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Class Information
Number: 257/E23.008
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Mountings, e.g., nondetachable insulating substrates (epo) > Characterized by material or its electrical properties (epo) > Semiconductor insulating substrates (epo)
Description: This subclass is indented under subclass E23.005. This subclass is substantially the same in scope as ECLA classification H01L23/14S.










Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8610257 Semiconductor device and method for producing such a device Dec. 17, 2013
8541874 Semiconductor device Sep. 24, 2013
8519542 Air through-silicon via structure Aug. 27, 2013
8466545 Stackable semiconductor package Jun. 18, 2013
8426919 Integrated circuitry Apr. 23, 2013
8399301 Mounting structures for integrated circuit modules Mar. 19, 2013
8390119 Flip chip package utilizing trace bump trace interconnection Mar. 5, 2013
8383461 Method for manufacturing semiconductor package having improved bump structures Feb. 26, 2013
8357591 Method of processing a wafer by using and reusing photolithographic masks Jan. 22, 2013
8324736 Manufacturing process and structure of through silicon via Dec. 4, 2012
8274133 Semiconductor package and method for making the same Sep. 25, 2012
8217515 Semiconductor mounting substrate and method for manufacturing the same Jul. 10, 2012
8211723 Al(x)Ga(1-x)N-cladding-free nonpolar III-nitride based laser diodes and light emitting diodes Jul. 3, 2012
8159032 Electronic device comprising an ESD device Apr. 17, 2012
8154117 High power integrated circuit device having bump pads Apr. 10, 2012
8097898 Light-emitting diode Jan. 17, 2012
8084777 Light emitting diode source with protective barrier Dec. 27, 2011
8039313 Method for producing a semiconductor device including connecting a functional wafer to a carrier substrate and selectively etching the carrier substrate Oct. 18, 2011
8018032 Silicon substrate and chip package structure with silicon base having stepped recess for accommodating chip Sep. 13, 2011
7982306 Stackable semiconductor package Jul. 19, 2011
7960820 Semiconductor package Jun. 14, 2011
7956416 Integrated circuitry Jun. 7, 2011
7833895 TSVS having chemically exposed TSV tips for integrated circuit devices Nov. 16, 2010
RE41721 Semiconductor device having an improved connected arrangement between a semiconductor pellet and base substrate electrodes Sep. 21, 2010
7795721 Semiconductor device and method for manufacturing the same Sep. 14, 2010
7737542 Stackable semiconductor package Jun. 15, 2010
7723840 Integrated circuit package system with contoured die May. 25, 2010
7638844 Manufacturing method of semiconductor-on-insulator region structures Dec. 29, 2009
7633142 Flexible core for enhancement of package interconnect reliability Dec. 15, 2009
7605452 Semiconductor light-emitting device, semiconductor light-emitting module, and method of manufacturing the semiconductor light-emitting module Oct. 20, 2009
7589025 Semiconductor processing Sep. 15, 2009
7582973 Flip-chip type assembly Sep. 1, 2009
7579687 Circuit module turbulence enhancement systems and methods Aug. 25, 2009
7563651 Method of fabricating a substrate with a concave surface Jul. 21, 2009
7528480 Circuit board, semiconductor device, and manufacturing method of circuit board May. 5, 2009
7462940 Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same Dec. 9, 2008
7423336 Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices Sep. 9, 2008
7414309 Encapsulated electronic part packaging structure Aug. 19, 2008
7388293 Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions Jun. 17, 2008
7352061 Flexible core for enhancement of package interconnect reliability Apr. 1, 2008
7262497 Bumpless assembly package Aug. 28, 2007
7170183 Wafer level stacked package Jan. 30, 2007
7164199 Device packages with low stress assembly process Jan. 16, 2007
7060601 Packaging substrates for integrated circuits and soldering methods Jun. 13, 2006
7049170 Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities May. 23, 2006
7034401 Packaging substrates for integrated circuits and soldering methods Apr. 25, 2006
6992871 Microtransformer for system-on-chip power supply Jan. 31, 2006
6905951 Method of forming a device substrate and semiconductor package including a pyramid contact Jun. 14, 2005
6887787 Method for fabricating semiconductor components with conductors having wire bondable metalization layers May. 3, 2005
6867499 Semiconductor packaging Mar. 15, 2005

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