| |
 |
|
Class Information
Number: 257/E23.006
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Mountings, e.g., nondetachable insulating substrates (epo) > Characterized by material or its electrical properties (epo) > Metallic substrates having insulating layers (epo)
Description: This subclass is indented under subclass E23.005. This subclass is substantially the same in scope as ECLA classification H01L23/14M.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7595553 |
Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus |
Sep. 29, 2009 |
| 7589025 |
Semiconductor processing |
Sep. 15, 2009 |
| 7575957 |
Leadless semiconductor package and method for manufacturing the same |
Aug. 18, 2009 |
| 7528482 |
Embedded chip package with improved heat dissipation performance and method of making the same |
May. 5, 2009 |
| 7514767 |
Fan out type wafer level package structure and method of the same |
Apr. 7, 2009 |
| 7495318 |
Apparatus and method for improving AC coupling on circuit boards |
Feb. 24, 2009 |
| 7485493 |
Singulating surface-mountable semiconductor devices and fitting external contacts to said devices |
Feb. 3, 2009 |
| 7462926 |
Leadframe comprising tin plating or an intermetallic layer formed therefrom |
Dec. 9, 2008 |
| 7459782 |
Stiffener for flip chip BGA package |
Dec. 2, 2008 |
| 7417313 |
Method for manufacturing an adhesive substrate with a die-cavity sidewall |
Aug. 26, 2008 |
| 7396735 |
Semiconductor element heat dissipating member, semiconductor device using same, and method for manufacturing same |
Jul. 8, 2008 |
| 7340828 |
Method for producing metal/ceramic bonding circuit board |
Mar. 11, 2008 |
| 7335995 |
Microelectronic assembly having array including passive elements and interconnects |
Feb. 26, 2008 |
| 7323765 |
Die attach paddle for mounting integrated circuit die |
Jan. 29, 2008 |
| 7276787 |
Silicon chip carrier with conductive through-vias and method for fabricating same |
Oct. 2, 2007 |
| 7224046 |
Multilayer wiring board incorporating carbon fibers and glass fibers |
May. 29, 2007 |
| 7109569 |
Dual referenced microstrip |
Sep. 19, 2006 |
| 7071569 |
Electrical package capable of increasing the density of bonding pads and fine circuit lines inside a interconnection |
Jul. 4, 2006 |
| 7047637 |
Method of manufacture of ceramic composite wiring structures for semiconductor devices |
May. 23, 2006 |
| 7038142 |
Circuit board and method for fabricating the same, and electronic device |
May. 2, 2006 |
| 6979497 |
Electro-conductive metal plated polyimide substrate |
Dec. 27, 2005 |
| 6938333 |
Method of manufacturing a metal-ceramic circuit board |
Sep. 6, 2005 |
| 6876075 |
Aluminum-silicon carbide semiconductor substrate and method for producing the same |
Apr. 5, 2005 |
| 6867491 |
Metal core integrated circuit package with electrically isolated regions and associated methods |
Mar. 15, 2005 |
| 6841413 |
Thinned die integrated circuit package |
Jan. 11, 2005 |
| 6822320 |
Microelectronic connection components utilizing conductive cores and polymeric coatings |
Nov. 23, 2004 |
| 6818972 |
Reduction of chip carrier flexing during thermal cycling |
Nov. 16, 2004 |
| 6803649 |
Electronic assembly |
Oct. 12, 2004 |
| 6742249 |
Method of manufacture of ceramic composite wiring structures for semiconductor devices |
Jun. 1, 2004 |
| 6739047 |
Method of making ceramic multilayer circuit boards mounted in a patterned metal support substrate |
May. 25, 2004 |
| 6734363 |
Lightweight electronic equipment conductor with coolant permeable support |
May. 11, 2004 |
| 6713587 |
Electrodepositable dielectric coating compositions and methods related thereto |
Mar. 30, 2004 |
| 6709897 |
Method of forming IC package having upward-facing chip cavity |
Mar. 23, 2004 |
| 6671950 |
Multi-layer circuit assembly and process for preparing the same |
Jan. 6, 2004 |
| 6649265 |
Carbon-based metal composite material, method for preparation thereof and use thereof |
Nov. 18, 2003 |
| 6646344 |
Composite material, and manufacturing method and uses of same |
Nov. 11, 2003 |
| 6641861 |
Heatsink and fabrication method thereof |
Nov. 4, 2003 |
| 6630734 |
Composite material, and manufacturing method and uses of same |
Oct. 7, 2003 |
| 6611056 |
Composite material, and manufacturing method and uses of same |
Aug. 26, 2003 |
| 6579623 |
Composite material member for semiconductor device and insulated and non-insulated semiconductor devices using composite material member |
Jun. 17, 2003 |
| 6528179 |
Reduction of chip carrier flexing during thermal cycling |
Mar. 4, 2003 |
| 6518502 |
Ceramic multilayer circuit boards mounted on a patterned metal support substrate |
Feb. 11, 2003 |
| 6507105 |
Member for semiconductor device and method for producing the same |
Jan. 14, 2003 |
| 6497943 |
Surface metal balancing to reduce chip carrier flexing |
Dec. 24, 2002 |
| 6492201 |
Forming microelectronic connection components by electrophoretic deposition |
Dec. 10, 2002 |
| 6451448 |
Surface treated metallic materials and manufacturing method thereof |
Sep. 17, 2002 |
| 6424046 |
Substrate for manufacturing a semiconductor device with three element alloy |
Jul. 23, 2002 |
| 6420018 |
Low thermal expansion circuit board and multilayer wiring circuit board |
Jul. 16, 2002 |
| 6391422 |
Wiring substrate and stiffener therefor |
May. 21, 2002 |
| 6369332 |
Metal-base multilayer circuit substrate with heat conducting adhesive |
Apr. 9, 2002 |
|
|
|
