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Class Information
Number: 257/E23.013
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of lead-in layers inseparably applied to semiconductor body (epo) > Bridge structure with air gap (epo)
Description: This subclass is indented under subclass E23.012. This subclass is substantially the same in scope as ECLA classification H01L23/482A.

Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8659115 Airgap-containing interconnect structure with improved patternable low-K material and method of fabricating Feb. 25, 2014
8642465 Method for manufacturing and making planar contact with an electronic apparatus, and correspondingly manufactured apparatus Feb. 4, 2014
8643009 Transistor, semiconductor device including the transistor, and manufacturing method of the transistor and the semiconductor device Feb. 4, 2014
RE44699 Semiconductor integrated circuit having pads layout for increasing signal integrity and reducing chip size Jan. 14, 2014
8618670 Corrosion control of stacked integrated circuits Dec. 31, 2013
8482096 Semiconductor photodetector and manufacturing method therefor Jul. 9, 2013
8482072 Semiconductor die with integrated electro-static discharge device Jul. 9, 2013
8476118 Semiconductor device and fabrication mehtod of the semiconductor device Jul. 2, 2013
8466545 Stackable semiconductor package Jun. 18, 2013
8436448 Through-silicon via with air gap May. 7, 2013
8426931 Semiconductor device and method of fabricating the semiconductor device Apr. 23, 2013
8399349 Materials and methods of forming controlled void Mar. 19, 2013
8372729 Integrated circuit devices with ESD protection in scribe line, and methods for fabricating same Feb. 12, 2013
8362578 Triple-axis MEMS accelerometer Jan. 29, 2013
8324711 Precision high-frequency capacitor formed on semiconductor substrate Dec. 4, 2012
8310061 Stacked die parallel plate capacitor Nov. 13, 2012
8278657 Transistor, semiconductor device including the transistor, and manufacturing method of the transistor and the semiconductor device Oct. 2, 2012
8274143 Semiconductor device, method of forming the same, and electronic device Sep. 25, 2012
8269326 Semiconductor device assemblies Sep. 18, 2012
8269351 Multi-chip stack package structure Sep. 18, 2012
8269352 Multi-chip stack package structure Sep. 18, 2012
8263438 Method for connecting a die assembly to a substrate in an integrated circuit Sep. 11, 2012
8232618 Semiconductor structure having a contact-level air gap within the interlayer dielectrics above a semiconductor device and a method of forming the semiconductor structure using a self-assembly Jul. 31, 2012
8178878 Mother thin film transistor array substrate and thin film transistor array substrate fabricated therefrom May. 15, 2012
8148235 Methods of manufacturing semiconductor devices Apr. 3, 2012
8129824 Shielding for a semiconductor package Mar. 6, 2012
8124449 Device including a semiconductor chip and metal foils Feb. 28, 2012
8125046 Micro-electromechanical system devices Feb. 28, 2012
8120162 Package with improved connection of a decoupling capacitor Feb. 21, 2012
8097934 Delamination resistant device package having low moisture sensitivity Jan. 17, 2012
8093700 Packaging millimeter wave modules Jan. 10, 2012
8013364 Semiconductor devices and structures thereof Sep. 6, 2011
8013441 Power semiconductor device in lead frame employing connecting element with conductive film Sep. 6, 2011
8004063 Precision high-frequency capacitor formed on semiconductor substrate Aug. 23, 2011
7999367 Stacked memory device Aug. 16, 2011
7947566 Method and apparatus for making coplanar isolated regions of different semiconductor materials on a substrate May. 24, 2011
7902648 Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methods Mar. 8, 2011
7884469 Semiconductor package having a bridged plate interconnection Feb. 8, 2011
7875911 Semiconductor device and oscillator Jan. 25, 2011
7863103 Thermally improved semiconductor QFN/SON package Jan. 4, 2011
7859121 Wiring board and method of manufacturing the same, and electronic component device using the wiring board and method of manufacturing the same Dec. 28, 2010
7855444 Mountable integrated circuit package system with substrate Dec. 21, 2010
7834439 Semiconductor module and method of manufacturing the same Nov. 16, 2010
7829997 Interconnect for chip level power distribution Nov. 9, 2010
7811924 Air gap formation and integration using a patterning cap Oct. 12, 2010
7808093 Stacked semiconductor device Oct. 5, 2010
7786591 Die down ball grid array package Aug. 31, 2010
7768043 Semiconductor device having high frequency components and manufacturing method thereof Aug. 3, 2010
7737502 Raised STI process for multiple gate ox and sidewall protection on strained Si/SGOI sructure with elevated source/drain Jun. 15, 2010
7732322 Dielectric material with reduced dielectric constant and methods of manufacturing the same Jun. 8, 2010

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