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Class Information
Number: 257/E23.004
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Mountings, e.g., nondetachable insulating substrates (epo) > Characterized by shape (epo)
Description: This subclass is indented under subclass E23.003. This subclass is substantially the same in scope as ECLA classification H01L23/13.

Patents under this class:

Patent Number Title Of Patent Date Issued
8674487 Semiconductor packages with lead extensions and related methods Mar. 18, 2014
8637997 Semiconductor device and method of manufacturing the same Jan. 28, 2014
8629549 Carrier body for a semiconductor component, semiconductor component and method for producing a carrier body Jan. 14, 2014
8610257 Semiconductor device and method for producing such a device Dec. 17, 2013
8610255 Light emitting device package Dec. 17, 2013
8581403 Electronic component mounting structure, electronic component mounting method, and electronic component mounting board Nov. 12, 2013
8531034 Semiconductor package and package on package having the same Sep. 10, 2013
8524514 Method for producing a non-plane element Sep. 3, 2013
8508038 Method for producing an integrated circuit and resulting film chip Aug. 13, 2013
8502359 Semiconductor device Aug. 6, 2013
8497575 Semiconductor packaging system with an aligned interconnect and method of manufacture thereof Jul. 30, 2013
8445324 Method of wafer-level fabrication of MEMS devices May. 21, 2013
8395245 Semiconductor package module Mar. 12, 2013
8354749 Method for efficiently producing removable peripheral cards Jan. 15, 2013
8288845 Package including proximately-positioned lead frame Oct. 16, 2012
8269334 Multichip package leadframe including electrical bussing Sep. 18, 2012
8242596 Method for efficiently producing removable peripheral cards Aug. 14, 2012
8227921 Semiconductor package with increased I/O density and method of making same Jul. 24, 2012
8222748 Packaged electronic devices having die attach regions with selective thin dielectric layer Jul. 17, 2012
8212343 Semiconductor chip package Jul. 3, 2012
RE43444 Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes Jun. 5, 2012
8148806 Multiple chips bonded to packaging structure with low noise and multiple selectable functions Apr. 3, 2012
8120162 Package with improved connection of a decoupling capacitor Feb. 21, 2012
8120151 Optical semiconductor device and method for manufacturing the same Feb. 21, 2012
8106490 Semiconductor chip package Jan. 31, 2012
8097943 Semiconductor device and method of forming wafer level ground plane and power ring Jan. 17, 2012
8089159 Semiconductor package with increased I/O density and method of making the same Jan. 3, 2012
8089143 Integrated circuit package system using interposer Jan. 3, 2012
8089141 Semiconductor package having leadframe with exposed anchor pads Jan. 3, 2012
8084777 Light emitting diode source with protective barrier Dec. 27, 2011
RE42972 Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof Nov. 29, 2011
8067827 Stacked microelectronic device assemblies Nov. 29, 2011
8062929 Semiconductor device and method of stacking same size semiconductor die electrically connected through conductive via formed around periphery of the die Nov. 22, 2011
8044523 Semiconductor device Oct. 25, 2011
8022539 Integrated circuit packaging system with increased connectivity and method of manufacture thereof Sep. 20, 2011
8008763 Stacked electronic component and manufacturing method thereof Aug. 30, 2011
7999387 Semiconductor element connected to printed circuit board Aug. 16, 2011
7964952 Stacked semiconductor package assembly having hollowed substrate Jun. 21, 2011
7956441 Method of increasing the area of a useful layer of material transferred onto a support Jun. 7, 2011
7952157 Electromagnetic shielding device for an infrared receiver May. 31, 2011
7911047 Semiconductor device and method of fabricating the semiconductor device Mar. 22, 2011
7888259 Integrated circuit package employing predetermined three-dimensional solder pad surface and method for making same Feb. 15, 2011
7888175 Method and apparatus for facilitating proximity communication and power delivery Feb. 15, 2011
7875965 Semiconductor chip package Jan. 25, 2011
7872360 Semiconductor device and method of manufacturing the same Jan. 18, 2011
7851912 Semiconductor device Dec. 14, 2010
7838331 Method for dicing semiconductor substrate Nov. 23, 2010
7834452 Device made of single-crystal silicon Nov. 16, 2010
7834439 Semiconductor module and method of manufacturing the same Nov. 16, 2010
7834436 Semiconductor chip package Nov. 16, 2010

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