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Class Information
Number: 257/E23.019
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of lead-in layers inseparably applied to semiconductor body (epo) > Consisting of layered constructions comprising conductive layers and insulating layers, e.g., planar contacts (epo)
Description: This subclass is indented under subclass E23.012. This subclass is substantially the same in scope as ECLA classification H01L23/485.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.02 Bonding areas, e.g., pads (epo) 1,264
257/E23.021 Bump or ball contacts (epo) 2,068
257/E23.022 Overhang structure (epo) 39


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

Patent Number Title Of Patent Date Issued
6787449 Method for the formation of RuSixOy-containing barrier layers for high-k dielectrics Sep. 7, 2004
6784097 Method of manufacturing a semiconductor device with a self-aligned contact Aug. 31, 2004
6776622 Conductive contact structure and process for producing the same Aug. 17, 2004
6764953 Electronic device, and method of patterning a first layer Jul. 20, 2004
6764955 Semiconductor device having a contact window and fabrication method thereof Jul. 20, 2004
6750494 Semiconductor buried contact with a removable spacer Jun. 15, 2004
6746952 Diffusion barrier layer for semiconductor wafer fabrication Jun. 8, 2004
6744138 RuSixOy-containing barrier layers for high-k dielectrics Jun. 1, 2004
6740587 Semiconductor device having a metal silicide layer and method for manufacturing the same May. 25, 2004
6740584 Semiconductor device and method of fabricating the same May. 25, 2004
6737310 Self-aligned process for a stacked gate RF MOSFET device May. 18, 2004
6734564 Specially shaped contact via and integrated circuit therewith May. 11, 2004
6731007 Semiconductor integrated circuit device with vertically stacked conductor interconnections May. 4, 2004
6730975 DRAM device May. 4, 2004
6731008 Semiconductor device with conductive contact layer structure May. 4, 2004
6724085 Semiconductor device with reduced resistance plug wire for interconnection Apr. 20, 2004
6724088 Quantum conductive barrier for contact to shallow diffusion region Apr. 20, 2004
6713384 Contact integration method Mar. 30, 2004
6707117 Method of providing semiconductor interconnects using silicide exclusion Mar. 16, 2004
6700205 Semiconductor devices having contact plugs and local interconnects Mar. 2, 2004
6696368 Titanium boronitride layer for high aspect ratio semiconductor devices Feb. 24, 2004
6696761 Method to encapsulate copper plug for interconnect metallization Feb. 24, 2004
6693360 Static type semiconductor memory device Feb. 17, 2004
6693032 Method of forming a contact structure having an anchoring portion Feb. 17, 2004
6690093 Metal contact structure in semiconductor device and method for forming the same Feb. 10, 2004
6688584 Compound structure for reduced contact resistance Feb. 10, 2004
6683351 Semiconductor device having structures that can avoid deterioration caused by the manufacturing processing Jan. 27, 2004
6680538 Semiconductor device for suppressing detachment of conductive layer Jan. 20, 2004
6674171 Semiconductor device with a low resistance wiring Jan. 6, 2004
6670711 Semiconductor device including low dielectric constant insulating film formed on upper and side surfaces of the gate electrode Dec. 30, 2003
6664585 Semiconductor memory device having multilayered storage node contact plug and method for fabricating the same Dec. 16, 2003
6664159 Mixed metal nitride and boride barrier layers Dec. 16, 2003
6660456 Technique for the size reduction of vias and other images in semiconductor chips Dec. 9, 2003
6657280 Redundant interconnect high current bipolar device Dec. 2, 2003
6656833 Method of DRAM Dec. 2, 2003
6653690 Semiconductor device comprising high density integrated circuit having a large number of insulated gate field effect transistors Nov. 25, 2003
6653739 Semiconductor device Nov. 25, 2003
6653222 Plasma enhanced liner Nov. 25, 2003
6650017 Electrical wiring of semiconductor device enabling increase in electromigration (EM) lifetime Nov. 18, 2003
6645849 Method for manufacturing semiconductor device for suppressing detachment of conductive layer Nov. 11, 2003
6642620 Integrated circuits having low resistivity contacts and the formation thereof using an in situ plasma doping and clean Nov. 4, 2003
6638842 Methods of fabricating integrated circuitry Oct. 28, 2003
6639319 Conductive structure in an integrated circuit Oct. 28, 2003
6630718 Transistor gate and local interconnect Oct. 7, 2003
6627537 Bit line and manufacturing method thereof Sep. 30, 2003
6624073 Optimized TaCN thin film diffusion barrier for copper metallization Sep. 23, 2003
6617691 Semiconductor device Sep. 9, 2003
6617242 Method for fabricating interlevel contacts of aluminum/refractory metal alloys Sep. 9, 2003
6610587 Method of forming a local interconnect Aug. 26, 2003
6605532 Structure for an electrical contact to a thin film in a semiconductor structure and method for making the same Aug. 12, 2003

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