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Class Information
Number: 257/E23.003
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Mountings, e.g., nondetachable insulating substrates (epo)
Description: This subclass is indented under subclass E23.001. This subclass is substantially the same in scope as ECLA classification H01L23/12.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.005 Characterized by material or its electrical properties (epo) 52
257/E23.004 Characterized by shape (epo) 1,051


Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8703542 Wafer-level packaging mechanisms Apr. 22, 2014
8704360 Top port surface mount silicon condenser microphone package Apr. 22, 2014
8692394 Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor device Apr. 8, 2014
8686550 Method and apparatus for high pressure sensor device Apr. 1, 2014
8659168 Wiring board for flip-chip mounting, mounting structure of electronic components on wiring board, and semiconductor device including wiring board Feb. 25, 2014
8652883 Methods of manufacture of bottom port surface mount silicon condenser microphone packages Feb. 18, 2014
8633064 Methods of manufacture of top port multipart surface mount silicon condenser microphone package Jan. 21, 2014
8629005 Methods of manufacture of bottom port surface mount silicon condenser microphone packages Jan. 14, 2014
8629552 Top port multi-part surface mount silicon condenser microphone package Jan. 14, 2014
8623709 Methods of manufacture of top port surface mount silicon condenser microphone packages Jan. 7, 2014
8623710 Methods of manufacture of bottom port multi-part surface mount silicon condenser microphone packages Jan. 7, 2014
8624384 Bottom port surface mount silicon condenser microphone package Jan. 7, 2014
8624385 Top port surface mount silicon condenser microphone package Jan. 7, 2014
8624386 Bottom port multi-part surface mount silicon condenser microphone package Jan. 7, 2014
8624387 Top port multi-part surface mount silicon condenser microphone package Jan. 7, 2014
8617934 Methods of manufacture of top port multi-part surface mount silicon condenser microphone packages Dec. 31, 2013
8610257 Semiconductor device and method for producing such a device Dec. 17, 2013
8604609 Flange for semiconductor die Dec. 10, 2013
8592952 Semiconductor chip and semiconductor package with stack chip structure Nov. 26, 2013
8592970 Multichip electronic packages and methods of manufacture Nov. 26, 2013
8519424 User configurable mosaic light emitting apparatus Aug. 27, 2013
8502398 Wiring board, semiconductor apparatus and method of manufacturing them Aug. 6, 2013
8476753 Process for enhanced 3D integration and structures generated using the same Jul. 2, 2013
8460971 Semiconductor device packaging structure and packaging method Jun. 11, 2013
8421197 Integrated circuit package system with warp-free chip Apr. 16, 2013
8395268 Semiconductor memory device Mar. 12, 2013
8354297 Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die Jan. 15, 2013
8330262 Processes for enhanced 3D integration and structures generated using the same Dec. 11, 2012
8314487 Flange for semiconductor die Nov. 20, 2012
8241950 System and method to manufacture an implantable electrode Aug. 14, 2012
8232631 Semiconductor packing having offset stack structure Jul. 31, 2012
8217515 Semiconductor mounting substrate and method for manufacturing the same Jul. 10, 2012
8207607 Semiconductor device with resin mold Jun. 26, 2012
8178371 Solid-state lasers May. 15, 2012
8178959 Process for fabricating a semiconductor component support, support and semiconductor device May. 15, 2012
8148817 Multi-die DC-DC buck power converter with efficient packaging Apr. 3, 2012
8143718 Semiconductor device having stress relaxation sections Mar. 27, 2012
8125059 Semiconductor device Feb. 28, 2012
8121331 Surface mount silicon condenser microphone package Feb. 21, 2012
8114708 System and method for pre-patterned embedded chip build-up Feb. 14, 2012
8105878 Manufacturing method of a semiconductor device having a package dicing Jan. 31, 2012
8097947 Conductive systems and devices including wires coupled to anisotropic conductive film, and methods of forming the same Jan. 17, 2012
8089777 Semiconductor device having semiconductor structure bodies on upper and lower surfaces thereof, and method of manufacturing the same Jan. 3, 2012
8084777 Light emitting diode source with protective barrier Dec. 27, 2011
8062929 Semiconductor device and method of stacking same size semiconductor die electrically connected through conductive via formed around periphery of the die Nov. 22, 2011
8053905 Compliant bonding structures for semiconductor devices Nov. 8, 2011
8044499 Wiring substrate, manufacturing method thereof, semiconductor device, and manufacturing method thereof Oct. 25, 2011
8039949 Ball grid array package having one or more stiffeners Oct. 18, 2011
8035211 Integrated circuit package system with support structure under wire-in-film adhesive Oct. 11, 2011
8026127 Integrated circuit package system with slotted die paddle and method of manufacture thereof Sep. 27, 2011

1 2 3










 
 
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