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Class Information
Number: 257/E23.02
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of lead-in layers inseparably applied to semiconductor body (epo) > Consisting of layered constructions comprising conductive layers and insulating layers, e.g., planar contacts (epo) > Bonding areas, e.g., pads (epo)
Description: This subclass is indented under subclass E23.019. This subclass is substantially the same in scope as ECLA classification H01L23/485A.

Patents under this class:

Patent Number Title Of Patent Date Issued
8710678 Device and method including a soldering process Apr. 29, 2014
8710659 Semiconductor device and method of manufacturing the same Apr. 29, 2014
8704365 Integrated circuit packaging system having a cavity Apr. 22, 2014
8704356 High temperature interconnect assemblies for high temperature electronics utilizing transition pads Apr. 22, 2014
8704238 Method and structure of monolithically integrated IC-MEMS oscillator using IC foundry-compatible processes Apr. 22, 2014
8703541 Electronic system with expansion feature Apr. 22, 2014
8686550 Method and apparatus for high pressure sensor device Apr. 1, 2014
8686451 Optical-electronic component and method for production thereof Apr. 1, 2014
8680681 Bond pad configurations for controlling semiconductor chip package interactions Mar. 25, 2014
8680676 Semiconductor package with under bump metallization routing Mar. 25, 2014
8674506 Structures and methods to reduce maximum current density in a solder ball Mar. 18, 2014
8674367 Organic light-emitting display device having protrusions and recesses formed on conductive layer in pad portion and method of manufacturing the same Mar. 18, 2014
8669555 Semiconductor device Mar. 11, 2014
8643180 Semiconductor device Feb. 4, 2014
8638000 Micromechanical method and corresponding assembly for bonding semiconductor substrates and correspondingly bonded semiconductor chip Jan. 28, 2014
8629557 Structures and methods for detecting solder wetting of pedestal sidewalls Jan. 14, 2014
8618677 Wirebonded semiconductor package Dec. 31, 2013
8618652 Forming functionalized carrier structures with coreless packages Dec. 31, 2013
8592987 Semiconductor element comprising a supporting structure and production method Nov. 26, 2013
8592968 Semiconductor device, semiconductor package, interposer, semiconductor device manufacturing method and interposer manufacturing method Nov. 26, 2013
8587135 Semiconductor device having electrode/film opening edge spacing smaller than bonding pad/electrode edge spacing Nov. 19, 2013
8587108 Package for semiconductor device including guide rings and manufacturing method of the same Nov. 19, 2013
8581407 Electronic system modules and method of fabrication Nov. 12, 2013
8581366 Method and system for forming conductive bumping with copper interconnection Nov. 12, 2013
8581250 Method and apparatus of fabricating a pad structure for a semiconductor device Nov. 12, 2013
8580655 Processing method for bump-included device wafer Nov. 12, 2013
8575754 Micro-bump structure Nov. 5, 2013
8575721 Semiconductor device Nov. 5, 2013
8575018 Semiconductor device and method of forming bump structure with multi-layer UBM around bump formation area Nov. 5, 2013
8552560 Alternate pad structures/passivation inegration schemes to reduce or eliminate IMC cracking in post wire bonded dies during Cu/Low-K BEOL processing Oct. 8, 2013
8551814 Method of fabricating a semiconductor device that limits damage to elements of the semiconductor device that are exposed during processing Oct. 8, 2013
8546947 Chip structure and process for forming the same Oct. 1, 2013
8546941 Multi-direction design for bump pad structures Oct. 1, 2013
8546253 Self-aligned polymer passivation/aluminum pad Oct. 1, 2013
8541786 Packaged semiconductor device having improved locking properties Sep. 24, 2013
8536717 Integrated circuit package and method of assembling an integrated circuit package Sep. 17, 2013
8536716 Supply voltage or ground connections for integrated circuit device Sep. 17, 2013
8525354 Bond pad structure and fabricating method thereof Sep. 3, 2013
8513778 Semiconductor device Aug. 20, 2013
8508054 Enhanced bump pitch scaling Aug. 13, 2013
8508051 Protection film having a plurality of openings above an electrode pad Aug. 13, 2013
8508037 Bumpless build-up layer and laminated core hybrid structures and methods of assembling same Aug. 13, 2013
8487438 Integrated circuit system having different-size solder bumps and different-size bonding pads Jul. 16, 2013
8482137 Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its Jul. 9, 2013
8476760 Electroplated posts with reduced topography and stress Jul. 2, 2013
8476759 Electrical connection structure Jul. 2, 2013
8461697 Semiconductor integrated circuit device Jun. 11, 2013
8461019 Method of processing device wafer Jun. 11, 2013
8456012 Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same Jun. 4, 2013
8446005 Semiconductor device having a bus configuration which reduces electromigration May. 21, 2013

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