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Class Information
Number: 257/E23.017
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of lead-in layers inseparably applied to semiconductor body (epo) > Materials (epo)
Description: This subclass is indented under subclass E23.012. This subclass is substantially the same in scope as ECLA classification H01L23/482M.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.018 Conductive organic material or pastes, e.g., conductive adhesives, inks (epo) 140


Patents under this class:
1 2

Patent Number Title Of Patent Date Issued
8709933 Interposer having molded low CTE dielectric Apr. 29, 2014
8692245 Crack stop structure and method for forming the same Apr. 8, 2014
8624402 Mock bump system for flip chip integrated circuits Jan. 7, 2014
8617984 Tungsten metallization: structure and fabrication of same Dec. 31, 2013
8610285 3D IC packaging structures and methods with a metal pillar Dec. 17, 2013
8575751 Conductive bump, method for producing the same, and electronic component mounted structure Nov. 5, 2013
8569889 Nano thick Pt metallization layer Oct. 29, 2013
8564132 Tungsten metallization: structure and fabrication of same Oct. 22, 2013
8456010 Semiconductor device Jun. 4, 2013
8368223 Paste for forming an interconnect and interconnect formed from the paste Feb. 5, 2013
8269348 IC die including RDL capture pads with notch having bonding connectors or its UBM pad over the notch Sep. 18, 2012
8072066 Metal interconnects for integrated circuit die comprising non-oxidizing portions extending outside seal ring Dec. 6, 2011
7999387 Semiconductor element connected to printed circuit board Aug. 16, 2011
7816155 Mounted semiconductor device and a method for making the same Oct. 19, 2010
7772040 Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby Aug. 10, 2010
7718552 Nanostructured titania May. 18, 2010
7692299 Semiconductor apparatus having improved thermal fatigue life Apr. 6, 2010
7659627 Photodiode Feb. 9, 2010
7553762 Method for forming metal silicide layer Jun. 30, 2009
7545043 Device comprising multi-layered thin film having excellent adhesive strength and method for fabricating the same Jun. 9, 2009
7462926 Leadframe comprising tin plating or an intermetallic layer formed therefrom Dec. 9, 2008
7449367 Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device Nov. 11, 2008
7045831 Semiconductor device May. 16, 2006
6969637 Electronic semiconductor device having a thermal spreader Nov. 29, 2005
6946681 Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof Sep. 20, 2005
6896976 Tin antimony solder for MOSFET with TiNiAg back metal May. 24, 2005
6870243 Thin GaAs die with copper back-metal structure Mar. 22, 2005
6797594 Semiconductor device and method of manufacturing the same Sep. 28, 2004
6788552 Method and apparatus for reducing substrate bias voltage drop Sep. 7, 2004
6784522 Electronic semiconductor device having a thermal spreader Aug. 31, 2004
6781244 Electrical die contact structure and fabrication method Aug. 24, 2004
6773956 Method for contact-connecting a semiconductor component Aug. 10, 2004
6746951 Bond pad of semiconductor device and method of fabricating the same Jun. 8, 2004
6686606 Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof Feb. 3, 2004
6664640 Semiconductor device Dec. 16, 2003
6661026 Thin film transistor substrate Dec. 9, 2003
6614641 Ceramic electronic component Sep. 2, 2003
6605842 Semiconductor device and a method of manufacturing the same Aug. 12, 2003
6582982 Composition for wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof Jun. 24, 2003
6570182 Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof May. 27, 2003
6528848 Semiconductor device and a method of manufacturing the same Mar. 4, 2003
6486494 Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof Nov. 26, 2002
6445004 Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof Sep. 3, 2002
6380098 Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof Apr. 30, 2002
6376910 Solder-on back metal for semiconductor die Apr. 23, 2002
6339230 Method for manufacturing a liquid crystal display Jan. 15, 2002
6337520 Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and manufacturing method thereof Jan. 8, 2002
6334567 Component and method for production thereof Jan. 1, 2002
6331443 Method for manufacturing a liquid crystal display Dec. 18, 2001
6309965 Method of producing a semiconductor body with metallization on the back side that includes a titanium nitride layer to reduce warping Oct. 30, 2001

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