dispersed with conductive particles which establish electrical connection by penetrating to both copper conductive layer and land of wiring boar |
May. 5, 2009 |
| 7528486 |
Anisotropic conductive film and bump, and packaging structure of semiconductor having the same |
May. 5, 2009 |
| 7528478 |
Semiconductor devices having post passivation interconnections and a buffer layer |
May. 5, 2009 |
| 7528467 |
IC substrate with over voltage protection function |
May. 5, 2009 |
| 7528008 |
Method of electrically connecting a microelectronic component |
May. 5, 2009 |
| 7525193 |
Semiconductor device and method of manufacturing the same |
Apr. 28, 2009 |
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