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Class Information
Number: 257/E23.009
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Mountings, e.g., nondetachable insulating substrates (epo) > Characterized by material or its electrical properties (epo) > Ceramic or glass substrates (epo)
Description: This subclass is indented under subclass E23.005. This subclass is substantially the same in scope as ECLA classification H01L23/15.

Patents under this class:
1 2 3 4 5 6 7 8 9 10

Patent Number Title Of Patent Date Issued
8709865 Fabrication method of packaging substrate having through-holed interposer embedded therein Apr. 29, 2014
8637980 Adhesive applications using alkali silicate glass for electronics Jan. 28, 2014
8629556 Semiconductor device Jan. 14, 2014
8610257 Semiconductor device and method for producing such a device Dec. 17, 2013
8546934 Method for manufacturing semiconductor devices having a glass substrate Oct. 1, 2013
8541874 Semiconductor device Sep. 24, 2013
8492870 Semiconductor package with interconnect layers Jul. 23, 2013
8466548 Semiconductor device including excess solder Jun. 18, 2013
8421215 Laminated and sintered ceramic circuit board, and semiconductor package including the circuit board Apr. 16, 2013
8334589 Power block and power semiconductor module using same Dec. 18, 2012
8329555 Method for producing a capping wafer for a sensor Dec. 11, 2012
8304895 Semiconductor package and method of fabricating the same Nov. 6, 2012
8294257 Power block and power semiconductor module using same Oct. 23, 2012
8232213 Semiconductor device and manufacturing method thereof, and liquid crystal display device Jul. 31, 2012
8217515 Semiconductor mounting substrate and method for manufacturing the same Jul. 10, 2012
8211730 Nanophotonic transceiver Jul. 3, 2012
8164178 Chip-type semiconductor ceramic electronic component Apr. 24, 2012
8120161 Semiconductor module including semiconductor chips coupled to external contact elements Feb. 21, 2012
8097898 Light-emitting diode Jan. 17, 2012
8063473 Nanophotonic transceiver Nov. 22, 2011
8049323 Chip holder with wafer level redistribution layer Nov. 1, 2011
8044475 Chip package Oct. 25, 2011
8039313 Method for producing a semiconductor device including connecting a functional wafer to a carrier substrate and selectively etching the carrier substrate Oct. 18, 2011
8018047 Power semiconductor module including a multilayer substrate Sep. 13, 2011
7986034 Power semiconductor module and method for producing the same Jul. 26, 2011
7910944 Side mountable semiconductor light emitting device packages and panels Mar. 22, 2011
7897459 Semiconductor device and manufacturing method thereof Mar. 1, 2011
7833832 Method of fabricating semiconductor components with through interconnects Nov. 16, 2010
7830001 Cu-Mo substrate and method for producing same Nov. 9, 2010
7808073 Network electronic component, semiconductor device incorporating network electronic component, and methods of manufacturing both Oct. 5, 2010
7795721 Semiconductor device and method for manufacturing the same Sep. 14, 2010
7750461 Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate Jul. 6, 2010
7749430 Member for semiconductor device and production method thereof Jul. 6, 2010
7737562 Semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode Jun. 15, 2010
7723837 Semiconductor device May. 25, 2010
7700397 Process for packaging components, and packaged components Apr. 20, 2010
7640647 Method of assembling a packaged high frequency circuit module Jan. 5, 2010
7638865 Sensor package Dec. 29, 2009
7586188 Chip package and coreless package substrate thereof Sep. 8, 2009
7575954 Ceramic substrate and method of breaking same Aug. 18, 2009
7564131 Semiconductor package and method of making a semiconductor package Jul. 21, 2009
7547957 Thin film capacitors and methods of making the same Jun. 16, 2009
7535094 Substrate structure, a method and an arrangement for producing such substrate structure May. 19, 2009
7535106 Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate May. 19, 2009
7521779 Roughened printed circuit board Apr. 21, 2009
7482685 Ceramic circuit board, method for making the same, and power module Jan. 27, 2009
7470971 Anodically bonded ultra-high-vacuum cell Dec. 30, 2008
7453144 Thin film capacitors and methods of making the same Nov. 18, 2008
7358158 Wafer machining adhesive tape, and its manufacturing method and using method Apr. 15, 2008
7332809 Glass substrate having a grooved portion, method for fabricating the same, and press mold for fabricating the glass substrate Feb. 19, 2008

1 2 3 4 5 6 7 8 9 10

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