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Class Information
Number: 257/E23.019
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of lead-in layers inseparably applied to semiconductor body (epo) > Consisting of layered constructions comprising conductive layers and insulating layers, e.g., planar contacts (epo)
Description: This subclass is indented under subclass E23.012. This subclass is substantially the same in scope as ECLA classification H01L23/485.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.02 Bonding areas, e.g., pads (epo) 1,264
257/E23.021 Bump or ball contacts (epo) 2,068
257/E23.022 Overhang structure (epo) 39


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

Patent Number Title Of Patent Date Issued
8053885 Wafer level vertical diode package structure and method for making the same Nov. 8, 2011
8049340 Device for avoiding parasitic capacitance in an integrated circuit package Nov. 1, 2011
8049334 Buried silicide local interconnect with sidewall spacers and method for making the same Nov. 1, 2011
8035231 Semiconductor device and method of manufacturing the same Oct. 11, 2011
8030767 Bump structure with annular support Oct. 4, 2011
8021929 Apparatus and method configured to lower thermal stresses Sep. 20, 2011
8022497 Semiconductor device comprising insulating film Sep. 20, 2011
8022524 Semiconductor device Sep. 20, 2011
8018047 Power semiconductor module including a multilayer substrate Sep. 13, 2011
8018045 Printed circuit board Sep. 13, 2011
8013385 Semiconductor device Sep. 6, 2011
8012783 Semiconductor element and method for manufacturing same Sep. 6, 2011
7999383 High speed, high density, low power die interconnect system Aug. 16, 2011
7977763 Chip package with die and substrate Jul. 12, 2011
7973398 Embedded chip package structure with chip support protruding section Jul. 5, 2011
7969007 Semiconductor device and manufacturing method thereof Jun. 28, 2011
7969003 Bump structure having a reinforcement member Jun. 28, 2011
7952120 Semiconductor device May. 31, 2011
7952196 Affordable high performance high frequency multichip module fabrication and apparatus May. 31, 2011
7952200 Semiconductor device including a copolymer layer May. 31, 2011
7939918 Chip packages with covers May. 10, 2011
7936070 Semiconductor device and method for fabricating semiconductor device May. 3, 2011
7936071 Semiconductor device having a specified terminal layout pattern May. 3, 2011
7915079 Method of manufacturing layered chip package Mar. 29, 2011
7906840 Semiconductor integrated circuit package, printed circuit board, semiconductor apparatus, and power supply wiring structure Mar. 15, 2011
7892963 Integrated circuit packaging system and method of manufacture thereof Feb. 22, 2011
7893534 Thermally insulating bonding pad structure for solder reflow connection Feb. 22, 2011
7888798 Semiconductor devices including interlayer conductive contacts and methods of forming the same Feb. 15, 2011
7888788 Semiconductor device with reduced cross talk Feb. 15, 2011
7888782 Apparatus and method configured to lower thermal stresses Feb. 15, 2011
7884476 Semiconductor device Feb. 8, 2011
7880280 Electronic component and method for manufacturing an electronic component Feb. 1, 2011
7867888 Flip-chip package substrate and a method for fabricating the same Jan. 11, 2011
7867924 Methods of reducing impurity concentration in isolating films in semiconductor devices Jan. 11, 2011
7863750 Semiconductor device capable of suppressing warping in a wafer state and manufacturing method thereof Jan. 4, 2011
7863719 Wafer level chip scale package Jan. 4, 2011
7859122 Final via structures for bond pad-solder ball interconnections Dec. 28, 2010
7847375 Electronic device and method of manufacturing same Dec. 7, 2010
7843062 Thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperature Nov. 30, 2010
7843069 Wire bond pads Nov. 30, 2010
7808083 Semiconductor device Oct. 5, 2010
7800214 Semiconductor device Sep. 21, 2010
7795130 Active area bonding compatible high current structures Sep. 14, 2010
7791200 Approach to high temperature wafer processing Sep. 7, 2010
7791202 Semiconductor device having oxidized metal film and manufacture method of the same Sep. 7, 2010
7786579 Apparatus for crack prevention in integrated circuit packages Aug. 31, 2010
7781338 Semiconductor device manufacturing method and semiconductor device Aug. 24, 2010
7777328 Substrate and multilayer circuit board Aug. 17, 2010
7755195 Semiconductor apparatus integrating an electrical device under an electrode pad Jul. 13, 2010
7750468 Semiconductor device and method for manufacturing the same Jul. 6, 2010

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19










 
 
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