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Class Information
Number: 257/E23.013
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of lead-in layers inseparably applied to semiconductor body (epo) > Bridge structure with air gap (epo)
Description: This subclass is indented under subclass E23.012. This subclass is substantially the same in scope as ECLA classification H01L23/482A.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615480 |
Methods of post-contact back end of the line through-hole via integration |
Nov. 10, 2009 |
| 7608909 |
Suspended transmission line structures in back end of line processing |
Oct. 27, 2009 |
| 7585744 |
Method of forming a seal for a semiconductor device |
Sep. 8, 2009 |
| 7576414 |
Electrostatic discharge (ESD) protection structure |
Aug. 18, 2009 |
| 7573081 |
Method to fabricate horizontal air columns underneath metal inductor |
Aug. 11, 2009 |
| 7569906 |
Method for fabricating condenser microphone and condenser microphone |
Aug. 4, 2009 |
| 7554166 |
Airdome enclosure for components |
Jun. 30, 2009 |
| 7541682 |
Semiconductor chip having bond pads |
Jun. 2, 2009 |
| 7528038 |
Non-volatile two-transistor semiconductor memory cell and method for producing the same |
May. 5, 2009 |
| 7468538 |
Strained silicon on a SiGe on SOI substrate |
Dec. 23, 2008 |
| 7462932 |
Manufacture of mountable capped chips |
Dec. 9, 2008 |
| 7443019 |
Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same |
Oct. 28, 2008 |
| 7385281 |
Semiconductor integrated circuit device |
Jun. 10, 2008 |
| 7375421 |
High density multilayer circuit module |
May. 20, 2008 |
| 7358179 |
Method of manufacturing semiconductor device including air space formed around gate electrode |
Apr. 15, 2008 |
| 7335931 |
Monolithic microwave integrated circuit compatible FET structure |
Feb. 26, 2008 |
| 7335965 |
Packaging of electronic chips with air-bridge structures |
Feb. 26, 2008 |
| 7319274 |
Methods for selective integration of airgaps and devices made by such methods |
Jan. 15, 2008 |
| 7297593 |
Method of manufacturing a floating gate of a flash memory device |
Nov. 20, 2007 |
| 7288835 |
Integrated circuit package-in-package system |
Oct. 30, 2007 |
| 7282794 |
Multiple die stack apparatus employing t-shaped interposer elements |
Oct. 16, 2007 |
| 7230315 |
Integrated chemical microreactor with large area channels and manufacturing process thereof |
Jun. 12, 2007 |
| 7170183 |
Wafer level stacked package |
Jan. 30, 2007 |
| 7148578 |
Semiconductor multi-chip package |
Dec. 12, 2006 |
| 7112866 |
Method to form a cross network of air gaps within IMD layer |
Sep. 26, 2006 |
| 7084479 |
Line level air gaps |
Aug. 1, 2006 |
| 7071514 |
Electrostatic discharge protection device |
Jul. 4, 2006 |
| 7061094 |
Multilayer printed circuit board including first and second signal traces and a first ground trace |
Jun. 13, 2006 |
| 7056822 |
Method of fabricating an interconnect structure employing air gaps between metal lines and between metal layers |
Jun. 6, 2006 |
| 7005248 |
Method of forming cavity between multilayered wirings |
Feb. 28, 2006 |
| 6917091 |
High power semiconductor device having source electrodes connected by air bridges and having opposite current path directions |
Jul. 12, 2005 |
| 6870184 |
Mechanically-stable BJT with reduced base-collector capacitance |
Mar. 22, 2005 |
| 6806181 |
Method of fabricating an air bridge |
Oct. 19, 2004 |
| 6798064 |
Electronic component and method of manufacture |
Sep. 28, 2004 |
| 6724067 |
Low stress thermal and electrical interconnects for heterojunction bipolar transistors |
Apr. 20, 2004 |
| 6624519 |
Aluminum based alloy bridge structure and method of forming same |
Sep. 23, 2003 |
| 6600179 |
Power amplifier with base and collector straps |
Jul. 29, 2003 |
| 6504190 |
FET whose source electrode overhangs gate electrode and its manufacture method |
Jan. 7, 2003 |
| 6472719 |
Method of manufacturing air gap in multilevel interconnection |
Oct. 29, 2002 |
| 6469886 |
Monolithic integrated capacitor |
Oct. 22, 2002 |
| 6469330 |
Process for manufacturing integrated devices comprising microstructures and associated suspended electrical interconnections |
Oct. 22, 2002 |
| 6395608 |
Heterojunction bipolar transistor and its fabrication method |
May. 28, 2002 |
| 6355551 |
Integrated circuit having a void between adjacent conductive lines |
Mar. 12, 2002 |
| 6329231 |
Distributed constant circuit with active element |
Dec. 11, 2001 |
| 6306754 |
Method for forming wiring with extremely low parasitic capacitance |
Oct. 23, 2001 |
| 6268262 |
Method for forming air bridges |
Jul. 31, 2001 |
| 6255712 |
Semi-sacrificial diamond for air dielectric formation |
Jul. 3, 2001 |
| 6245658 |
Method of forming low dielectric semiconductor device with rigid, metal silicide lined interconnection system |
Jun. 12, 2001 |
| 6246118 |
Low dielectric semiconductor device with rigid, conductively lined interconnection system |
Jun. 12, 2001 |
| 6211561 |
Interconnect structure and method employing air gaps between metal lines and between metal layers |
Apr. 3, 2001 |
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