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Class Information
Number: 257/E23.021
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of lead-in layers inseparably applied to semiconductor body (epo) > Consisting of layered constructions comprising conductive layers and insulating layers, e.g., planar contacts (epo) > Bump or ball contacts (epo)
Description: This subclass is indented under subclass E23.019. This subclass is substantially the same in scope as ECLA classification H01L23/485B.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710657 Semiconductor assembly and semiconductor package including a solder channel Apr. 29, 2014
8710656 Redistribution layer (RDL) with variable offset bumps Apr. 29, 2014
8710655 Die packages and systems having the die packages Apr. 29, 2014
8709935 Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties Apr. 29, 2014
8704350 Stacked wafer level package and method of manufacturing the same Apr. 22, 2014
8703599 Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts Apr. 22, 2014
8691610 Semiconductor device and method for manufacturing the same Apr. 8, 2014
8686574 Semiconductor device Apr. 1, 2014
8674507 Wafer level processing method and structure to manufacture two kinds of interconnects, gold and solder, on one wafer Mar. 18, 2014
8674506 Structures and methods to reduce maximum current density in a solder ball Mar. 18, 2014
8674501 Semiconductor integrated circuit device Mar. 18, 2014
8670638 Signal distribution and radiation in a wireless enabled integrated circuit (IC) using a leaky waveguide Mar. 11, 2014
8664760 Connector design for packaging integrated circuits Mar. 4, 2014
8659152 Semiconductor device Feb. 25, 2014
8659123 Metal pad structures in dies Feb. 25, 2014
8653662 Structure for monitoring stress induced failures in interlevel dielectric layers of solder bump integrated circuits Feb. 18, 2014
8653658 Planarized bumps for underfill control Feb. 18, 2014
8653644 Packaged semiconductor chips with array Feb. 18, 2014
8653640 Semiconductor package apparatus Feb. 18, 2014
8643181 Integrated circuit packaging system with encapsulation and method of manufacture thereof Feb. 4, 2014
8643180 Semiconductor device Feb. 4, 2014
8643179 Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package Feb. 4, 2014
8642462 Interconnection designs and materials having improved strength and fatigue life Feb. 4, 2014
8633601 Interconnect assemblies and methods of making and using same Jan. 21, 2014
8633586 Mock bump system for flip chip integrated circuits Jan. 21, 2014
8629557 Structures and methods for detecting solder wetting of pedestal sidewalls Jan. 14, 2014
8624404 Integrated circuit package having offset vias Jan. 7, 2014
8624402 Mock bump system for flip chip integrated circuits Jan. 7, 2014
8624391 Chip design with robust corner bumps Jan. 7, 2014
8624382 Packaging substrate and method of fabricating the same Jan. 7, 2014
8624359 Wafer level chip scale package and method of manufacturing the same Jan. 7, 2014
8623754 Repairing anomalous stiff pillar bumps Jan. 7, 2014
8618658 Semiconductor device and fabricating method thereof Dec. 31, 2013
8618645 Package process and package structure Dec. 31, 2013
8610270 Semiconductor device and semiconductor assembly with lead-free solder Dec. 17, 2013
8610269 Semiconductor device, method for manufacturing semiconductor device, and circuit device using semiconductor device Dec. 17, 2013
8610268 Semiconductor element, semiconductor element mounted board, and method of manufacturing semiconductor element Dec. 17, 2013
8610266 Semiconductor device for radio frequency applications and method for making the same Dec. 17, 2013
8610247 Structure and method for a transformer with magnetic features Dec. 17, 2013
8604614 Semiconductor packages having warpage compensation Dec. 10, 2013
8598691 Semiconductor devices and methods of manufacturing and packaging thereof Dec. 3, 2013
RE44608 Solder joint flip chip interconnection Nov. 26, 2013
8592976 Ball-limiting-metallurgy layers in solder ball structures Nov. 26, 2013
8592975 Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure Nov. 26, 2013
8587120 Semiconductor device and method of forming interconnect structure over seed layer on contact pad of semiconductor die without undercutting seed layer beneath interconnect structure Nov. 19, 2013
8587119 Conductive feature for semiconductor substrate and method of manufacture Nov. 19, 2013
8587108 Package for semiconductor device including guide rings and manufacturing method of the same Nov. 19, 2013
8586473 Methods for fabricating integrated circuits with ruthenium-lined copper Nov. 19, 2013
8586467 Method of mounting electronic component and mounting substrate Nov. 19, 2013
8581403 Electronic component mounting structure, electronic component mounting method, and electronic component mounting board Nov. 12, 2013











 
 
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