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Class Information
Number: 257/E23.002
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Details not otherwise provided for, e.g., protection against moisture (epo)
Description: This subclass is indented under subclass E23.001. This subclass is substantially the same in scope as ECLA classification H01L23/00V.










Patents under this class:
1 2 3 4 5 6 7 8 9

Patent Number Title Of Patent Date Issued
5818094 Package for housing a semiconductor element Oct. 6, 1998
5814887 Semiconductor device and production method thereof Sep. 29, 1998
5808363 Semiconductor device and method of fabricating the same Sep. 15, 1998
5804869 Clamp disposed at edge of a dielectric structure in a semiconductor device and method of forming same Sep. 8, 1998
5793110 MOS transistor with good hot carrier resistance and low interface state density Aug. 11, 1998
5790220 Liquid crystal display and method of fabricating same with a black resin film covered an exposed portion of the wiring region on the outside of the sealing layer Aug. 4, 1998
5786625 Moisture resistant semiconductor device Jul. 28, 1998
5786638 Semiconductor device with moisture impervious film Jul. 28, 1998
5767446 Printed circuit board having epoxy barrier around a throughout slot and ball grid array semiconductor package Jun. 16, 1998
5760453 Moisture barrier layers for integrated circuit applications Jun. 2, 1998
5757064 Multlayer interconnection structure for semiconductor device May. 26, 1998
5742094 Sealed semiconductor chip Apr. 21, 1998
5721450 Moisture relief for chip carriers Feb. 24, 1998
5717255 Semiconductor device Feb. 10, 1998
5712206 Method of forming moisture barrier layers for integrated circuit applications Jan. 27, 1998
5657207 Alignment means for integrated circuit chips Aug. 12, 1997
5652459 Moisture guard ring for integrated circuit applications Jul. 29, 1997
5637919 Perimeter independent precision locating member Jun. 10, 1997
5576246 Personalized area leadframe coining or half etching for reduced mechanical stress at device edge Nov. 19, 1996
5572067 Sacrificial corner structures Nov. 5, 1996
5566051 Ultra high density integrated circuit packages method and apparatus Oct. 15, 1996
5561591 Multi-signal rail assembly with impedance control for a three-dimensional high density integrated circuit package Oct. 1, 1996
5550711 Ultra high density integrated circuit packages Aug. 27, 1996
5545921 Personalized area leadframe coining or half etching for reduced mechanical stress at device edge Aug. 13, 1996
5543664 Ultra high density integrated circuit package Aug. 6, 1996
5538924 Method of forming a moisture guard ring for integrated circuit applications Jul. 23, 1996
5538924 Method of forming a moisture guard ring for integrated circuit applications Jul. 23, 1996
5534728 Semiconductor device having a corrosion-resistant metal wiring layer Jul. 9, 1996
5499160 High density integrated circuit module with snap-on rail assemblies Mar. 12, 1996
5475920 Method of assembling ultra high density integrated circuit packages Dec. 19, 1995
5446620 Ultra high density integrated circuit packages Aug. 29, 1995
5420751 Ultra high density modular integrated circuit package May. 30, 1995
5412247 Protection and packaging system for semiconductor devices May. 2, 1995
5386342 Rigid backplane formed from a moisture resistant insulative material used to protect a semiconductor device Jan. 31, 1995
5377077 Ultra high density integrated circuit packages method and apparatus Dec. 27, 1994
5367766 Ultra high density integrated circuit packages method Nov. 29, 1994
5343076 Semiconductor device with an airtight space formed internally within a hollow package Aug. 30, 1994
5339216 Device and method for reducing thermal cycling in a semiconductor package Aug. 16, 1994
5300461 Process for fabricating sealed semiconductor chip using silicon nitride passivation film Apr. 5, 1994
5296738 Moisture relief for chip carrier Mar. 22, 1994
5296745 Semiconductor device having a moisture barrier around periphery of device Mar. 22, 1994
5294975 Laser alignment target for semiconductor integrated circuits Mar. 15, 1994
5291066 Moisture-proof electrical circuit high density interconnect module and method for making same Mar. 1, 1994
5284801 Methods of moisture protection in semiconductor devices utilizing polyimides for inter-metal dielectric Feb. 8, 1994
5279029 Ultra high density integrated circuit packages method Jan. 18, 1994
5270256 Method of forming a guard wall to reduce delamination effects Dec. 14, 1993
5270571 Three-dimensional package for semiconductor devices Dec. 14, 1993
5262671 Semiconductor device in which a peripheral potential barrier is established Nov. 16, 1993
5248848 Reflow compatible device package Sep. 28, 1993
5231036 Method of using a contamination shield during the manufacture of EPROM semiconductor package windows Jul. 27, 1993

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