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Class Information
Number: 257/E23.004
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Mountings, e.g., nondetachable insulating substrates (epo) > Characterized by shape (epo)
Description: This subclass is indented under subclass E23.003. This subclass is substantially the same in scope as ECLA classification H01L23/13.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619317 |
Carrier structure for semiconductor chip and method for manufacturing the same |
Nov. 17, 2009 |
| 7615842 |
Inductor integrated chip |
Nov. 10, 2009 |
| 7615859 |
Thin semiconductor package having stackable lead frame and method of manufacturing the same |
Nov. 10, 2009 |
| 7605459 |
Coreless substrate and manufacturing thereof |
Oct. 20, 2009 |
| 7550845 |
Ball grid array package with separated stiffener layer |
Jun. 23, 2009 |
| 7550830 |
Stacked semiconductor package having fan-out structure through wire bonding |
Jun. 23, 2009 |
| 7545036 |
Semiconductor device that suppresses variations in high frequency characteristics of circuit elements |
Jun. 9, 2009 |
| 7538414 |
Semiconductor integrated circuit device |
May. 26, 2009 |
| 7531906 |
Flip chip packaging using recessed interposer terminals |
May. 12, 2009 |
| 7528474 |
Stacked semiconductor package assembly having hollowed substrate |
May. 5, 2009 |
| 7518239 |
Semiconductor device with substrate having penetrating hole having a protrusion |
Apr. 14, 2009 |
| 7514276 |
Aligning stacked chips using resistance assistance |
Apr. 7, 2009 |
| 7514774 |
Stacked multi-chip package with EMI shielding |
Apr. 7, 2009 |
| 7498669 |
Semiconductor device |
Mar. 3, 2009 |
| 7479691 |
Power semiconductor module having surface-mountable flat external contacts and method for producing the same |
Jan. 20, 2009 |
| 7476913 |
Light emitting device having a mirror portion |
Jan. 13, 2009 |
| 7470971 |
Anodically bonded ultra-high-vacuum cell |
Dec. 30, 2008 |
| 7466021 |
Memory packages having stair step interconnection layers |
Dec. 16, 2008 |
| 7462940 |
Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same |
Dec. 9, 2008 |
| 7443013 |
Flexible substrate for package of die |
Oct. 28, 2008 |
| 7427532 |
Method of manufacturing a device having a contacting structure |
Sep. 23, 2008 |
| 7411295 |
Circuit board, device mounting structure, device mounting method, and electronic apparatus |
Aug. 12, 2008 |
| 7400032 |
Module assembly for stacked BGA packages |
Jul. 15, 2008 |
| 7400035 |
Semiconductor device having multilayer printed wiring board |
Jul. 15, 2008 |
| 7391104 |
Non-stick detection method and mechanism for array molded laminate packages |
Jun. 24, 2008 |
| 7391122 |
Techniques for flip chip package migration |
Jun. 24, 2008 |
| 7375422 |
Stacked-type semiconductor package |
May. 20, 2008 |
| 7368810 |
Invertible microfeature device packages |
May. 6, 2008 |
| 7368795 |
Image sensor module with passive component |
May. 6, 2008 |
| 7364784 |
Thin semiconductor package having stackable lead frame and method of manufacturing the same |
Apr. 29, 2008 |
| 7339259 |
Semiconductor device |
Mar. 4, 2008 |
| 7327032 |
Semiconductor package accomplishing fan-out structure through wire bonding |
Feb. 5, 2008 |
| 7323769 |
High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package |
Jan. 29, 2008 |
| 7307293 |
Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths |
Dec. 11, 2007 |
| 7279779 |
Substrate assembly for stressed systems |
Oct. 9, 2007 |
| 7265453 |
Semiconductor component having dummy segments with trapped corner air |
Sep. 4, 2007 |
| 7253504 |
Integrated circuit package and method |
Aug. 7, 2007 |
| 7253514 |
Self-supporting connecting element for a semiconductor chip |
Aug. 7, 2007 |
| 7247932 |
Chip package with capacitor |
Jul. 24, 2007 |
| 7239024 |
Semiconductor package with recess for die |
Jul. 3, 2007 |
| 7235871 |
Stacked microelectronic dies |
Jun. 26, 2007 |
| 7230328 |
Semiconductor package and laminated semiconductor package |
Jun. 12, 2007 |
| 7224062 |
Chip package with embedded panel-shaped component |
May. 29, 2007 |
| 7218001 |
Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components |
May. 15, 2007 |
| 7217991 |
Fan-in leadframe semiconductor package |
May. 15, 2007 |
| 7205658 |
Singulation method used in leadless packaging process |
Apr. 17, 2007 |
| 7180170 |
Lead-free integrated circuit package structure |
Feb. 20, 2007 |
| 7157794 |
Semiconductor device that suppresses variations in high frequency characteristics of circuit elements |
Jan. 2, 2007 |
| 7138708 |
Electronic system for fixing power and signal semiconductor chips |
Nov. 21, 2006 |
| 7132315 |
Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same |
Nov. 7, 2006 |
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