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Class Information
Number: 257/E23.018
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of lead-in layers inseparably applied to semiconductor body (epo) > Materials (epo) > Conductive organic material or pastes, e.g., conductive adhesives, inks (epo)
Description: This subclass is indented under subclass E23.017. This subclass is substantially the same in scope as ECLA classification H01L23/482M4.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7626254 |
Semiconductor package using chip-embedded interposer substrate |
Dec. 1, 2009 |
| 7550318 |
Interconnect for improved die to substrate electrical coupling |
Jun. 23, 2009 |
| 7538419 |
Stacked-type chip package structure |
May. 26, 2009 |
| 7531385 |
Flip chip mounting method and method for connecting substrates |
May. 12, 2009 |
| 7476981 |
Electronic module with layer of adhesive and process for producing it |
Jan. 13, 2009 |
| 7456504 |
Electronic component assemblies with electrically conductive bonds |
Nov. 25, 2008 |
| 7446403 |
Carrier structure stacking system and method |
Nov. 4, 2008 |
| 7443019 |
Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same |
Oct. 28, 2008 |
| 7385282 |
Stacked-type chip package structure |
Jun. 10, 2008 |
| 7358616 |
Semiconductor stacked die/wafer configuration and packaging and method thereof |
Apr. 15, 2008 |
| 7335985 |
Method and system for electrically coupling a chip to chip package |
Feb. 26, 2008 |
| 7335988 |
Use of palladium in IC manufacturing with conductive polymer bump |
Feb. 26, 2008 |
| 7321133 |
Heteroatomic regioregular poly(3-substitutedthiophenes) as thin film conductors in diodes which are not light emitting or photovoltaic |
Jan. 22, 2008 |
| 7126228 |
Apparatus for processing semiconductor devices in a singulated form |
Oct. 24, 2006 |
| 7078823 |
Semiconductor die configured for use with interposer substrates having reinforced interconnect slots |
Jul. 18, 2006 |
| 6788552 |
Method and apparatus for reducing substrate bias voltage drop |
Sep. 7, 2004 |
| 6737108 |
Microcapsulating conductive metal particles with polymerized monomers |
May. 18, 2004 |
| 6617697 |
Assembly with connecting structure |
Sep. 9, 2003 |
| 6576998 |
Thin semiconductor package with semiconductor chip and electronic discrete device |
Jun. 10, 2003 |
| 6429382 |
Electrical mounting structure having an elution preventive film |
Aug. 6, 2002 |
| 6406746 |
Microcapsulating conductive metal particles with polymerized monomers |
Jun. 18, 2002 |
| 6138348 |
Method of forming electrically conductive polymer interconnects on electrical substrates |
Oct. 31, 2000 |
| 6113728 |
Process for connecting circuits and adhesive film used therefor |
Sep. 5, 2000 |
| 5918364 |
Method of forming electrically conductive polymer interconnects on electrical substrates |
Jul. 6, 1999 |
| 5879761 |
Method for forming electrically conductive polymer interconnects on electrical substrates |
Mar. 9, 1999 |
| 5843251 |
Process for connecting circuits and adhesive film used therefor |
Dec. 1, 1998 |
| 5814180 |
Low temperature method for mounting electrical components |
Sep. 29, 1998 |
| 5714238 |
Conductive adhesive and circuit using the same |
Feb. 3, 1998 |
| 5612403 |
Low temperature flexible die attach adhesive and articles using same |
Mar. 18, 1997 |
| 5611140 |
Method of forming electrically conductive polymer interconnects on electrical substrates |
Mar. 18, 1997 |
| 5604026 |
Electrically conductive adhesives |
Feb. 18, 1997 |
| 5600183 |
Multi-layer film adhesive for electrically isolating and grounding an integrated circuit chip to a printed circuit substrate |
Feb. 4, 1997 |
| 5510649 |
Ceramic semiconductor package having varying conductive bonds |
Apr. 23, 1996 |
| 5475048 |
Conductor-filled thermosetting resin |
Dec. 12, 1995 |
| 5457149 |
Reworkable adhesive for electronic applications |
Oct. 10, 1995 |
| 5403389 |
Resinless pseudoplastic bonding compositions |
Apr. 4, 1995 |
| 5386000 |
Low temperature flexible die attach adhesive and articles using same |
Jan. 31, 1995 |
| 5371178 |
Rapidly curing adhesive and method |
Dec. 6, 1994 |
| 5306333 |
Resinless pseudoplastic bonding compositions |
Apr. 26, 1994 |
| 5261156 |
Method of electrically connecting an integrated circuit to an electric device |
Nov. 16, 1993 |
| 5258577 |
Die mounting with uniaxial conductive adhesive |
Nov. 2, 1993 |
| 5237130 |
Flip chip technology using electrically conductive polymers and dielectrics |
Aug. 17, 1993 |
| 5204399 |
Thermoplastic film die attach adhesives |
Apr. 20, 1993 |
| 5196371 |
Flip chip bonding method using electrically conductive polymer bumps |
Mar. 23, 1993 |
| 5170930 |
Liquid metal paste for thermal and electrical connections |
Dec. 15, 1992 |
| 5164119 |
Silver-glass pastes |
Nov. 17, 1992 |
| 5158818 |
Conductive die attach tape |
Oct. 27, 1992 |
| 5155066 |
Rapid-curing adhesive formulation for semiconductor devices |
Oct. 13, 1992 |
| 5150195 |
Rapid-curing adhesive formulation for semiconductor devices |
Sep. 22, 1992 |
| 5136365 |
Anisotropic conductive adhesive and encapsulant material |
Aug. 4, 1992 |
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