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Class Information
Number: 257/E23.002
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Details not otherwise provided for, e.g., protection against moisture (epo)
Description: This subclass is indented under subclass E23.001. This subclass is substantially the same in scope as ECLA classification H01L23/00V.










Patents under this class:
1 2 3 4 5 6 7 8 9

Patent Number Title Of Patent Date Issued
7009292 Package type semiconductor device Mar. 7, 2006
7002256 Semiconductor device having wiring patterns and dummy patterns covered with insulating layer Feb. 21, 2006
6998712 Semiconductor device and method for manufacturing the same Feb. 14, 2006
6984857 Hydrogen barrier for protecting ferroelectric capacitors in a semiconductor device and methods for fabricating the same Jan. 10, 2006
6979595 Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices Dec. 27, 2005
6972488 Semiconductor device in which a semiconductor chip mounted on a printed circuit is sealed with a molded resin Dec. 6, 2005
6958530 Rectification chip terminal structure Oct. 25, 2005
6949822 Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance Sep. 27, 2005
6940157 High frequency semiconductor module, high frequency semiconductor device and manufacturing method for the same Sep. 6, 2005
6940712 Electronic device substrate assembly with multilayer impermeable barrier and method of making Sep. 6, 2005
6919623 Hydrogen diffusion hybrid port and method of forming Jul. 19, 2005
6913953 Semiconductor device capable of preventing moisture absorption of fuse area thereof and method for manufacturing the fuse area Jul. 5, 2005
6903017 Integrated circuit metallization using a titanium/aluminum alloy Jun. 7, 2005
6893893 Method of preventing short circuits in magnetic film stacks May. 17, 2005
6888183 Manufacture method for semiconductor device with small variation in MOS threshold voltage May. 3, 2005
6882048 Lead frame and semiconductor package having a groove formed in the respective terminals for limiting a plating area Apr. 19, 2005
6879019 Guard ring of a combination wafer or singulated die Apr. 12, 2005
6876064 Semiconductor device having superior resistance to moisture Apr. 5, 2005
6872597 Method of manufacturing a semiconductor device and a semiconductor device Mar. 29, 2005
6873049 Near hermetic power chip on board device and manufacturing method therefor Mar. 29, 2005
6870265 Semiconductor device and manufacturing method thereof Mar. 22, 2005
6861344 Method of manufacturing a semiconductor integrated circuit device Mar. 1, 2005
6861754 Semiconductor device with anchor type seal ring Mar. 1, 2005
6833720 Electrical detection of dicing damage Dec. 21, 2004
6828637 Semiconductor memory devices having dummy active regions Dec. 7, 2004
6825132 Manufacturing method of semiconductor device including an insulation film on a conductive layer Nov. 30, 2004
6822170 Embedding resin and wiring substrate using the same Nov. 23, 2004
6809407 Semiconductor device Oct. 26, 2004
6806576 Passivation integrity improvements Oct. 19, 2004
6806518 Semiconductor memory devices having dummy active regions Oct. 19, 2004
6794732 Semiconductor device and method of manufacturing the same Sep. 21, 2004
6791182 Semiconductor device Sep. 14, 2004
6790694 High frequency semiconductor module, high frequency semiconductor device and manufacturing method for the same Sep. 14, 2004
6781064 Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same Aug. 24, 2004
6771487 Power electronics component with improved thermal properties Aug. 3, 2004
6764953 Electronic device, and method of patterning a first layer Jul. 20, 2004
6764899 Method for fabricating semiconductor device Jul. 20, 2004
6743524 Barrier layer for an article and method of making said barrier layer by expanding thermal plasma Jun. 1, 2004
6740940 Semiconductor memory devices having dummy active regions May. 25, 2004
6734567 Flip-chip device strengthened by substrate metal ring May. 11, 2004
6723583 Method of manufacturing a semiconductor device using a mold Apr. 20, 2004
6713859 Direct build-up layer on an encapsulated die package having a moisture barrier structure Mar. 30, 2004
6713344 Semiconductor device and method for manufacturing the same Mar. 30, 2004
6703701 Semiconductor device with integrated circuit elements of group III-V comprising means for preventing pollution by hydrogen Mar. 9, 2004
6693336 Intergrated circuit chip package with reduced parameter offsets Feb. 17, 2004
6683329 Semiconductor device with slot above guard ring Jan. 27, 2004
6646346 Integrated circuit metallization using a titanium/aluminum alloy Nov. 11, 2003
6635572 Method of substrate silicon removal for integrated circuit devices Oct. 21, 2003
6613586 HYDROGEN BARRIER ENCAPSULATION TECHNIQUES FOR THE CONTROL OF HYDROGEN INDUCED DEGRADATION OF FERROELECTRIC CAPACITORS IN CONJUNCTION WITH MULTILEVEL METAL PROCESSING FOR NON-VOLATILE INTEGRATE Sep. 2, 2003
6608372 Surface mountable chip type semiconductor device and manufacturing method Aug. 19, 2003

1 2 3 4 5 6 7 8 9










 
 
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