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Class Information
Number: 257/E23.002
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Details not otherwise provided for, e.g., protection against moisture (epo)
Description: This subclass is indented under subclass E23.001. This subclass is substantially the same in scope as ECLA classification H01L23/00V.

Patents under this class:
1 2 3 4 5 6 7 8 9

Patent Number Title Of Patent Date Issued
5223739 Plastic molded semiconductor device having waterproof cap Jun. 29, 1993
5196919 Use of a contamination shield during the manufacture of semiconductor packages Mar. 23, 1993
5173766 Semiconductor device package and method of making such a package Dec. 22, 1992
5173764 Semiconductor device having a particular lid means and encapsulant to reduce die stress Dec. 22, 1992
5153385 Transfer molded semiconductor package with improved adhesion Oct. 6, 1992
5045639 Pin grid array package Sep. 3, 1991
4982250 Mosture barrier for floating gate transistors Jan. 1, 1991
4961106 Metal packages having improved thermal dissipation Oct. 2, 1990
4866506 Plastic-sealed IC device of heat-resistant construction Sep. 12, 1989
4679308 Process for controlling mobile ion contamination in semiconductor devices Jul. 14, 1987
4603897 Vacuum pickup apparatus Aug. 5, 1986
4594770 Method of making semiconductor casing Jun. 17, 1986
4583109 Apparatus for compensating corrosion effects in integrated semiconductor circuits Apr. 15, 1986
4480262 Semiconductor casing Oct. 30, 1984
4279292 Charge coupled device temperature gradient and moisture regulator Jul. 21, 1981

1 2 3 4 5 6 7 8 9

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