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Class Information
Number: 257/E23.015
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of lead-in layers inseparably applied to semiconductor body (epo) > Pads with extended contours, e.g., grid structure, branch structure, finger structure (epo)
Description: This subclass is indented under subclass E23.012. This subclass is substantially the same in scope as ECLA classification H01L23/482E.

Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8674367 Organic light-emitting display device having protrusions and recesses formed on conductive layer in pad portion and method of manufacturing the same Mar. 18, 2014
8659144 Power and ground planes in package substrate Feb. 25, 2014
8629052 Methods of forming semiconductor devices having narrow conductive line patterns Jan. 14, 2014
8629547 Semiconductor chip package Jan. 14, 2014
8610264 Compliant interconnects in wafers Dec. 17, 2013
8587134 Semiconductor packages Nov. 19, 2013
8575018 Semiconductor device and method of forming bump structure with multi-layer UBM around bump formation area Nov. 5, 2013
8571229 Semiconductor device Oct. 29, 2013
8546253 Self-aligned polymer passivation/aluminum pad Oct. 1, 2013
8546887 Semiconductor devices Oct. 1, 2013
8536716 Supply voltage or ground connections for integrated circuit device Sep. 17, 2013
8525212 Light emitting diode having electrode extensions Sep. 3, 2013
8466546 Chip-scale package Jun. 18, 2013
8461697 Semiconductor integrated circuit device Jun. 11, 2013
8450768 Semiconductor light-emitting element and process for production thereof May. 28, 2013
8399981 Ball grid array with improved single-ended and differential signal performance Mar. 19, 2013
8390031 Pad layout structure of semiconductor chip Mar. 5, 2013
8390115 Wiring board and semiconductor device using the wiring board Mar. 5, 2013
8373265 Package substrate having a through hole and method of fabricating the same Feb. 12, 2013
8368198 Stacked package of semiconductor device Feb. 5, 2013
8354297 Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die Jan. 15, 2013
8338965 Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device Dec. 25, 2012
8334201 Semiconductor device and inspection method therefor Dec. 18, 2012
8309451 Semiconductor device and method of providing common voltage bus and wire bondable redistribution Nov. 13, 2012
8304900 Integrated circuit packaging system with stacked lead and method of manufacture thereof Nov. 6, 2012
8298930 Undercut-repair of barrier layer metallurgy for solder bumps and methods thereof Oct. 30, 2012
8294276 Semiconductor device and fabricating method thereof Oct. 23, 2012
8288860 Memory device system with stacked packages Oct. 16, 2012
8278759 Structures for measuring misalignment of patterns Oct. 2, 2012
8278769 Compound semiconductor device and connectors Oct. 2, 2012
8264090 Semiconductor device including offset bonding pad and inspection method therefor Sep. 11, 2012
8258631 Pad layout structure of semiconductor chip Sep. 4, 2012
8247908 Circuit substrate and method for utilizing packaging of the circuit substrate Aug. 21, 2012
8241950 System and method to manufacture an implantable electrode Aug. 14, 2012
8217415 Electronic device contact structures Jul. 10, 2012
8169084 Bond pad structure and method for producing same May. 1, 2012
8148256 Copper bonding method Apr. 3, 2012
8148810 Semiconductor device, and inspection method thereof Apr. 3, 2012
8143713 Chip-on-board package Mar. 27, 2012
8129834 Integral metal structure with conductive post portions Mar. 6, 2012
8124519 Apparatus and method for bonding silicon wafer to conductive substrate Feb. 28, 2012
8097962 Semiconductor device Jan. 17, 2012
8076785 Semiconductor device Dec. 13, 2011
8072084 Integrated circuit, circuit system, and method of manufacturing Dec. 6, 2011
8044523 Semiconductor device Oct. 25, 2011
8035228 High-density 3-dimensional resistors Oct. 11, 2011
8026603 Interconnect structure of an integrated circuit and manufacturing method thereof Sep. 27, 2011
8013455 Semiconductor device having pads Sep. 6, 2011
7994627 Pad redistribution chip for compactness, method of manufacturing the same, and stacked package using the same Aug. 9, 2011
7964888 Semiconductor light emitting device packages and methods Jun. 21, 2011

1 2 3 4 5 6 7

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