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Class Information
Number: 257/E23.003
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Mountings, e.g., nondetachable insulating substrates (epo)
Description: This subclass is indented under subclass E23.001. This subclass is substantially the same in scope as ECLA classification H01L23/12.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7605020 |
Semiconductor chip package |
Oct. 20, 2009 |
| 7602070 |
Room temperature metal direct bonding |
Oct. 13, 2009 |
| 7589416 |
Substrate, electronic component, and manufacturing method of these |
Sep. 15, 2009 |
| 7582964 |
Semiconductor package having non-ceramic based window frame |
Sep. 1, 2009 |
| 7579691 |
Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication |
Aug. 25, 2009 |
| 7566632 |
Lock and key structure for three-dimensional chip connection and process thereof |
Jul. 28, 2009 |
| 7563651 |
Method of fabricating a substrate with a concave surface |
Jul. 21, 2009 |
| 7554204 |
Die offset die to die bonding |
Jun. 30, 2009 |
| 7535094 |
Substrate structure, a method and an arrangement for producing such substrate structure |
May. 19, 2009 |
| 7518231 |
Differential chip performance within a multi-chip package |
Apr. 14, 2009 |
| 7504722 |
Semiconductor device with slanting side surface for external connection |
Mar. 17, 2009 |
| 7501696 |
Semiconductor chip-embedded substrate and method of manufacturing same |
Mar. 10, 2009 |
| 7501698 |
Method and system for an improved power distribution network for use with a semiconductor device |
Mar. 10, 2009 |
| 7482690 |
Electronic components such as thin array plastic packages and process for fabricating same |
Jan. 27, 2009 |
| 7482700 |
Semiconductor device having projection on surface thereof, and method of identifying semiconductor package |
Jan. 27, 2009 |
| 7436054 |
MEMS microphone with a stacked PCB package and method of producing the same |
Oct. 14, 2008 |
| 7427809 |
Repairable three-dimensional semiconductor subsystem |
Sep. 23, 2008 |
| 7425760 |
Multi-chip module structure with power delivery using flexible cables |
Sep. 16, 2008 |
| 7417294 |
Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
Aug. 26, 2008 |
| 7417313 |
Method for manufacturing an adhesive substrate with a die-cavity sidewall |
Aug. 26, 2008 |
| 7400038 |
Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication |
Jul. 15, 2008 |
| 7391122 |
Techniques for flip chip package migration |
Jun. 24, 2008 |
| 7378725 |
Semiconducting device with stacked dice |
May. 27, 2008 |
| 7348210 |
Post bump passivation for soft error protection |
Mar. 25, 2008 |
| 7323765 |
Die attach paddle for mounting integrated circuit die |
Jan. 29, 2008 |
| 7298045 |
Stacked semiconductor device |
Nov. 20, 2007 |
| 7259443 |
Methods for forming patterns on a filled dielectric material on substrates |
Aug. 21, 2007 |
| 7245011 |
Prevention of contamination on bonding pads of wafer during SMT |
Jul. 17, 2007 |
| 7233066 |
Multilayer wiring substrate, and method of producing same |
Jun. 19, 2007 |
| 7221048 |
Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier |
May. 22, 2007 |
| 7205655 |
Multilayer circuit including stacked layers of insulating material and conductive sections |
Apr. 17, 2007 |
| 7190058 |
Spacer die structure and method for attaching |
Mar. 13, 2007 |
| 7170159 |
Low CTE substrates for use with low-k flip-chip package devices |
Jan. 30, 2007 |
| 7109067 |
Semiconductor device and method for fabricating same |
Sep. 19, 2006 |
| 7078797 |
Hybrid integrated circuit device |
Jul. 18, 2006 |
| 6984886 |
System-on-a-chip with multi-layered metallized through-hole interconnection |
Jan. 10, 2006 |
| 6962866 |
System-on-a-chip with multi-layered metallized through-hole interconnection |
Nov. 8, 2005 |
| 6828002 |
Substrate strip with sides having flanges and recesses |
Dec. 7, 2004 |
| 6486003 |
Expandable interposer for a microelectronic package and method therefor |
Nov. 26, 2002 |
| 6441479 |
System-on-a-chip with multi-layered metallized through-hole interconnection |
Aug. 27, 2002 |
| 6153926 |
Semiconductor device |
Nov. 28, 2000 |
| 5954978 |
Substrate, a module and a method for fastening components of the module to the substrate |
Sep. 21, 1999 |
| 4210885 |
Thin film lossy line for preventing reflections in microcircuit chip package interconnections |
Jul. 1, 1980 |
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