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Class Information
Number: 257/E23.019
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of lead-in layers inseparably applied to semiconductor body (epo) > Consisting of layered constructions comprising conductive layers and insulating layers, e.g., planar contacts (epo)
Description: This subclass is indented under subclass E23.012. This subclass is substantially the same in scope as ECLA classification H01L23/485.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.02 Bonding areas, e.g., pads (epo) 1,264
257/E23.021 Bump or ball contacts (epo) 2,068
257/E23.022 Overhang structure (epo) 39


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

Patent Number Title Of Patent Date Issued
8691631 Device including two mounting surfaces Apr. 8, 2014
8643184 Crosstalk polarity reversal and cancellation through substrate material tuning Feb. 4, 2014
8618669 Combination substrate Dec. 31, 2013
8598699 Semiconductor device having a ground metal layer through which at least one hole is formed, and a ground patch disposed in the at least one hole Dec. 3, 2013
8575754 Micro-bump structure Nov. 5, 2013
8552528 Diode-less array for one-time programmable memory Oct. 8, 2013
8552559 Very thick metal interconnection scheme in IC chips Oct. 8, 2013
8546195 Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor Oct. 1, 2013
8535546 Method of manufacturing multilayer wiring substrate Sep. 17, 2013
8531039 Micro pin grid array with pin motion isolation Sep. 10, 2013
8513806 Laminated high melting point soldering layer formed by TLP bonding and fabrication method for the same, and semiconductor device Aug. 20, 2013
8513778 Semiconductor device Aug. 20, 2013
8492870 Semiconductor package with interconnect layers Jul. 23, 2013
8476759 Electrical connection structure Jul. 2, 2013
8455992 Semiconductor package and method of fabricating the same Jun. 4, 2013
8450858 Method of manufacturing semiconductor device including wiring layout and semiconductor device May. 28, 2013
8445995 Semiconductor structure with conductive plug in an oxide layer May. 21, 2013
8446003 Semiconductor device including double-sided multi-electrode chip embedded in multilayer wiring substrate May. 21, 2013
8426244 High speed, high density, low power die interconnect system Apr. 23, 2013
8426968 High speed, high density, low power die interconnect system Apr. 23, 2013
8421240 Sensor device and method of manufacturing the sensor device Apr. 16, 2013
8415780 Package carrier and manufacturing method thereof Apr. 9, 2013
8394673 Semiconductor device Mar. 12, 2013
8368226 Die power structure Feb. 5, 2013
8361898 Bonding pad structure for back illuminated optoelectronic device and fabricating method thereof Jan. 29, 2013
8344477 Semiconductor chip, semiconductor wafer, method of manufacturing semiconductor chip Jan. 1, 2013
8309453 Multilevel interconnects structure with shielding function and fabricating method thereof Nov. 13, 2012
8309402 Method of fabricating oxide material layer with openings attached to device layers Nov. 13, 2012
8294276 Semiconductor device and fabricating method thereof Oct. 23, 2012
8278733 Bonding pad structure and integrated circuit chip using such bonding pad structure Oct. 2, 2012
8274160 Active area bonding compatible high current structures Sep. 25, 2012
8258056 Method and material for forming a double exposure lithography pattern Sep. 4, 2012
8237255 Multi-layer printed circuit board having built-in integrated circuit package Aug. 7, 2012
8237281 Semiconductor device Aug. 7, 2012
8203210 Semiconductor device having metal contacts formed in an interlayer dielectric film comprising four silicon-containing layers Jun. 19, 2012
8188592 Apparatus and method configured to lower thermal stresses May. 29, 2012
8183698 Bond pad support structure for semiconductor device May. 22, 2012
8169070 Semiconductor device May. 1, 2012
8169084 Bond pad structure and method for producing same May. 1, 2012
8154124 Semiconductor device having a chip-size package Apr. 10, 2012
8125052 Seal ring structure with improved cracking protection Feb. 28, 2012
8120113 Metal line in semiconductor device Feb. 21, 2012
8120188 Electronic component mounting structure and method for manufacturing the same Feb. 21, 2012
8114708 System and method for pre-patterned embedded chip build-up Feb. 14, 2012
8106501 Semiconductor die package including low stress configuration Jan. 31, 2012
8097943 Semiconductor device and method of forming wafer level ground plane and power ring Jan. 17, 2012
8089156 Electrode structure for semiconductor chip with crack suppressing dummy metal patterns Jan. 3, 2012
8084302 Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor Dec. 27, 2011
8076748 Semiconductor device Dec. 13, 2011
8058726 Semiconductor device having redistribution layer Nov. 15, 2011

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