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Class Information
Number: 257/E23.009
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Mountings, e.g., nondetachable insulating substrates (epo) > Characterized by material or its electrical properties (epo) > Ceramic or glass substrates (epo)
Description: This subclass is indented under subclass E23.005. This subclass is substantially the same in scope as ECLA classification H01L23/15.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7586188 |
Chip package and coreless package substrate thereof |
Sep. 8, 2009 |
| 7575954 |
Ceramic substrate and method of breaking same |
Aug. 18, 2009 |
| 7564131 |
Semiconductor package and method of making a semiconductor package |
Jul. 21, 2009 |
| 7547957 |
Thin film capacitors and methods of making the same |
Jun. 16, 2009 |
| 7535094 |
Substrate structure, a method and an arrangement for producing such substrate structure |
May. 19, 2009 |
| 7535106 |
Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate |
May. 19, 2009 |
| 7521779 |
Roughened printed circuit board |
Apr. 21, 2009 |
| 7482685 |
Ceramic circuit board, method for making the same, and power module |
Jan. 27, 2009 |
| 7470971 |
Anodically bonded ultra-high-vacuum cell |
Dec. 30, 2008 |
| 7453144 |
Thin film capacitors and methods of making the same |
Nov. 18, 2008 |
| 7358158 |
Wafer machining adhesive tape, and its manufacturing method and using method |
Apr. 15, 2008 |
| 7332809 |
Glass substrate having a grooved portion, method for fabricating the same, and press mold for fabricating the glass substrate |
Feb. 19, 2008 |
| 7304378 |
Aluminum/ceramic bonding substrate |
Dec. 4, 2007 |
| 7294559 |
Wafer dicing process for optical electronic packing |
Nov. 13, 2007 |
| 7221048 |
Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier |
May. 22, 2007 |
| 7205181 |
Method of forming hermetic wafer scale integrated circuit structure |
Apr. 17, 2007 |
| 7164199 |
Device packages with low stress assembly process |
Jan. 16, 2007 |
| 7148136 |
Method of producing ceramic multi-layer substrate |
Dec. 12, 2006 |
| 7038309 |
Chip package structure with glass substrate |
May. 2, 2006 |
| 7031166 |
Silicon nitride powder, silicon nitride sintered body, sintered silicon nitride substrate, and circuit board and thermoelectric module comprising such sintered silicon nitride substrate |
Apr. 18, 2006 |
| 7011804 |
Method and apparatus for preparing aluminum nitride |
Mar. 14, 2006 |
| 7001569 |
Method of manufacturing ceramic multi-layer substrate, and unbaked composite laminated body |
Feb. 21, 2006 |
| 6974558 |
Susbstrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same |
Dec. 13, 2005 |
| 6965168 |
Micro-machined semiconductor package |
Nov. 15, 2005 |
| 6953761 |
Aluminum nitride sintered body and substrate for electronic devices |
Oct. 11, 2005 |
| 6953756 |
Glass ceramic sintered body and wiring board using the sintered body |
Oct. 11, 2005 |
| 6949823 |
Method and apparatus for high electrical and thermal performance ball grid array package |
Sep. 27, 2005 |
| 6946415 |
Composition for insulating ceramics and insulating ceramics using the same |
Sep. 20, 2005 |
| 6942833 |
Ceramic multilayer substrate manufacturing method and unfired composite multilayer body |
Sep. 13, 2005 |
| 6896953 |
Wiring board and process of producing the same |
May. 24, 2005 |
| 6888236 |
Ceramic substrate for manufacture/inspection of semiconductor |
May. 3, 2005 |
| 6879010 |
Ceramic biomolecule imaging chip |
Apr. 12, 2005 |
| 6878464 |
Glass-ceramic composite material and multilayered circuit substrate |
Apr. 12, 2005 |
| 6876075 |
Aluminum-silicon carbide semiconductor substrate and method for producing the same |
Apr. 5, 2005 |
| 6864700 |
System for electronically coupling a device to an electrical apparatus |
Mar. 8, 2005 |
| 6846987 |
Power electronics component |
Jan. 25, 2005 |
| 6846765 |
Silicon nitride powder, silicon nitride sintered body, sintered silicon nitride substrate, and circuit board and thermoelectric module comprising such sintered silicon nitride substrate |
Jan. 25, 2005 |
| 6844283 |
Zero thermal expansion material and practical component parts making use of the same |
Jan. 18, 2005 |
| 6831031 |
Thermally conductive sheet |
Dec. 14, 2004 |
| 6818574 |
Jointed body of glass-ceramic and aluminum nitride sintered compact and method for producing the same |
Nov. 16, 2004 |
| 6812178 |
Zero thermal expansion material |
Nov. 2, 2004 |
| 6811634 |
Method for manufacturing ceramic multi-layered board |
Nov. 2, 2004 |
| 6806552 |
Integrated inductive circuits |
Oct. 19, 2004 |
| 6800576 |
Aluminum nitride sintered bodies and members for semiconductor-producing apparatuses |
Oct. 5, 2004 |
| 6797093 |
Glass ceramic multilayer substrate manufacturing method and glass ceramic multilayer substrate product |
Sep. 28, 2004 |
| 6791180 |
Ceramic circuit board and power module |
Sep. 14, 2004 |
| 6776861 |
Tape composition and process for internally constrained sintering of low temperature co-fired ceramic |
Aug. 17, 2004 |
| 6777965 |
Interposer for electrically coupling a semiconductive device to an electrical apparatus |
Aug. 17, 2004 |
| 6762496 |
Substrate and production method therefor |
Jul. 13, 2004 |
| 6759599 |
Circuit board, method for manufacturing same, and high-output module |
Jul. 6, 2004 |
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