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Class Information
Number: 257/E23.005
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Mountings, e.g., nondetachable insulating substrates (epo) > Characterized by material or its electrical properties (epo)
Description: This subclass is indented under subclass E23.003. This subclass is substantially the same in scope as ECLA classification H01L23/14.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7598153 |
Method and structure for fabricating bonded substrate structures using thermal processing to remove oxygen species |
Oct. 6, 2009 |
| 7582513 |
Electronic device and method for producing electronic devices |
Sep. 1, 2009 |
| 7582973 |
Flip-chip type assembly |
Sep. 1, 2009 |
| 7462926 |
Leadframe comprising tin plating or an intermetallic layer formed therefrom |
Dec. 9, 2008 |
| 7382056 |
Integrated passive devices |
Jun. 3, 2008 |
| 7358603 |
High density electronic packages |
Apr. 15, 2008 |
| 7321166 |
Wiring board having connecting wiring between electrode plane and connecting pad |
Jan. 22, 2008 |
| 7256481 |
Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices |
Aug. 14, 2007 |
| 7170183 |
Wafer level stacked package |
Jan. 30, 2007 |
| 6967282 |
Flip chip MMIC on board performance using periodic electromagnetic bandgap structures |
Nov. 22, 2005 |
| 6949707 |
Periodic interleaved star with vias electromagnetic bandgap structure for microstrip and flip chip on board applications |
Sep. 27, 2005 |
| 6433071 |
Aromatic polysulfone resin composition and molded article thereof |
Aug. 13, 2002 |
| 5682063 |
Substrate for semiconductor device |
Oct. 28, 1997 |
| 5526867 |
Methods of forming electronic packages |
Jun. 18, 1996 |
| 5382758 |
Diamond substrates having metallized vias |
Jan. 17, 1995 |
| 5328715 |
Process for making metallized vias in diamond substrates |
Jul. 12, 1994 |
| 5250451 |
Process for the production of thin film transistors |
Oct. 5, 1993 |
| 5163499 |
Method of forming electronic packages |
Nov. 17, 1992 |
| 4916259 |
Composite dielectric structure for optimizing electrical performance in high performance chip support packages |
Apr. 10, 1990 |
| 4426689 |
Vertical semiconductor integrated circuit chip packaging |
Jan. 17, 1984 |
| 4286374 |
Large scale integrated circuit production |
Sep. 1, 1981 |
| 4285002 |
Integrated circuit package |
Aug. 18, 1981 |
| 4065782 |
Field-effect transistors |
Dec. 27, 1977 |
| 3995310 |
Semiconductor assembly including mounting plate with recessed periphery |
Nov. 30, 1976 |
| 3968193 |
Firing process for forming a multilayer glass-metal module |
Jul. 6, 1976 |
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