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Browse by Category: Main > Physics
Class Information
Number: 257/E23.006
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Mountings, e.g., nondetachable insulating substrates (epo) > Characterized by material or its electrical properties (epo) > Metallic substrates having insulating layers (epo)
Description: This subclass is indented under subclass E23.005. This subclass is substantially the same in scope as ECLA classification H01L23/14M.










Patents under this class:
1 2 3 4 5 6

Patent Number Title Of Patent Date Issued
8709865 Fabrication method of packaging substrate having through-holed interposer embedded therein Apr. 29, 2014
8610257 Semiconductor device and method for producing such a device Dec. 17, 2013
8610260 Stub minimization for assemblies without wirebonds to package substrate Dec. 17, 2013
8535546 Method of manufacturing multilayer wiring substrate Sep. 17, 2013
8466545 Stackable semiconductor package Jun. 18, 2013
8232138 Circuit board with notched stiffener frame Jul. 31, 2012
8193634 Mounted semiconductor device and a method for making the same Jun. 5, 2012
8174117 Semiconductor device and method of manufacturing the same May. 8, 2012
8163575 Grown photonic crystals in semiconductor light emitting devices Apr. 24, 2012
8154114 Power semiconductor module Apr. 10, 2012
8129824 Shielding for a semiconductor package Mar. 6, 2012
8124544 Method for manufacturing semiconductor device Feb. 28, 2012
8049311 Electronic component and method for its production Nov. 1, 2011
8040148 System in package with built-in test-facilitating circuit Oct. 18, 2011
8035214 Conductive connecting pin for package substance Oct. 11, 2011
8021927 Die down ball grid array packages and method for making same Sep. 20, 2011
7872340 Integrated circuit package system employing an offset stacked configuration Jan. 18, 2011
7863724 Circuit substrate having post-fed die side power supply connections Jan. 4, 2011
7830004 Packaging with base layers comprising alloy 42 Nov. 9, 2010
7763960 Semiconductor device, method for manufacturing semiconductor device, and electric equipment system Jul. 27, 2010
7759161 Semiconductor device and method of manufacturing thereof Jul. 20, 2010
7759784 3D circuit module, multilayer 3D circuit module formed thereof, mobile terminal device using the circuit modules and method for manufacturing the circuit modules Jul. 20, 2010
7749809 Methods and systems for packaging integrated circuits Jul. 6, 2010
7719104 Circuit board structure with embedded semiconductor chip and method for fabricating the same May. 18, 2010
7687895 Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips Mar. 30, 2010
7676918 Method for forming a molded circuit board Mar. 16, 2010
7663228 Electronic component and electronic component module Feb. 16, 2010
7595553 Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus Sep. 29, 2009
7589025 Semiconductor processing Sep. 15, 2009
7575957 Leadless semiconductor package and method for manufacturing the same Aug. 18, 2009
7528482 Embedded chip package with improved heat dissipation performance and method of making the same May. 5, 2009
7514767 Fan out type wafer level package structure and method of the same Apr. 7, 2009
7495318 Apparatus and method for improving AC coupling on circuit boards Feb. 24, 2009
7485493 Singulating surface-mountable semiconductor devices and fitting external contacts to said devices Feb. 3, 2009
7462926 Leadframe comprising tin plating or an intermetallic layer formed therefrom Dec. 9, 2008
7459782 Stiffener for flip chip BGA package Dec. 2, 2008
7417313 Method for manufacturing an adhesive substrate with a die-cavity sidewall Aug. 26, 2008
7396735 Semiconductor element heat dissipating member, semiconductor device using same, and method for manufacturing same Jul. 8, 2008
7340828 Method for producing metal/ceramic bonding circuit board Mar. 11, 2008
7335995 Microelectronic assembly having array including passive elements and interconnects Feb. 26, 2008
7323765 Die attach paddle for mounting integrated circuit die Jan. 29, 2008
7276787 Silicon chip carrier with conductive through-vias and method for fabricating same Oct. 2, 2007
7224046 Multilayer wiring board incorporating carbon fibers and glass fibers May. 29, 2007
7109569 Dual referenced microstrip Sep. 19, 2006
7071569 Electrical package capable of increasing the density of bonding pads and fine circuit lines inside a interconnection Jul. 4, 2006
7047637 Method of manufacture of ceramic composite wiring structures for semiconductor devices May. 23, 2006
7038142 Circuit board and method for fabricating the same, and electronic device May. 2, 2006
6979497 Electro-conductive metal plated polyimide substrate Dec. 27, 2005
6938333 Method of manufacturing a metal-ceramic circuit board Sep. 6, 2005
6876075 Aluminum-silicon carbide semiconductor substrate and method for producing the same Apr. 5, 2005

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