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Class Information
Number: 257/E23.018
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of lead-in layers inseparably applied to semiconductor body (epo) > Materials (epo) > Conductive organic material or pastes, e.g., conductive adhesives, inks (epo)
Description: This subclass is indented under subclass E23.017. This subclass is substantially the same in scope as ECLA classification H01L23/482M4.

Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8674521 Semiconductor device package including a paste member Mar. 18, 2014
8598719 Semiconductor element mounting board Dec. 3, 2013
8525338 Chip with sintered connections to package Sep. 3, 2013
8519549 Anisotropic conductive film and display device having the same Aug. 27, 2013
8436461 Semiconductor device May. 7, 2013
8432036 Lead frames with improved adhesion to plastic encapsulant Apr. 30, 2013
8278767 Optoelectronic component Oct. 2, 2012
8247883 Printing shielded connections and circuits Aug. 21, 2012
8203218 Semiconductor device package including a paste member Jun. 19, 2012
8120189 Wiring terminal-connecting adhesive Feb. 21, 2012
8115322 Adhesive, method of connecting wiring terminals and wiring structure Feb. 14, 2012
7939917 Tape structures, and methods and apparatuses for separating a wafer using the same May. 10, 2011
7928566 Conductive bump, method for manufacturing the conductive bump, semiconductor device and method for manufacturing the semiconductor device Apr. 19, 2011
7923289 Process for fabricating a semiconductor package Apr. 12, 2011
7915082 Semiconductor device Mar. 29, 2011
7915743 Adhesive for electronic components, method for manufacturing semiconductor chip laminate, and semiconductor device Mar. 29, 2011
7898071 Apparatus and method for housing micromechanical systems Mar. 1, 2011
7868466 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument Jan. 11, 2011
7816780 Semiconductor apparatus and manufacturing method of semiconductor apparatus Oct. 19, 2010
7808113 Flip chip semiconductor device having workpiece adhesion promoter layer for improved underfill adhesion Oct. 5, 2010
7777335 Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particles Aug. 17, 2010
7737536 Capacitive techniques to reduce noise in high speed interconnections Jun. 15, 2010
7714444 Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same May. 11, 2010
7692292 Packaged electronic element and method of producing electronic element package Apr. 6, 2010
7667337 Semiconductor device with conductive die attach material Feb. 23, 2010
7638880 Chip package Dec. 29, 2009
7638883 Flip chip mounting method and bump forming method Dec. 29, 2009
7626254 Semiconductor package using chip-embedded interposer substrate Dec. 1, 2009
7550318 Interconnect for improved die to substrate electrical coupling Jun. 23, 2009
7538419 Stacked-type chip package structure May. 26, 2009
7531385 Flip chip mounting method and method for connecting substrates May. 12, 2009
7476981 Electronic module with layer of adhesive and process for producing it Jan. 13, 2009
7456504 Electronic component assemblies with electrically conductive bonds Nov. 25, 2008
7446403 Carrier structure stacking system and method Nov. 4, 2008
7443019 Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same Oct. 28, 2008
7385282 Stacked-type chip package structure Jun. 10, 2008
7358616 Semiconductor stacked die/wafer configuration and packaging and method thereof Apr. 15, 2008
7335988 Use of palladium in IC manufacturing with conductive polymer bump Feb. 26, 2008
7335985 Method and system for electrically coupling a chip to chip package Feb. 26, 2008
7321133 Heteroatomic regioregular poly(3-substitutedthiophenes) as thin film conductors in diodes which are not light emitting or photovoltaic Jan. 22, 2008
7126228 Apparatus for processing semiconductor devices in a singulated form Oct. 24, 2006
7078823 Semiconductor die configured for use with interposer substrates having reinforced interconnect slots Jul. 18, 2006
6788552 Method and apparatus for reducing substrate bias voltage drop Sep. 7, 2004
6737108 Microcapsulating conductive metal particles with polymerized monomers May. 18, 2004
6617697 Assembly with connecting structure Sep. 9, 2003
6576998 Thin semiconductor package with semiconductor chip and electronic discrete device Jun. 10, 2003
6429382 Electrical mounting structure having an elution preventive film Aug. 6, 2002
6406746 Microcapsulating conductive metal particles with polymerized monomers Jun. 18, 2002
6138348 Method of forming electrically conductive polymer interconnects on electrical substrates Oct. 31, 2000
6113728 Process for connecting circuits and adhesive film used therefor Sep. 5, 2000

1 2 3

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