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Class Information
Number: 257/E23.02
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of lead-in layers inseparably applied to semiconductor body (epo) > Consisting of layered constructions comprising conductive layers and insulating layers, e.g., planar contacts (epo) > Bonding areas, e.g., pads (epo)
Description: This subclass is indented under subclass E23.019. This subclass is substantially the same in scope as ECLA classification H01L23/485A.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7626275 |
Semiconductor device |
Dec. 1, 2009 |
| 7617598 |
Method of making a thermally isolated via structure |
Nov. 17, 2009 |
| 7619305 |
Semiconductor package-on-package (POP) device avoiding crack at solder joints of micro contacts during package stacking |
Nov. 17, 2009 |
| 7615873 |
Solder flow stops for semiconductor die substrates |
Nov. 10, 2009 |
| 7601626 |
Method for manufacturing semiconductor device, and method and structure for implementing semiconductor device |
Oct. 13, 2009 |
| 7598620 |
Copper bonding compatible bond pad structure and method |
Oct. 6, 2009 |
| 7598569 |
Semiconductor device |
Oct. 6, 2009 |
| 7595560 |
Semiconductor device |
Sep. 29, 2009 |
| 7592701 |
Electrode structure, part mounting structure and liquid crystal display unit equipped with the part mounting structure |
Sep. 22, 2009 |
| 7592710 |
Bond pad structure for wire bonding |
Sep. 22, 2009 |
| 7589419 |
Side connectors for RFID chip |
Sep. 15, 2009 |
| 7586199 |
Structures, architectures, systems, methods, algorithms and software for configuring and integrated circuit for multiple packaging types |
Sep. 8, 2009 |
| 7586195 |
Semiconductor device |
Sep. 8, 2009 |
| 7585699 |
Semiconductor package board using a metal base |
Sep. 8, 2009 |
| 7585693 |
Method of forming a microelectronic package using control of die and substrate differential expansions and microelectronic package formed according to the method |
Sep. 8, 2009 |
| 7579695 |
Integration type semiconductor device and method for manufacturing the same |
Aug. 25, 2009 |
| 7576424 |
Semiconductor device |
Aug. 18, 2009 |
| 7576440 |
Semiconductor chip having bond pads and multi-chip package |
Aug. 18, 2009 |
| 7573141 |
Semiconductor package with a chip on a support plate |
Aug. 11, 2009 |
| 7560814 |
Semiconductor device that improves electrical connection reliability |
Jul. 14, 2009 |
| 7560372 |
Process for making a semiconductor device having a roughened surface |
Jul. 14, 2009 |
| 7554201 |
Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same |
Jun. 30, 2009 |
| 7547977 |
Semiconductor chip having bond pads |
Jun. 16, 2009 |
| 7544539 |
Forced heat transfer apparatus for heating stacked dice |
Jun. 9, 2009 |
| 7541682 |
Semiconductor chip having bond pads |
Jun. 2, 2009 |
| 7541275 |
Method for manufacturing an interconnect |
Jun. 2, 2009 |
| 7535112 |
Semiconductor constructions comprising multi-level patterns of radiation-imageable material |
May. 19, 2009 |
| 7528476 |
Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument |
May. 5, 2009 |
| 7528495 |
Chip structure |
May. 5, 2009 |
| 7521812 |
Method of wire bonding over active area of a semiconductor circuit |
Apr. 21, 2009 |
| 7521801 |
Semiconductor device |
Apr. 21, 2009 |
| 7521797 |
Method of manufacturing substrate joint body, substrate joint body and electrooptical device |
Apr. 21, 2009 |
| 7517785 |
Electronic interconnects and methods of making same |
Apr. 14, 2009 |
| 7518242 |
Semiconductor testing device |
Apr. 14, 2009 |
| 7514800 |
Semiconductor device and wire bonding method therefor |
Apr. 7, 2009 |
| 7514796 |
Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips |
Apr. 7, 2009 |
| 7514767 |
Fan out type wafer level package structure and method of the same |
Apr. 7, 2009 |
| 7507592 |
Bonding pad structure for a display device and fabrication method thereof |
Mar. 24, 2009 |
| 7508072 |
Semiconductor device with pad electrode for testing and manufacturing method of the same |
Mar. 24, 2009 |
| 7508082 |
Semiconductor device and method of manufacturing the same |
Mar. 24, 2009 |
| 7504728 |
Integrated circuit having bond pad with improved thermal and mechanical properties |
Mar. 17, 2009 |
| 7498249 |
Method of forming a connecting conductor and wirings of a semiconductor chip |
Mar. 3, 2009 |
| 7498251 |
Redistribution circuit structure |
Mar. 3, 2009 |
| 7498680 |
Test structure |
Mar. 3, 2009 |
| 7495335 |
Method of reducing process steps in metal line protective structure formation |
Feb. 24, 2009 |
| 7476965 |
Electronic device with integrated heat distributor |
Jan. 13, 2009 |
| 7466013 |
Semiconductor die structure featuring a triple pad organization |
Dec. 16, 2008 |
| 7462941 |
Power grid layout techniques on integrated circuits |
Dec. 9, 2008 |
| 7462887 |
Semiconductor connection component |
Dec. 9, 2008 |
| 7462935 |
Structure and method for forming a capacitively coupled chip-to-chip signaling interface |
Dec. 9, 2008 |
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