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Class Information
Number: 257/E23.019
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of lead-in layers inseparably applied to semiconductor body (epo) > Consisting of layered constructions comprising conductive layers and insulating layers, e.g., planar contacts (epo)
Description: This subclass is indented under subclass E23.012. This subclass is substantially the same in scope as ECLA classification H01L23/485.

Sub-classes under this class:

Class Number Class Name Patents
257/E23.02 Bonding areas, e.g., pads (epo) 1,264
257/E23.021 Bump or ball contacts (epo) 2,068
257/E23.022 Overhang structure (epo) 39

Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

Patent Number Title Of Patent Date Issued
6597042 Contact with germanium layer Jul. 22, 2003
6593657 Contact integration article Jul. 15, 2003
6590295 Microelectronic device with a spacer redistribution layer via and method of making the same Jul. 8, 2003
6586345 Method of manufacturing a semiconductor device wiring layer having an oxide layer between the polysilicon and silicide layers Jul. 1, 2003
6586276 Method for fabricating a microelectronic device using wafer-level adhesion layer deposition Jul. 1, 2003
6579789 Method for fabricating metal wiring and the metal wiring Jun. 17, 2003
6579776 Method of manufacturing semiconductor device Jun. 17, 2003
6580175 Semiconductor layout structure for a conductive layer and contact hole Jun. 17, 2003
6573602 Semiconductor device with a self-aligned contact and a method of manufacturing the same Jun. 3, 2003
6566759 Self-aligned contact areas for sidewall image transfer formed conductors May. 20, 2003
6566241 Method of forming metal contact in semiconductor device May. 20, 2003
6566718 Field effect transistor with an improved gate contact and method of fabricating the same May. 20, 2003
6566197 Method for fabricating connection structure between segment transistor and memory cell region of flash memory device May. 20, 2003
6562651 Method of manufacturing a semiconductor device having contact pads May. 13, 2003
6563221 Connection structures for integrated circuits and processes for their formation May. 13, 2003
6555471 Method of making a void-free aluminum film Apr. 29, 2003
6555911 Semiconductor device and method of manufacturing interconnections thereof using copper and tungsten in predetermined ratios Apr. 29, 2003
6548386 Method for forming and patterning film Apr. 15, 2003
6544830 Method of manufacturing a semiconductor device with multiple emitter contact plugs Apr. 8, 2003
6541864 Semiconductor device with tapered contact hole and wire groove Apr. 1, 2003
6531737 Semiconductor device having an improved interlayer contact and manufacturing method thereof Mar. 11, 2003
6524953 Asymmetric, double-sided self-aligned silicide and method of forming the same Feb. 25, 2003
6521531 Method for selectively growing a conductive film to fill a contact hole Feb. 18, 2003
6518176 Method of selective formation of a barrier layer for a contact level via Feb. 11, 2003
6514671 Interconnect line formed by dual damascene using dielectric layers having dissimilar etching characteristics Feb. 4, 2003
6511910 Method for manufacturing semiconductor devices Jan. 28, 2003
6509650 Electronic device, and method of patterning a first layer Jan. 21, 2003
6503803 Method of fabricating a semiconductor integrated circuit device for connecting semiconductor region and electrical wiring metal via titanium silicide layer Jan. 7, 2003
6504217 Semiconductor device and a method of manufacturing the same Jan. 7, 2003
6503795 Method for fabricating a semiconductor device having a storage cell Jan. 7, 2003
6501141 Self-aligned contact with improved isolation and method for forming Dec. 31, 2002
6495920 Wiring for semiconductor device Dec. 17, 2002
6495408 Local interconnection process for preventing dopant cross diffusion in shared gate electrodes Dec. 17, 2002
6495461 Process for forming amorphous titanium silicon nitride on substrate Dec. 17, 2002
6486026 Method of forming DRAM circuitry Nov. 26, 2002
6486555 Semiconductor device having a contact structure using aluminum Nov. 26, 2002
6482734 Diffusion barrier layer for semiconductor device and fabrication method thereof Nov. 19, 2002
6482735 Method for improved metal fill by treatment of mobility layers Nov. 19, 2002
6483192 Semiconductor device and method of manufacturing the same Nov. 19, 2002
6479377 Method for making semiconductor devices having contact plugs and local interconnects Nov. 12, 2002
6479379 Self-aligned etch stop for polycrystalline silicon plugs on a semiconductor device Nov. 12, 2002
6476489 Apparatus and manufacturing method for semiconductor device adopting NA interlayer contact structure Nov. 5, 2002
6472261 Method of forming an integrated circuit contact structure having gate electrode protection for self-aligned contacts with zero enclosure Oct. 29, 2002
6472754 Semiconductor device with improved arrangements to avoid breakage of tungsten interconnector Oct. 29, 2002
6469389 Contact plug Oct. 22, 2002
6465893 Stacked chip assembly Oct. 15, 2002
6465294 Self-aligned process for a stacked gate RF MOSFET device Oct. 15, 2002
6461911 Semiconductor memory device and fabricating method thereof Oct. 8, 2002
6461912 Method of fabricating semiconductor storage device having a capacitor Oct. 8, 2002
6461954 Method and an apparatus for forming an under bump metallization structure Oct. 8, 2002

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

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