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Class Information
Number: 257/E23.017
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of lead-in layers inseparably applied to semiconductor body (epo) > Materials (epo)
Description: This subclass is indented under subclass E23.012. This subclass is substantially the same in scope as ECLA classification H01L23/482M.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7553762 |
Method for forming metal silicide layer |
Jun. 30, 2009 |
| 7545043 |
Device comprising multi-layered thin film having excellent adhesive strength and method for fabricating the same |
Jun. 9, 2009 |
| 7462926 |
Leadframe comprising tin plating or an intermetallic layer formed therefrom |
Dec. 9, 2008 |
| 7449367 |
Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device |
Nov. 11, 2008 |
| 7045831 |
Semiconductor device |
May. 16, 2006 |
| 6969637 |
Electronic semiconductor device having a thermal spreader |
Nov. 29, 2005 |
| 6946681 |
Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof |
Sep. 20, 2005 |
| 6896976 |
Tin antimony solder for MOSFET with TiNiAg back metal |
May. 24, 2005 |
| 6870243 |
Thin GaAs die with copper back-metal structure |
Mar. 22, 2005 |
| 6797594 |
Semiconductor device and method of manufacturing the same |
Sep. 28, 2004 |
| 6788552 |
Method and apparatus for reducing substrate bias voltage drop |
Sep. 7, 2004 |
| 6784522 |
Electronic semiconductor device having a thermal spreader |
Aug. 31, 2004 |
| 6781244 |
Electrical die contact structure and fabrication method |
Aug. 24, 2004 |
| 6773956 |
Method for contact-connecting a semiconductor component |
Aug. 10, 2004 |
| 6746951 |
Bond pad of semiconductor device and method of fabricating the same |
Jun. 8, 2004 |
| 6686606 |
Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof |
Feb. 3, 2004 |
| 6664640 |
Semiconductor device |
Dec. 16, 2003 |
| 6661026 |
Thin film transistor substrate |
Dec. 9, 2003 |
| 6614641 |
Ceramic electronic component |
Sep. 2, 2003 |
| 6605842 |
Semiconductor device and a method of manufacturing the same |
Aug. 12, 2003 |
| 6582982 |
Composition for wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof |
Jun. 24, 2003 |
| 6570182 |
Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof |
May. 27, 2003 |
| 6528848 |
Semiconductor device and a method of manufacturing the same |
Mar. 4, 2003 |
| 6486494 |
Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof |
Nov. 26, 2002 |
| 6445004 |
Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof |
Sep. 3, 2002 |
| 6380098 |
Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof |
Apr. 30, 2002 |
| 6376910 |
Solder-on back metal for semiconductor die |
Apr. 23, 2002 |
| 6339230 |
Method for manufacturing a liquid crystal display |
Jan. 15, 2002 |
| 6337520 |
Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and manufacturing method thereof |
Jan. 8, 2002 |
| 6334567 |
Component and method for production thereof |
Jan. 1, 2002 |
| 6331443 |
Method for manufacturing a liquid crystal display |
Dec. 18, 2001 |
| 6309965 |
Method of producing a semiconductor body with metallization on the back side that includes a titanium nitride layer to reduce warping |
Oct. 30, 2001 |
| 6268661 |
Semiconductor device and method of its fabrication |
Jul. 31, 2001 |
| 6211550 |
Backmetal drain terminal with low stress and thermal resistance |
Apr. 3, 2001 |
| 6147403 |
Semiconductor body with metallizing on the back side |
Nov. 14, 2000 |
| 6140703 |
Semiconductor metallization structure |
Oct. 31, 2000 |
| 6140150 |
Plastic encapsulation for integrated circuits having plated copper top surface level interconnect |
Oct. 31, 2000 |
| 6104062 |
Semiconductor device having reduced effective substrate resistivity and associated methods |
Aug. 15, 2000 |
| 6081308 |
Method for manufacturing liquid crystal display |
Jun. 27, 2000 |
| 6027957 |
Controlled solder interdiffusion for high power semiconductor laser diode die bonding |
Feb. 22, 2000 |
| 5965946 |
Package having Au layer semiconductor device having Au layer |
Oct. 12, 1999 |
| 5901901 |
Semiconductor assembly with solder material layer and method for soldering the semiconductor assemly |
May. 11, 1999 |
| 5726494 |
Semiconductor device having a plated heat sink |
Mar. 10, 1998 |
| 5698897 |
Semiconductor device having a plated heat sink |
Dec. 16, 1997 |
| 5641994 |
Multilayered A1-alloy structure for metal conductors |
Jun. 24, 1997 |
| 5635764 |
Surface treated structure for solder joint |
Jun. 3, 1997 |
| 5614291 |
Semiconductor device and method of manufacturing the same |
Mar. 25, 1997 |
| 5561083 |
Method of making multilayered Al-alloy structure for metal conductors |
Oct. 1, 1996 |
| 5451544 |
Method of manufacturing a back contact for semiconductor die |
Sep. 19, 1995 |
| 5436505 |
Heat-resisting ohmic contact on semiconductor diamond layer |
Jul. 25, 1995 |
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