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Class Information
Number: 257/E23.01
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo)
Description: This subclass is indented under subclass E23.001. This subclass is substantially the same in scope as ECLA classification H01L23/48.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.012 Consisting of lead-in layers inseparably applied to semiconductor body (epo) 99
257/E23.023 Consisting of soldered or bonded constructions (epo) 391
257/E23.078 Flexible arrangements, e.g., pressure contacts without soldering (epo) 478
257/E23.079 For integrated circuit devices, e.g., power bus, number of leads (epo) 952
257/E23.011 Internal lead connections, e.g., via connections, feedthrough structures (epo) 1,161


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13

Patent Number Title Of Patent Date Issued
8710681 Isolation rings for blocking the interface between package components and the respective molding compound Apr. 29, 2014
8710630 Mechanisms for marking the orientation of a sawed die Apr. 29, 2014
8710677 Multi-chip package with a supporting member and method of manufacturing the same Apr. 29, 2014
8710671 Multi-level integrated circuit, device and method for modeling multi-level integrated circuits Apr. 29, 2014
8710667 Semiconductor device Apr. 29, 2014
8710660 Hybrid interconnect scheme including aluminum metal line in low-k dielectric Apr. 29, 2014
8710655 Die packages and systems having the die packages Apr. 29, 2014
8710652 Embedded package and method for manufacturing the same Apr. 29, 2014
8710644 Semiconductor unit having a power semiconductor and semiconductor apparatus using the same Apr. 29, 2014
8710639 Semiconductor element-embedded wiring substrate Apr. 29, 2014
8704339 Semiconductor device Apr. 22, 2014
8704377 Compliant conductive nano-particle electrical interconnect Apr. 22, 2014
8704384 Stacked die assembly Apr. 22, 2014
8692371 Semiconductor apparatus and manufacturing method thereof Apr. 8, 2014
8692376 Semiconductor device and method of manufacturing the same Apr. 8, 2014
8692284 Interposer and manufacturing method thereof Apr. 8, 2014
8686570 Multi-dimensional integrated circuit structures and methods of forming the same Apr. 1, 2014
8686564 Semiconductor device Apr. 1, 2014
8680554 Epitaxial structure and method for making the same Mar. 25, 2014
8679970 Structure and process for conductive contact integration Mar. 25, 2014
8680668 Device including a semiconductor chip and metal foils Mar. 25, 2014
8680684 Stackable microelectronic package structures Mar. 25, 2014
8674485 Semiconductor device including leadframe with downsets Mar. 18, 2014
8669658 Crosstalk-free WLCSP structure for high frequency application Mar. 11, 2014
8669646 Apparatus and method for grounding an IC package lid for EMI reduction Mar. 11, 2014
8664045 LED lamp strip and manufacturing process thereof Mar. 4, 2014
8664775 Semiconductor device Mar. 4, 2014
8659161 Chip package with reinforced positive alignment features Feb. 25, 2014
8659169 Corner structure for IC die Feb. 25, 2014
8659164 Microelectronic package with terminals on dielectric mass Feb. 25, 2014
8659138 Semiconductor package having electrode on side surface, and semiconductor device Feb. 25, 2014
8653541 Semiconductor device Feb. 18, 2014
8653663 Barrier layer for copper interconnect Feb. 18, 2014
8653664 Barrier layers for copper interconnect Feb. 18, 2014
8653673 Method for packaging semiconductors at a wafer level Feb. 18, 2014
8648477 Semiconductor chip, film substrate, and related semiconductor chip package Feb. 11, 2014
8638000 Micromechanical method and corresponding assembly for bonding semiconductor substrates and correspondingly bonded semiconductor chip Jan. 28, 2014
8637984 Multi-chip package with pillar connection Jan. 28, 2014
8633550 Semiconductor device Jan. 21, 2014
8629541 Semiconductor package for controlling warpage Jan. 14, 2014
8629559 Stress reduction apparatus with an inverted cup-shaped layer Jan. 14, 2014
8624394 Integrated technology for partial air gap low K deposition Jan. 7, 2014
8624367 Semiconductor device including semiconductor chip mounted on lead frame Jan. 7, 2014
8618540 Semiconductor packages Dec. 31, 2013
8618679 Pattern structures in semiconductor devices Dec. 31, 2013
8619003 Semiconductor device with wireless communication Dec. 31, 2013
8604615 Semiconductor device including a stack of semiconductor chips, underfill material and molding material Dec. 10, 2013
8598709 Method and system for routing electrical connections of semiconductor chips Dec. 3, 2013
8598696 Multi-surface IC packaging structures Dec. 3, 2013
8592979 Semiconductor device conductive pattern structures and methods of manufacturing the same Nov. 26, 2013

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