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Class Information
Number: 257/E23.007
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Mountings, e.g., nondetachable insulating substrates (epo) > Characterized by material or its electrical properties (epo) > Organic substrates, e.g., plastic (epo)
Description: This subclass is indented under subclass E23.005. This subclass is substantially the same in scope as ECLA classification H01L23/14P.

Patents under this class:
1 2 3 4 5 6

Patent Number Title Of Patent Date Issued
8686574 Semiconductor device Apr. 1, 2014
8629556 Semiconductor device Jan. 14, 2014
8610257 Semiconductor device and method for producing such a device Dec. 17, 2013
8384230 Semiconductor device Feb. 26, 2013
8217515 Semiconductor mounting substrate and method for manufacturing the same Jul. 10, 2012
8097898 Light-emitting diode Jan. 17, 2012
8084777 Light emitting diode source with protective barrier Dec. 27, 2011
8058667 Leadframe package for light emitting diode device Nov. 15, 2011
7932607 Composite conductive film and semiconductor package using such film Apr. 26, 2011
7919845 Formation of a hybrid integrated circuit device Apr. 5, 2011
7847384 Semiconductor package and manufacturing method thereof Dec. 7, 2010
7816782 Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package Oct. 19, 2010
7816783 Resin wiring substrate, and semiconductor device and laminated semiconductor device using the same Oct. 19, 2010
7759788 Semiconductor device Jul. 20, 2010
7759161 Semiconductor device and method of manufacturing thereof Jul. 20, 2010
7740376 Flexible light emitting module Jun. 22, 2010
7679172 Semiconductor package without chip carrier and fabrication method thereof Mar. 16, 2010
7671464 Lighting device having a lighting unit with an optical semiconductor bare chip mounted on printed wiring board Mar. 2, 2010
7649198 Nano-array and fabrication method thereof Jan. 19, 2010
7649272 Arrangement of an electrical component placed on a substrate, and method for producing the same Jan. 19, 2010
7638854 Semiconductor device, display module, and manufacturing method of semiconductor device Dec. 29, 2009
7635914 Multi layer low cost cavity substrate fabrication for pop packages Dec. 22, 2009
7633142 Flexible core for enhancement of package interconnect reliability Dec. 15, 2009
7605474 Structure of polymer-matrix conductive film and method for fabricating the same Oct. 20, 2009
7598609 Structure of polymer-matrix conductive film and method for fabricating the same Oct. 6, 2009
7579215 Method for fabricating a low cost integrated circuit (IC) package Aug. 25, 2009
7521271 Method of manufacturing a transponder Apr. 21, 2009
7423336 Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices Sep. 9, 2008
7378721 Chip on lead frame for small package speed sensor May. 27, 2008
7365414 Component packaging apparatus, systems, and methods Apr. 29, 2008
7352061 Flexible core for enhancement of package interconnect reliability Apr. 1, 2008
7335978 Semiconductor component having stiffener, circuit decal and terminal contacts Feb. 26, 2008
7291912 Circuit board Nov. 6, 2007
7253502 Circuitized substrate with internal organic memory device, electrical assembly utilizing same, and information handling system utilizing same Aug. 7, 2007
7242086 Optical semiconductor bare chip, printed wiring board, lighting unit and lighting device Jul. 10, 2007
7230279 Memory card Jun. 12, 2007
7224046 Multilayer wiring board incorporating carbon fibers and glass fibers May. 29, 2007
7196426 Multilayered substrate for semiconductor device Mar. 27, 2007
7125809 Method and material for removing etch residue from high aspect ratio contact surfaces Oct. 24, 2006
7074882 Polyimide resin for electrical insulating material Jul. 11, 2006
7056406 Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereof Jun. 6, 2006
7056414 Connecting method for metal material and electric conductive plastic material and product thereby Jun. 6, 2006
7047634 Method of making a multilayer wiring board May. 23, 2006
7038142 Circuit board and method for fabricating the same, and electronic device May. 2, 2006
7022399 Semiconductor device integrated multilayer wiring board Apr. 4, 2006
7005179 Conductive inks for metalization in integrated polymer microsystems Feb. 28, 2006
6924971 High dielectric constant composite material and multilayer wiring board using the same Aug. 2, 2005
6890617 Porous adhesive sheet, semiconductor wafer with porous adhesive sheet, and method of manufacture thereof May. 10, 2005
6889429 Method of making a lead-free integrated circuit package May. 10, 2005
6863962 Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same Mar. 8, 2005

1 2 3 4 5 6

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