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Class Information
Number: 257/E23.012
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of lead-in layers inseparably applied to semiconductor body (epo)
Description: This subclass is indented under subclass E23.01. This subclass is substantially the same in scope as ECLA classification H01L23/482.

Sub-classes under this class:

Class Number Class Name Patents
257/E23.014 Beam leads (epo) 81
257/E23.013 Bridge structure with air gap (epo) 149
257/E23.019 Consisting of layered constructions comprising conductive layers and insulating layers, e.g., planar contacts (epo) 939
257/E23.016 For devices consisting of semiconductor layers on insulating or semi-insulating substrates, e.g., silicon on sapphire devices, i.e., sos (epo) 89
257/E23.017 Materials (epo) 97
257/E23.015 Pads with extended contours, e.g., grid structure, branch structure, finger structure (epo) 329

Patents under this class:
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Patent Number Title Of Patent Date Issued
8709933 Interposer having molded low CTE dielectric Apr. 29, 2014
8686562 Refractory metal nitride capped electrical contact and method for frabricating same Apr. 1, 2014
8669652 Lead component and method for manufacturing the same, and semiconductor package Mar. 11, 2014
8604601 Semiconductor device having wiring layers with power-supply plane and ground plane Dec. 10, 2013
8571229 Semiconductor device Oct. 29, 2013
8552560 Alternate pad structures/passivation inegration schemes to reduce or eliminate IMC cracking in post wire bonded dies during Cu/Low-K BEOL processing Oct. 8, 2013
8546947 Chip structure and process for forming the same Oct. 1, 2013
8487322 Luminous body with LED dies and production thereof Jul. 16, 2013
8476094 Method for making light emitting diode Jul. 2, 2013
8471271 Light emitting diode package and method of manufacturing the same Jun. 25, 2013
8440485 Method for making light emitting diode May. 14, 2013
8441128 Semiconductor arrangement May. 14, 2013
8390117 Semiconductor device and method of manufacturing the same Mar. 5, 2013
8378500 Stacked semiconductor device including a serial path Feb. 19, 2013
8294276 Semiconductor device and fabricating method thereof Oct. 23, 2012
8288860 Memory device system with stacked packages Oct. 16, 2012
8227909 Semiconductor package and method of manufacturing the same Jul. 24, 2012
8124449 Device including a semiconductor chip and metal foils Feb. 28, 2012
8115214 Light emitting diode package and method of manufacturing the same Feb. 14, 2012
8097943 Semiconductor device and method of forming wafer level ground plane and power ring Jan. 17, 2012
8076764 Stacked type semiconductor memory device and chip selection circuit Dec. 13, 2011
8058726 Semiconductor device having redistribution layer Nov. 15, 2011
8039303 Method of forming stress relief layer between die and interconnect structure Oct. 18, 2011
8013441 Power semiconductor device in lead frame employing connecting element with conductive film Sep. 6, 2011
8008776 Chip structure and process for forming the same Aug. 30, 2011
7999367 Stacked memory device Aug. 16, 2011
7989952 Semiconductor device Aug. 2, 2011
7977799 Planar packageless semiconductor structure with via and coplanar contacts Jul. 12, 2011
7969000 Semiconductor device Jun. 28, 2011
7956452 Flip chip packages Jun. 7, 2011
7944026 Semiconductor device May. 17, 2011
7939948 Interconnect structures with bond-pads and methods of forming bump sites on bond-pads May. 10, 2011
7936053 Integrated circuit package system with lead structures including a dummy tie bar May. 3, 2011
7932603 Chip structure and process for forming the same Apr. 26, 2011
7919875 Semiconductor device with recess portion over pad electrode Apr. 5, 2011
7915734 Chip structure and process for forming the same Mar. 29, 2011
7906374 COF packaging structure, method of manufacturing the COF packaging structure, and method for assembling a driver IC and the COF packaging structure thereof Mar. 15, 2011
7906841 Wafer level incapsulation chip and encapsulation chip manufacturing method Mar. 15, 2011
7902662 Power core devices and methods of making thereof Mar. 8, 2011
7851916 Strain silicon wafer with a crystal orientation (100) in flip chip BGA package Dec. 14, 2010
7838395 Semiconductor wafer level interconnect package utilizing conductive ring and pad for separate voltage supplies and method of making the same Nov. 23, 2010
7816776 Stacked semiconductor device and method of forming serial path thereof Oct. 19, 2010
7795731 Semiconductor devices including a topmost metal layer with at least one opening and their methods of fabrication Sep. 14, 2010
7718523 Solder attach film and method of forming solder ball using the same May. 18, 2010
7709946 Micro universal serial bus (USB) memory package May. 4, 2010
7709947 Semiconductor device having semiconductor element with back electrode on insulating substrate May. 4, 2010
7709963 Audio power amplifier package May. 4, 2010
7675158 Semiconductor integrated circuit including a power supply, and semiconductor system including a semiconductor integrated circuit Mar. 9, 2010
7666747 Process of manufacturing semiconductor device Feb. 23, 2010
7642551 Wafer-level package having test terminal Jan. 5, 2010

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