Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Physics
Class Information
Number: 257/E23.002
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Details not otherwise provided for, e.g., protection against moisture (epo)
Description: This subclass is indented under subclass E23.001. This subclass is substantially the same in scope as ECLA classification H01L23/00V.










Patents under this class:
1 2 3 4 5 6 7 8 9

Patent Number Title Of Patent Date Issued
6242802 Moisture enhanced ball grid array package Jun. 5, 2001
6242799 Anisotropic stress buffer and semiconductor device using the same Jun. 5, 2001
6237682 Cooling module including a pressure relief mechanism May. 29, 2001
6221690 Semiconductor package and production method thereof Apr. 24, 2001
6215180 Dual-sided heat dissipating structure for integrated circuit package Apr. 10, 2001
6210994 Process for forming an edge structure to seal integrated electronic devices, and corresponding device Apr. 3, 2001
6207595 Laminate and method of manufacture thereof Mar. 27, 2001
6190926 Yield enhancement technique for integrated circuit processing to reduce effects of undesired dielectric moisture retention and subsequent hydrogen out-diffusion Feb. 20, 2001
6188124 Semiconductor arrangement preventing damage during contact processing Feb. 13, 2001
6168970 Ultra high density integrated circuit packages Jan. 2, 2001
6157084 Film carrier and semiconductor device using same Dec. 5, 2000
6144108 Semiconductor device and method of fabricating the same Nov. 7, 2000
6143592 MOS semiconductor device and method of fabricating the same Nov. 7, 2000
6130472 Moisture and ion barrier for protection of devices and interconnect structures Oct. 10, 2000
6120907 Data card comprising a laser recording medium and a thin glass layer Sep. 19, 2000
6121083 Semiconductor device and method of fabricating the same Sep. 19, 2000
6111301 Interconnection with integrated corrosion stop Aug. 29, 2000
6111320 Semiconductor device having a barrier film for preventing penetration of moisture Aug. 29, 2000
6091121 Semiconductor device and method for manufacturing the same Jul. 18, 2000
6087713 Plastic package, semiconductor device, and method of manufacturing plastic package Jul. 11, 2000
6080932 Semiconductor package assemblies with moisture vents Jun. 27, 2000
6066893 Contaminant resistant barriers to prevent outgassing May. 23, 2000
6057591 Process for forming an edge structure to seal integrated electronic devices, and corresponding device May. 2, 2000
6054755 Semiconductor package with improved moisture vapor relief function and method of fabricating the same Apr. 25, 2000
6048754 Method of manufacturing a semiconductor device with an airtight space formed internally within a hollow package Apr. 11, 2000
6049123 Ultra high density integrated circuit packages Apr. 11, 2000
6046102 Moisture barrier gap fill structure and method for making the same Apr. 4, 2000
6025262 Method of passivating semiconductor wafers Feb. 15, 2000
6025642 Ultra high density integrated circuit packages Feb. 15, 2000
6022762 Process for forming a morphological edge structure to seal integrated electronic devices Feb. 8, 2000
6014318 Resin-sealed type ball grid array IC package and manufacturing method thereof Jan. 11, 2000
6011308 Semiconductor device having a barrier film formed to prevent the entry of moisture and method of manufacturing the same Jan. 4, 2000
5994764 Semiconductor device Nov. 30, 1999
5990513 Yield enhancement technique for integrated circuit processing to reduce effects of undesired dielectric moisture retention and subsequent hydrogen out-diffusion Nov. 23, 1999
5986315 Guard wall to reduce delamination effects within a semiconductor die Nov. 16, 1999
5981880 Electronic device packages having glass free non conductive layers Nov. 9, 1999
5969408 Process for forming a morphological edge structure to seal integrated electronic devices, and corresponding device Oct. 19, 1999
5959353 Semiconductor device Sep. 28, 1999
5930593 Method for formating device on wafer without peeling Jul. 27, 1999
5902131 Dual-level metalization method for integrated circuit ferroelectric devices May. 11, 1999
5901043 Device and method for reducing thermal cycling in a semiconductor package May. 4, 1999
5892269 Semiconductor device including an intrusion film layer Apr. 6, 1999
5880518 Semiconductor device including a two-layer protective insulating layer Mar. 9, 1999
5880519 Moisture barrier gap fill structure and method for making the same Mar. 9, 1999
5866476 Methods for forming moisture blocking layers Feb. 2, 1999
5866946 Semiconductor device having a plug for diffusing hydrogen into a semiconductor substrate Feb. 2, 1999
5856705 Sealed semiconductor chip and process for fabricating sealed semiconductor chip Jan. 5, 1999
5849632 Method of passivating semiconductor wafers Dec. 15, 1998
5834850 Encapsulated semiconductor device having metal foil covering, and metal foil Nov. 10, 1998
5825068 Integrated circuits that include a barrier layer reducing hydrogen diffusion into a polysilicon resistor Oct. 20, 1998

1 2 3 4 5 6 7 8 9










 
 
  Recently Added Patents
Methods of forming integrated circuit packages
Thermal conductivity and phase transition heat transfer mechanism including optical element to be cooled by heat transfer of the mechanism
Semiconductor pressure sensor
Hydrogen generation device and fuel cell system
Opportunistic modem
Film, polarizing plate and display device, and method of manufacturing film
Combination of the application of antibodies for immunostimulation together with glucocorticoids
  Randomly Featured Patents
Method and system for tapping telephone conversations
Electronic vernier systems and methods
Drop down trailer
Derivatives of carbohydrates and compositions containing them
Training device and method for guiding a ball throwing movement
Apparatus for treating yarns
Process for doping two levels of a double poly bipolar transistor after formation of second poly layer
Roaster
Semiconductor memory structures
Methods and systems for automated generation of bills