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Class Information
Number: 257/E23.007
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Mountings, e.g., nondetachable insulating substrates (epo) > Characterized by material or its electrical properties (epo) > Organic substrates, e.g., plastic (epo)
Description: This subclass is indented under subclass E23.005. This subclass is substantially the same in scope as ECLA classification H01L23/14P.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7605474 |
Structure of polymer-matrix conductive film and method for fabricating the same |
Oct. 20, 2009 |
| 7598609 |
Structure of polymer-matrix conductive film and method for fabricating the same |
Oct. 6, 2009 |
| 7579215 |
Method for fabricating a low cost integrated circuit (IC) package |
Aug. 25, 2009 |
| 7521271 |
Method of manufacturing a transponder |
Apr. 21, 2009 |
| 7423336 |
Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices |
Sep. 9, 2008 |
| 7378721 |
Chip on lead frame for small package speed sensor |
May. 27, 2008 |
| 7365414 |
Component packaging apparatus, systems, and methods |
Apr. 29, 2008 |
| 7352061 |
Flexible core for enhancement of package interconnect reliability |
Apr. 1, 2008 |
| 7335978 |
Semiconductor component having stiffener, circuit decal and terminal contacts |
Feb. 26, 2008 |
| 7291912 |
Circuit board |
Nov. 6, 2007 |
| 7253502 |
Circuitized substrate with internal organic memory device, electrical assembly utilizing same, and information handling system utilizing same |
Aug. 7, 2007 |
| 7242086 |
Optical semiconductor bare chip, printed wiring board, lighting unit and lighting device |
Jul. 10, 2007 |
| 7230279 |
Memory card |
Jun. 12, 2007 |
| 7224046 |
Multilayer wiring board incorporating carbon fibers and glass fibers |
May. 29, 2007 |
| 7196426 |
Multilayered substrate for semiconductor device |
Mar. 27, 2007 |
| 7125809 |
Method and material for removing etch residue from high aspect ratio contact surfaces |
Oct. 24, 2006 |
| 7074882 |
Polyimide resin for electrical insulating material |
Jul. 11, 2006 |
| 7056414 |
Connecting method for metal material and electric conductive plastic material and product thereby |
Jun. 6, 2006 |
| 7056406 |
Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereof |
Jun. 6, 2006 |
| 7047634 |
Method of making a multilayer wiring board |
May. 23, 2006 |
| 7038142 |
Circuit board and method for fabricating the same, and electronic device |
May. 2, 2006 |
| 7022399 |
Semiconductor device integrated multilayer wiring board |
Apr. 4, 2006 |
| 7005179 |
Conductive inks for metalization in integrated polymer microsystems |
Feb. 28, 2006 |
| 6924971 |
High dielectric constant composite material and multilayer wiring board using the same |
Aug. 2, 2005 |
| 6889429 |
Method of making a lead-free integrated circuit package |
May. 10, 2005 |
| 6890617 |
Porous adhesive sheet, semiconductor wafer with porous adhesive sheet, and method of manufacture thereof |
May. 10, 2005 |
| 6863962 |
Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same |
Mar. 8, 2005 |
| 6841740 |
Printed-wiring substrate and method for fabricating the same |
Jan. 11, 2005 |
| 6842662 |
Method and apparatus for fully aligned flip-chip assembly having a variable pitch packaging substrate |
Jan. 11, 2005 |
| 6835897 |
Warpage preventing substrate |
Dec. 28, 2004 |
| 6830806 |
Methods of manufacture of electric circuit substrates and components having multiple electric characteristics and substrates and components so manufactured |
Dec. 14, 2004 |
| 6812570 |
Organic packages having low tin solder connections |
Nov. 2, 2004 |
| 6797750 |
Flame-retardant epoxy resin composition, molded article thereof, and electronic part |
Sep. 28, 2004 |
| 6723801 |
Polyphenol resin, process for its production, epoxy resin composition and its use |
Apr. 20, 2004 |
| 6706409 |
Incombustible resin composition, prepreg, laminated plate, metal-clad laminated plate, printed wiring board and multi-layer printed wiring board |
Mar. 16, 2004 |
| 6660811 |
Epoxy resin composition and curing product thereof |
Dec. 9, 2003 |
| 6657295 |
Multilayer interconnect board and multilayer semiconductor device |
Dec. 2, 2003 |
| 6652805 |
Highly filled composites of powdered fillers and polymer matrix |
Nov. 25, 2003 |
| 6646350 |
Semiconductor device |
Nov. 11, 2003 |
| 6625037 |
Printed circuit board and method manufacturing the same |
Sep. 23, 2003 |
| 6621011 |
Electronic chip component |
Sep. 16, 2003 |
| 6608388 |
Delamination-preventing substrate and semiconductor package with the same |
Aug. 19, 2003 |
| 6566288 |
Electrically insulating non-woven fabric, a prepreg and a laminate |
May. 20, 2003 |
| 6548152 |
Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same |
Apr. 15, 2003 |
| 6515047 |
Composition of epoxy resin and triazine-formaldehyde-phenol resin |
Feb. 4, 2003 |
| 6488198 |
Wire bonding method and apparatus |
Dec. 3, 2002 |
| 6432539 |
Phosphorus-containing polymer having phenolic units and uses thereof |
Aug. 13, 2002 |
| 6434017 |
Semiconductor device and electronic apparatus |
Aug. 13, 2002 |
| 6426565 |
Electronic package and method of making same |
Jul. 30, 2002 |
| 6426371 |
Sol materials |
Jul. 30, 2002 |
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