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Class Information
Number: 257/E23.005
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Mountings, e.g., nondetachable insulating substrates (epo) > Characterized by material or its electrical properties (epo)
Description: This subclass is indented under subclass E23.003. This subclass is substantially the same in scope as ECLA classification H01L23/14.

Sub-classes under this class:

Class Number Class Name Patents
257/E23.009 Ceramic or glass substrates (epo) 484
257/E23.006 Metallic substrates having insulating layers (epo) 276
257/E23.007 Organic substrates, e.g., plastic (epo) 260
257/E23.008 Semiconductor insulating substrates (epo) 167

Patents under this class:
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Patent Number Title Of Patent Date Issued
8610257 Semiconductor device and method for producing such a device Dec. 17, 2013
8575746 Chip on flexible printed circuit type semiconductor package Nov. 5, 2013
8466546 Chip-scale package Jun. 18, 2013
8455994 Electronic module with feed through conductor between wiring patterns Jun. 4, 2013
8399977 Resin-sealed package and method of producing the same Mar. 19, 2013
8368201 Method for embedding a component in a base Feb. 5, 2013
8304885 Semiconductor device and electronic apparatus equipped with the semiconductor device Nov. 6, 2012
8294236 Semiconductor device having dual-STI and manufacturing method thereof Oct. 23, 2012
8264088 Planarized passivation layer for semiconductor devices Sep. 11, 2012
8222089 Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same Jul. 17, 2012
8203190 MEMS device including a chip carrier Jun. 19, 2012
8183594 Laminar structure on a semiconductor substrate May. 22, 2012
8039313 Method for producing a semiconductor device including connecting a functional wafer to a carrier substrate and selectively etching the carrier substrate Oct. 18, 2011
8035219 Packaging semiconductors at wafer level Oct. 11, 2011
8022416 Functional blocks for assembly Sep. 20, 2011
8008763 Stacked electronic component and manufacturing method thereof Aug. 30, 2011
7989944 Method for embedding a component in a base Aug. 2, 2011
7944040 Semiconductor device and electronic apparatus equipped with the semiconductor device May. 17, 2011
7915727 Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same Mar. 29, 2011
7872322 Magnetic field sensor with a hall element Jan. 18, 2011
7847384 Semiconductor package and manufacturing method thereof Dec. 7, 2010
7830004 Packaging with base layers comprising alloy 42 Nov. 9, 2010
7732920 Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus Jun. 8, 2010
7719107 Semiconductor device and electronic apparatus equipped with the semiconductor device May. 18, 2010
7671459 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices Mar. 2, 2010
7649270 Collective substrate, semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode Jan. 19, 2010
7646090 Semiconductor module for making electrical contact with a connection device via a rewiring device Jan. 12, 2010
7598153 Method and structure for fabricating bonded substrate structures using thermal processing to remove oxygen species Oct. 6, 2009
7582513 Electronic device and method for producing electronic devices Sep. 1, 2009
7582973 Flip-chip type assembly Sep. 1, 2009
7462926 Leadframe comprising tin plating or an intermetallic layer formed therefrom Dec. 9, 2008
7382056 Integrated passive devices Jun. 3, 2008
7358603 High density electronic packages Apr. 15, 2008
7321166 Wiring board having connecting wiring between electrode plane and connecting pad Jan. 22, 2008
7256481 Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices Aug. 14, 2007
7170183 Wafer level stacked package Jan. 30, 2007
6967282 Flip chip MMIC on board performance using periodic electromagnetic bandgap structures Nov. 22, 2005
6949707 Periodic interleaved star with vias electromagnetic bandgap structure for microstrip and flip chip on board applications Sep. 27, 2005
6433071 Aromatic polysulfone resin composition and molded article thereof Aug. 13, 2002
5682063 Substrate for semiconductor device Oct. 28, 1997
5526867 Methods of forming electronic packages Jun. 18, 1996
5382758 Diamond substrates having metallized vias Jan. 17, 1995
5328715 Process for making metallized vias in diamond substrates Jul. 12, 1994
5250451 Process for the production of thin film transistors Oct. 5, 1993
5163499 Method of forming electronic packages Nov. 17, 1992
4916259 Composite dielectric structure for optimizing electrical performance in high performance chip support packages Apr. 10, 1990
4426689 Vertical semiconductor integrated circuit chip packaging Jan. 17, 1984
4286374 Large scale integrated circuit production Sep. 1, 1981
4285002 Integrated circuit package Aug. 18, 1981
4065782 Field-effect transistors Dec. 27, 1977

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