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Class Information
Number: 257/E23.002
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Details not otherwise provided for, e.g., protection against moisture (epo)
Description: This subclass is indented under subclass E23.001. This subclass is substantially the same in scope as ECLA classification H01L23/00V.










Patents under this class:
1 2 3 4 5 6 7 8 9

Patent Number Title Of Patent Date Issued
6605865 Semiconductor package with optimized leadframe bonding strength Aug. 12, 2003
6596561 Method of manufacturing a semiconductor device using reinforcing patterns for ensuring mechanical strength during manufacture Jul. 22, 2003
6580155 Semiconductor device Jun. 17, 2003
6573604 Semiconductor device carrying memory and logic circuit on a chip and method of manufacturing the same Jun. 3, 2003
6563219 Passivation integrity improvements May. 13, 2003
6555924 Semiconductor package with flash preventing mechanism and fabrication method thereof Apr. 29, 2003
6551862 Semiconductor device and method of manufacturing the same Apr. 22, 2003
6541373 Manufacture method for semiconductor with small variation in MOS threshold voltage Apr. 1, 2003
6531766 Semiconductor package and production method thereof Mar. 11, 2003
6531344 High frequency gallium arsenide MMIC die coating method Mar. 11, 2003
6525398 Semiconductor device capable of preventing moisture-absorption of fuse area thereof Feb. 25, 2003
6518090 Semiconductor device and manufacturing method thereof Feb. 11, 2003
6515343 Metal-to-metal antifuse with non-conductive diffusion barrier Feb. 4, 2003
6509209 Method of forming a metal-to-metal antifuse with non-conductive diffusion barrier Jan. 21, 2003
6509650 Electronic device, and method of patterning a first layer Jan. 21, 2003
6503826 Semiconductor device and method for manufacturing the same Jan. 7, 2003
6504239 Semiconductor device having dummy pattern that relieves stress Jan. 7, 2003
6498089 Semiconductor integrated circuit device with moisture-proof ring and its manufacture method Dec. 24, 2002
6495879 Ferroelectric memory device having a protective layer Dec. 17, 2002
6492716 Seal ring structure for IC containing integrated digital/RF/analog circuits and functions Dec. 10, 2002
6486506 Flash memory with less susceptibility to charge gain and charge loss Nov. 26, 2002
6475328 Electronic component material containing pest repellent, electronic component using the same, and its manufacturing method Nov. 5, 2002
6462394 Device configured to avoid threshold voltage shift in a dielectric film Oct. 8, 2002
6462400 Chip outline band (COB) structure for integrated circuits Oct. 8, 2002
6455910 Cross guard-ring structure to protect the chip crack in low dielectric constant and copper process Sep. 24, 2002
6448630 Semiconductor device comprising a polish preventing pattern Sep. 10, 2002
6445062 Semiconductor device having a flip chip cavity with lower stress and method for forming same Sep. 3, 2002
6433417 Electronic component having improved soldering performance and adhesion properties of the lead wires Aug. 13, 2002
6429089 Semiconductor device and method of fabricating the same Aug. 6, 2002
6423566 Moisture and ion barrier for protection of devices and interconnect structures Jul. 23, 2002
6423999 Semiconductor device and capacitor with means to prevent deterioration due to hydrogen Jul. 23, 2002
6424051 Semiconductor device Jul. 23, 2002
6387387 Electronic component material containing pest repellent, electronic component using the same, and its manufacturing method May. 14, 2002
6373126 Method for reducing IC package delamination by use of internal baffles Apr. 16, 2002
6369453 Semiconductor wafer for measurement and recordation of impurities in semiconductor insulators Apr. 9, 2002
6358862 Passivation integrity improvements Mar. 19, 2002
6358780 Semiconductor package assemblies with moisture vents and methods of making same Mar. 19, 2002
6324756 Method and system for sealing the edge of a PBGA package Dec. 4, 2001
6325421 Authenticity attribute Dec. 4, 2001
6319849 Semiconductor device and a process for forming a protective insulating layer thereof Nov. 20, 2001
6309901 Use of glass laminate as a substrate in semiconductor devices Oct. 30, 2001
6287674 Laminate comprising a thin borosilicate glass substrate as a constituting layer Sep. 11, 2001
6274417 Method of forming a semiconductor device Aug. 14, 2001
6271594 Semiconductor device and method of manufacturing the same Aug. 7, 2001
6268090 Process for manufacturing semiconductor device and exposure mask Jul. 31, 2001
6268058 Security card comprising a thin glass layer Jul. 31, 2001
6261945 Crackstop and oxygen barrier for low-K dielectric integrated circuits Jul. 17, 2001
6258715 Process for low-k dielectric with dummy plugs Jul. 10, 2001
6255741 Semiconductor device with a protective sheet to affix a semiconductor chip Jul. 3, 2001
6249014 Hydrogen barrier encapsulation techniques for the control of hydrogen induced degradation of ferroelectric capacitors in conjunction with multilevel metal processing for non-volatile integrate Jun. 19, 2001

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