| |
 |
|
Class Information
Number: 257/E23.014
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of lead-in layers inseparably applied to semiconductor body (epo) > Beam leads (epo)
Description: This subclass is indented under subclass E23.012. This subclass is substantially the same in scope as ECLA classification H01L23/482B.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7550855 |
Vertically spaced plural microsprings |
Jun. 23, 2009 |
| 7528485 |
Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device |
May. 5, 2009 |
| 7476966 |
Semiconductor module |
Jan. 13, 2009 |
| 7466013 |
Semiconductor die structure featuring a triple pad organization |
Dec. 16, 2008 |
| 7462932 |
Manufacture of mountable capped chips |
Dec. 9, 2008 |
| 7459795 |
Method to build a wirebond probe card in a many at a time fashion |
Dec. 2, 2008 |
| 7432594 |
Semiconductor chip, electrically connections therefor |
Oct. 7, 2008 |
| 7405486 |
Circuit device |
Jul. 29, 2008 |
| 7227198 |
Half-bridge package |
Jun. 5, 2007 |
| 7224049 |
Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same |
May. 29, 2007 |
| 7161234 |
Semiconductor component and production method suitable therefor |
Jan. 9, 2007 |
| 7075173 |
Interposer including adhesive tape |
Jul. 11, 2006 |
| 6972243 |
Fabrication of semiconductor dies with micro-pins and structures produced therewith |
Dec. 6, 2005 |
| 6943056 |
Semiconductor device manufacturing method and electronic equipment using same |
Sep. 13, 2005 |
| 6939474 |
Method for forming microelectronic spring structures on a substrate |
Sep. 6, 2005 |
| 6870184 |
Mechanically-stable BJT with reduced base-collector capacitance |
Mar. 22, 2005 |
| 6790702 |
Three-dimensional multichip module |
Sep. 14, 2004 |
| 6780001 |
Forming tool for forming a contoured microelectronic spring mold |
Aug. 24, 2004 |
| 6759311 |
Fan out of interconnect elements attached to semiconductor wafer |
Jul. 6, 2004 |
| 6756244 |
Interconnect structure |
Jun. 29, 2004 |
| 6713374 |
Interconnect assemblies and methods |
Mar. 30, 2004 |
| 6433413 |
Three-dimensional multichip module |
Aug. 13, 2002 |
| 6107179 |
Integrated flexible interconnection |
Aug. 22, 2000 |
| 5891354 |
Methods of etching through wafers and substrates with a composite etch stop layer |
Apr. 6, 1999 |
| 5455187 |
Method of making a semiconductor device with a metallic layer coupled to a lower region of a substrate and metallic layer coupled to a lower region of a semiconductor device |
Oct. 3, 1995 |
| 5444009 |
Fabricating a semiconductor with an insulative coating |
Aug. 22, 1995 |
| 5441898 |
Fabricating a semiconductor with an insulative coating |
Aug. 15, 1995 |
| 5403729 |
Fabricating a semiconductor with an insulative coating |
Apr. 4, 1995 |
| 5280194 |
Electrical apparatus with a metallic layer coupled to a lower region of a substrate and metallic layer coupled to a lower region of a semiconductor device |
Jan. 18, 1994 |
| 5102822 |
Planar-type microwave integrated circuit with at least one mesa component, method of fabrication thereof |
Apr. 7, 1992 |
| 5047834 |
High strength low stress encapsulation of interconnected semiconductor devices |
Sep. 10, 1991 |
| 4982269 |
Blanar-type microwave integrated circuit with at least one mesa component, method of fabrication thereof |
Jan. 1, 1991 |
| 4859629 |
Method of fabricating a semiconductor beam lead device |
Aug. 22, 1989 |
| 4855796 |
Beam lead mixer diode |
Aug. 8, 1989 |
| 4812895 |
Hyperfrequency semiconductor device having external connections established by beam-leads |
Mar. 14, 1989 |
| 4784972 |
Method of joining beam leads with projections to device electrodes |
Nov. 15, 1988 |
| 4736235 |
Ultra-high frequency diode structure whose external connections are provided by two metal beam leads |
Apr. 5, 1988 |
| 4733290 |
Semiconductor device and method of fabrication |
Mar. 22, 1988 |
| 4577213 |
Internally matched Schottky barrier beam lead diode |
Mar. 18, 1986 |
| 4356374 |
Electronics circuit device and method of making the same |
Oct. 26, 1982 |
| 4346291 |
Thermally isolated monolithic semiconductor die |
Aug. 24, 1982 |
| 4301233 |
Beam lead Schottky barrier diode for operation at millimeter and submillimeter wave frequencies |
Nov. 17, 1981 |
| 4257061 |
Thermally isolated monolithic semiconductor die |
Mar. 17, 1981 |
| 4246595 |
Electronics circuit device and method of making the same |
Jan. 20, 1981 |
| 4189342 |
Semiconductor device comprising projecting contact layers |
Feb. 19, 1980 |
| 4143383 |
Controllable impedance attenuator having all connection contacts on one side |
Mar. 6, 1979 |
| 4112196 |
Beam lead arrangement for microelectronic devices |
Sep. 5, 1978 |
| 4110598 |
Thermal printhead assembly |
Aug. 29, 1978 |
| 4099200 |
Package for semiconductor beam lead devices |
Jul. 4, 1978 |
| 4097890 |
Low parasitic capacitance and resistance beamlead semiconductor component and method of manufacture |
Jun. 27, 1978 |
|
|
|
