| |
 |
|
Class Information
Number: 257/E23.008
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Mountings, e.g., nondetachable insulating substrates (epo) > Characterized by material or its electrical properties (epo) > Semiconductor insulating substrates (epo)
Description: This subclass is indented under subclass E23.005. This subclass is substantially the same in scope as ECLA classification H01L23/14S.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7605452 |
Semiconductor light-emitting device, semiconductor light-emitting module, and method of manufacturing the semiconductor light-emitting module |
Oct. 20, 2009 |
| 7589025 |
Semiconductor processing |
Sep. 15, 2009 |
| 7582973 |
Flip-chip type assembly |
Sep. 1, 2009 |
| 7579687 |
Circuit module turbulence enhancement systems and methods |
Aug. 25, 2009 |
| 7563651 |
Method of fabricating a substrate with a concave surface |
Jul. 21, 2009 |
| 7528480 |
Circuit board, semiconductor device, and manufacturing method of circuit board |
May. 5, 2009 |
| 7462940 |
Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same |
Dec. 9, 2008 |
| 7423336 |
Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices |
Sep. 9, 2008 |
| 7414309 |
Encapsulated electronic part packaging structure |
Aug. 19, 2008 |
| 7388293 |
Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions |
Jun. 17, 2008 |
| 7352061 |
Flexible core for enhancement of package interconnect reliability |
Apr. 1, 2008 |
| 7262497 |
Bumpless assembly package |
Aug. 28, 2007 |
| 7170183 |
Wafer level stacked package |
Jan. 30, 2007 |
| 7164199 |
Device packages with low stress assembly process |
Jan. 16, 2007 |
| 7060601 |
Packaging substrates for integrated circuits and soldering methods |
Jun. 13, 2006 |
| 7049170 |
Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities |
May. 23, 2006 |
| 7034401 |
Packaging substrates for integrated circuits and soldering methods |
Apr. 25, 2006 |
| 6992871 |
Microtransformer for system-on-chip power supply |
Jan. 31, 2006 |
| 6905951 |
Method of forming a device substrate and semiconductor package including a pyramid contact |
Jun. 14, 2005 |
| 6887787 |
Method for fabricating semiconductor components with conductors having wire bondable metalization layers |
May. 3, 2005 |
| 6867499 |
Semiconductor packaging |
Mar. 15, 2005 |
| 6864570 |
Method and apparatus for fabricating self-assembling microstructures |
Mar. 8, 2005 |
| 6825559 |
Group III nitride based flip-chip intergrated circuit and method for fabricating |
Nov. 30, 2004 |
| 6798061 |
Multiple semiconductor chip (multi-chip) module for use in power applications |
Sep. 28, 2004 |
| 6791178 |
Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices |
Sep. 14, 2004 |
| 6784544 |
Semiconductor component having conductors with wire bondable metalization layers |
Aug. 31, 2004 |
| 6781224 |
Semiconductor device and package including forming pyramid mount protruding through silicon substrate |
Aug. 24, 2004 |
| 6775906 |
Method of manufacturing an integrated circuit carrier |
Aug. 17, 2004 |
| 6737168 |
Composite material and semiconductor device using the same |
May. 18, 2004 |
| 6734568 |
Semiconductor device and method of manufacturing the same |
May. 11, 2004 |
| 6731513 |
Shielded multi-conductor interconnect bus for MEMS |
May. 4, 2004 |
| 6710461 |
Wafer level packaging of micro electromechanical device |
Mar. 23, 2004 |
| 6683384 |
Air isolated crossovers |
Jan. 27, 2004 |
| 6620647 |
Method for producing a semiconductor component with a silicon carrier substrate |
Sep. 16, 2003 |
| 6617677 |
Electric or electronic component and method of manufacturing such a component |
Sep. 9, 2003 |
| 6614110 |
Module with bumps for connection and support |
Sep. 2, 2003 |
| 6610934 |
Semiconductor module and method of making the device |
Aug. 26, 2003 |
| 6581279 |
Method of collectively packaging electronic components |
Jun. 24, 2003 |
| 6507099 |
Multi-chip integrated circuit carrier |
Jan. 14, 2003 |
| 6423573 |
Integrated electronic circuit comprising at least an electronic power component |
Jul. 23, 2002 |
| 6355542 |
Semiconductor device and manufacturing method |
Mar. 12, 2002 |
| 6346434 |
Semiconductor device and manufacturing method |
Feb. 12, 2002 |
| 6235554 |
Method for fabricating stackable chip scale semiconductor package |
May. 22, 2001 |
| 6160715 |
Translator for recessed flip-chip package |
Dec. 12, 2000 |
| 6156621 |
Method for fabricating direct wafer bond Si/SiO.sub.2 /Si substrates |
Dec. 5, 2000 |
| 6022757 |
Semiconductor device and manufacturing method |
Feb. 8, 2000 |
| 5954978 |
Substrate, a module and a method for fastening components of the module to the substrate |
Sep. 21, 1999 |
| 5933707 |
Crystal substrate processing |
Aug. 3, 1999 |
| 5904545 |
Apparatus for fabricating self-assembling microstructures |
May. 18, 1999 |
| 5904499 |
Package for power semiconductor chips |
May. 18, 1999 |
|
|
|
