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Class Information
Number: 257/E23.012
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of lead-in layers inseparably applied to semiconductor body (epo)
Description: This subclass is indented under subclass E23.01. This subclass is substantially the same in scope as ECLA classification H01L23/482.
Sub-classes under this class:
| Class Number |
Class Name |
Patents |
| 257/E23.014 |
Beam leads (epo) |
56 |
| 257/E23.013 |
Bridge structure with air gap (epo) |
94 |
| 257/E23.019 |
Consisting of layered constructions comprising conductive layers and insulating layers, e.g., planar contacts (epo) |
816 |
| 257/E23.016 |
For devices consisting of semiconductor layers on insulating or semi-insulating substrates, e.g., silicon on sapphire devices, i.e., sos (epo) |
71 |
| 257/E23.017 |
Materials (epo) |
79 |
| 257/E23.015 |
Pads with extended contours, e.g., grid structure, branch structure, finger structure (epo) |
233 |
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619309 |
Integrated connection arrangements |
Nov. 17, 2009 |
| 7569917 |
Semiconductor device |
Aug. 4, 2009 |
| 7531457 |
Method of fabricating suspended structure |
May. 12, 2009 |
| 7391107 |
Signal routing on redistribution layer |
Jun. 24, 2008 |
| 7262440 |
Light emitting diode package and fabrication method thereof |
Aug. 28, 2007 |
| 7247951 |
Chip carrier with oxidation protection layer |
Jul. 24, 2007 |
| 7220657 |
Semiconductor wafer and semiconductor device provided with columnar electrodes and methods of producing the wafer and device |
May. 22, 2007 |
| 7112523 |
Bumping process |
Sep. 26, 2006 |
| 6954001 |
Semiconductor device including a diffusion layer |
Oct. 11, 2005 |
| 6882030 |
Integrated circuit structures with a conductor formed in a through hole in a semiconductor substrate and protruding from a surface of the substrate |
Apr. 19, 2005 |
| 6861705 |
Driver circuits and methods for manufacturing driver circuits |
Mar. 1, 2005 |
| 6784557 |
Semiconductor device including a diffusion layer formed between electrode portions |
Aug. 31, 2004 |
| 6781244 |
Electrical die contact structure and fabrication method |
Aug. 24, 2004 |
| 6768189 |
High power chip scale package |
Jul. 27, 2004 |
| 6767762 |
Lightweight semiconductor device and method for its manufacture |
Jul. 27, 2004 |
| 6740582 |
Integrated circuits and methods for their fabrication |
May. 25, 2004 |
| 6727587 |
Connection device and method for producing the same |
Apr. 27, 2004 |
| 6664129 |
Integrated circuits and methods for their fabrication |
Dec. 16, 2003 |
| 6653738 |
Semiconductor device |
Nov. 25, 2003 |
| 6639303 |
Integrated circuits and methods for their fabrication |
Oct. 28, 2003 |
| 6498074 |
Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners |
Dec. 24, 2002 |
| 6448153 |
Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners |
Sep. 10, 2002 |
| 6426242 |
Semiconductor chip packaging method |
Jul. 30, 2002 |
| 6420209 |
Integrated circuits and methods for their fabrication |
Jul. 16, 2002 |
| 6346432 |
Semiconductor element having external connection terminals, method of manufacturing the semiconductor element, and semiconductor device equipped with the semiconductor element |
Feb. 12, 2002 |
| 6232655 |
Semiconductor element having external connection terminals, method of manufacturing the semiconductor element, and semiconductor device equipped with the semiconductor element |
May. 15, 2001 |
| 6222266 |
Miniaturization of a semiconductor chip |
Apr. 24, 2001 |
| 6184060 |
Integrated circuits and methods for their fabrication |
Feb. 6, 2001 |
| 6156165 |
Method of forming a metallization feature on an edge of an IC chip |
Dec. 5, 2000 |
| 6075279 |
Semiconductor device |
Jun. 13, 2000 |
| 6059939 |
Method for high density edge mounting of chips |
May. 9, 2000 |
| 5903437 |
High density edge mounting of chips |
May. 11, 1999 |
| 5731635 |
Semiconductor device having a carrier and a multilayer metallization |
Mar. 24, 1998 |
| 5533664 |
Method of manufacturing a semiconductor device |
Jul. 9, 1996 |
| 5512776 |
Interdigitated IMPATT devices |
Apr. 30, 1996 |
| 5231302 |
Semiconductor device including an oblique surface and an electrode crossing the oblique surface |
Jul. 27, 1993 |
| 5018002 |
High current hermetic package including an internal foil and having a lead extending through the package lid and a packaged semiconductor chip |
May. 21, 1991 |
| 4896194 |
Semiconductor device having an integrated circuit formed on a compound semiconductor layer |
Jan. 23, 1990 |
| 4882608 |
Multilayer semiconductor device having multiple paths of current flow |
Nov. 21, 1989 |
| 4812886 |
Multilayer contact apparatus and method |
Mar. 14, 1989 |
| 4596070 |
Interdigitated IMPATT devices |
Jun. 24, 1986 |
| 4587547 |
Electrode structure for a semiconductor devices |
May. 6, 1986 |
| 4321613 |
Field effect devices and their fabrication |
Mar. 23, 1982 |
| 4237600 |
Method for fabricating stacked semiconductor diodes for high power/low loss applications |
Dec. 9, 1980 |
| 4219827 |
Integrated circuit with metal path for reducing parasitic effects |
Aug. 26, 1980 |
| 4097890 |
Low parasitic capacitance and resistance beamlead semiconductor component and method of manufacture |
Jun. 27, 1978 |
| 4075650 |
Millimeter wave semiconductor device |
Feb. 21, 1978 |
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