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Class Information
Number: 257/E23.014
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of lead-in layers inseparably applied to semiconductor body (epo) > Beam leads (epo)
Description: This subclass is indented under subclass E23.012. This subclass is substantially the same in scope as ECLA classification H01L23/482B.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8686574 Semiconductor device Apr. 1, 2014
8648450 Semiconductor device including leadframe with a combination of leads and lands Feb. 11, 2014
8642465 Method for manufacturing and making planar contact with an electronic apparatus, and correspondingly manufactured apparatus Feb. 4, 2014
8633507 LED with versatile mounting ways Jan. 21, 2014
8618644 Electronic device and manufacturing thereof Dec. 31, 2013
8571229 Semiconductor device Oct. 29, 2013
8476763 Semiconductor device conductive pattern structures including dummy conductive patterns Jul. 2, 2013
8384230 Semiconductor device Feb. 26, 2013
8299620 Semiconductor device with welded leads and method of manufacturing the same Oct. 30, 2012
8253225 Device including semiconductor chip and leads coupled to the semiconductor chip and manufacturing thereof Aug. 28, 2012
8207608 Interconnections for fine pitch semiconductor devices and manufacturing method thereof Jun. 26, 2012
8178978 Support mounted electrically interconnected die assembly May. 15, 2012
8125046 Micro-electromechanical system devices Feb. 28, 2012
8093694 Method of manufacturing non-leaded integrated circuit package system having etched differential height lead structures Jan. 10, 2012
8072066 Metal interconnects for integrated circuit die comprising non-oxidizing portions extending outside seal ring Dec. 6, 2011
8049325 Integrated circuit devices having printed circuit boards therein with staggered bond fingers that support improved electrical isolation Nov. 1, 2011
8039363 Small chips with fan-out leads Oct. 18, 2011
7863737 Integrated circuit package system with wire bond pattern Jan. 4, 2011
7838395 Semiconductor wafer level interconnect package utilizing conductive ring and pad for separate voltage supplies and method of making the same Nov. 23, 2010
7821115 Tape carrier package including a heat dissipation element Oct. 26, 2010
7821128 Power semiconductor device having lines within a housing Oct. 26, 2010
7812432 Chip package with a dam structure on a die pad Oct. 12, 2010
7772045 Wire bond method for angularly disposed conductive pads and a device made from the method Aug. 10, 2010
7755193 Non-rectilinear routing in rectilinear mesh of a metallization layer of an integrated circuit Jul. 13, 2010
7741198 Method for fabricating a probing pad of an integrated circuit chip Jun. 22, 2010
7550855 Vertically spaced plural microsprings Jun. 23, 2009
7528485 Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device May. 5, 2009
7476966 Semiconductor module Jan. 13, 2009
7466013 Semiconductor die structure featuring a triple pad organization Dec. 16, 2008
7462932 Manufacture of mountable capped chips Dec. 9, 2008
7459795 Method to build a wirebond probe card in a many at a time fashion Dec. 2, 2008
7432594 Semiconductor chip, electrically connections therefor Oct. 7, 2008
7405486 Circuit device Jul. 29, 2008
7227198 Half-bridge package Jun. 5, 2007
7224049 Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same May. 29, 2007
7161234 Semiconductor component and production method suitable therefor Jan. 9, 2007
7075173 Interposer including adhesive tape Jul. 11, 2006
6972243 Fabrication of semiconductor dies with micro-pins and structures produced therewith Dec. 6, 2005
6943056 Semiconductor device manufacturing method and electronic equipment using same Sep. 13, 2005
6939474 Method for forming microelectronic spring structures on a substrate Sep. 6, 2005
6870184 Mechanically-stable BJT with reduced base-collector capacitance Mar. 22, 2005
6790702 Three-dimensional multichip module Sep. 14, 2004
6780001 Forming tool for forming a contoured microelectronic spring mold Aug. 24, 2004
6759311 Fan out of interconnect elements attached to semiconductor wafer Jul. 6, 2004
6756244 Interconnect structure Jun. 29, 2004
6713374 Interconnect assemblies and methods Mar. 30, 2004
6433413 Three-dimensional multichip module Aug. 13, 2002
6107179 Integrated flexible interconnection Aug. 22, 2000
5891354 Methods of etching through wafers and substrates with a composite etch stop layer Apr. 6, 1999
5455187 Method of making a semiconductor device with a metallic layer coupled to a lower region of a substrate and metallic layer coupled to a lower region of a semiconductor device Oct. 3, 1995

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