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Class Information
Number: 257/E23.015
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of lead-in layers inseparably applied to semiconductor body (epo) > Pads with extended contours, e.g., grid structure, branch structure, finger structure (epo)
Description: This subclass is indented under subclass E23.012. This subclass is substantially the same in scope as ECLA classification H01L23/482E.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7605481 |
Nickel alloy sputtering target and nickel alloy thin film |
Oct. 20, 2009 |
| 7592710 |
Bond pad structure for wire bonding |
Sep. 22, 2009 |
| 7585699 |
Semiconductor package board using a metal base |
Sep. 8, 2009 |
| 7563649 |
Chip packaging with metal frame pin grid array |
Jul. 21, 2009 |
| 7554133 |
Pad current splitting |
Jun. 30, 2009 |
| 7476965 |
Electronic device with integrated heat distributor |
Jan. 13, 2009 |
| 7449787 |
Liquid crystal display |
Nov. 11, 2008 |
| 7429797 |
Electronic device and carrier substrate |
Sep. 30, 2008 |
| 7405479 |
Wired circuit board |
Jul. 29, 2008 |
| 7378721 |
Chip on lead frame for small package speed sensor |
May. 27, 2008 |
| 7372169 |
Arrangement of conductive pads on grid array package and on circuit board |
May. 13, 2008 |
| 7327030 |
Apparatus and method incorporating discrete passive components in an electronic package |
Feb. 5, 2008 |
| 7327039 |
Nanoparticle filled underfill |
Feb. 5, 2008 |
| 7323774 |
Integrated circuit package system with pedestal structure |
Jan. 29, 2008 |
| 7315072 |
Semiconductor device capable of suppressing current concentration in pad and its manufacture method |
Jan. 1, 2008 |
| 7307354 |
Integrated circuit (IC) carrier assembly incorporating an integrated circuit (IC) retainer |
Dec. 11, 2007 |
| 7282795 |
Modifying a semiconductor device to provide electrical parameter monitoring |
Oct. 16, 2007 |
| 7268433 |
Semiconductor device |
Sep. 11, 2007 |
| 7253516 |
Electronic device and carrier substrate for same |
Aug. 7, 2007 |
| 7224066 |
Bonding material and circuit device using the same |
May. 29, 2007 |
| 7211904 |
Pad structure for bonding pad and probe pad and manufacturing method thereof |
May. 1, 2007 |
| 7205658 |
Singulation method used in leadless packaging process |
Apr. 17, 2007 |
| 7202541 |
Apparatus and method for transverse characterization of materials |
Apr. 10, 2007 |
| 7186592 |
High performance, integrated, MOS-type semiconductor device and related manufacturing process |
Mar. 6, 2007 |
| 7173336 |
Hybrid integrated circuit device |
Feb. 6, 2007 |
| 7166898 |
Flip chip FET device |
Jan. 23, 2007 |
| 7164208 |
Semiconductor device and method for manufacturing the same |
Jan. 16, 2007 |
| 7161250 |
Projected contact structures for engaging bumped semiconductor devices and methods of making the same |
Jan. 9, 2007 |
| 7161251 |
Partially populated ball grid design to accommodate landing pads close to the die |
Jan. 9, 2007 |
| 7151050 |
Method for fabricating electrical connection structure of circuit board |
Dec. 19, 2006 |
| 7042053 |
Semiconductor device with polymer insulation of some electrodes |
May. 9, 2006 |
| 7034344 |
Integrated semiconductor power device for multiple battery systems |
Apr. 25, 2006 |
| 7019337 |
Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switchin |
Mar. 28, 2006 |
| 7009292 |
Package type semiconductor device |
Mar. 7, 2006 |
| 6992340 |
Semiconductor device |
Jan. 31, 2006 |
| 6992528 |
Semiconductor device |
Jan. 31, 2006 |
| 6992532 |
IGFET and tuning circuit |
Jan. 31, 2006 |
| 6969909 |
Flip chip FET device |
Nov. 29, 2005 |
| 6939758 |
Gate length control for semiconductor chip design |
Sep. 6, 2005 |
| 6930354 |
Semiconductor device |
Aug. 16, 2005 |
| 6930355 |
Silicided trench gate power mosfets ultrasonically bonded to a surface source electrode |
Aug. 16, 2005 |
| 6917091 |
High power semiconductor device having source electrodes connected by air bridges and having opposite current path directions |
Jul. 12, 2005 |
| 6903460 |
Semiconductor equipment |
Jun. 7, 2005 |
| 6897547 |
Semiconductor device including bipolar junction transistor, and production method therefor |
May. 24, 2005 |
| 6897561 |
Semiconductor power device having a diamond shaped metal interconnect scheme |
May. 24, 2005 |
| 6891267 |
Semiconductor switching circuit device |
May. 10, 2005 |
| 6878999 |
Transistor with improved safe operating area |
Apr. 12, 2005 |
| 6856004 |
Compact layout for a semiconductor device |
Feb. 15, 2005 |
| 6853072 |
Semiconductor switching circuit device and manufacturing method thereof |
Feb. 8, 2005 |
| 6815776 |
Multi-finger type electrostatic discharge protection circuit |
Nov. 9, 2004 |
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