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Class Information
Number: 257/E23.002
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Details not otherwise provided for, e.g., protection against moisture (epo)
Description: This subclass is indented under subclass E23.001. This subclass is substantially the same in scope as ECLA classification H01L23/00V.










Patents under this class:
1 2 3 4 5 6 7 8 9

Patent Number Title Of Patent Date Issued
7683492 Semiconductor device Mar. 23, 2010
7675175 Semiconductor device having isolated pockets of insulation in conductive seal ring Mar. 9, 2010
7675171 Semiconductor package and fabricating method thereof Mar. 9, 2010
7671434 Electronic component, laser device, optical writing device and image forming apparatus Mar. 2, 2010
7667279 Semiconductor device Feb. 23, 2010
7663190 Tunable voltage isolation ground to ground ESD clamp Feb. 16, 2010
7642156 Three-dimensional flash memory cell Jan. 5, 2010
7635912 Semiconductor device Dec. 22, 2009
7629685 Semiconductor device package Dec. 8, 2009
7629689 Semiconductor integrated circuit having connection pads over active elements Dec. 8, 2009
7615845 Active shielding of conductors in MEMS devices Nov. 10, 2009
7608910 Semiconductor ESD device and methods of protecting a semiconductor device Oct. 27, 2009
7602065 Seal ring in semiconductor device Oct. 13, 2009
7573135 Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film Aug. 11, 2009
7566915 Guard ring extension to prevent reliability failures Jul. 28, 2009
7554184 Image sensor chip package Jun. 30, 2009
7550850 Semiconductor device Jun. 23, 2009
7547576 Solder wall structure in flip-chip technologies Jun. 16, 2009
7538045 Coating process to enable electrophoretic deposition May. 26, 2009
7528464 Semiconductor device and method for manufacturing the same May. 5, 2009
7504284 Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices Mar. 17, 2009
7495327 Chip stacking structure Feb. 24, 2009
7495254 Test structure and method for detecting and studying crystal lattice dislocation defects in integrated circuit devices Feb. 24, 2009
7453128 Semiconductor device and method for fabricating the same Nov. 18, 2008
7435993 High temperature, high voltage SiC void-less electronic package Oct. 14, 2008
7436047 Wafer having scribe lanes suitable for sawing process, reticle used in manufacturing the same, and method of manufacturing the same Oct. 14, 2008
7427803 Electromagnetic shielding using through-silicon vias Sep. 23, 2008
7411257 Semiconductor device having guard ring and manufacturing method thereof Aug. 12, 2008
7408259 Sheet to form a protective film for chips Aug. 5, 2008
7405459 Semiconductor device comprising porous film Jul. 29, 2008
7405455 Semiconductor constructions and transistor gates Jul. 29, 2008
7393716 Encapsulated organic semiconductor device and method Jul. 1, 2008
7390742 Method for producing a rewiring printed circuit board Jun. 24, 2008
7385277 Semiconductor chip and method of fabricating the same Jun. 10, 2008
7348594 Test structures and models for estimating the yield impact of dishing and/or voids Mar. 25, 2008
7307337 Resin-molded semiconductor device having posts with bumps and method for fabricating the same Dec. 11, 2007
7307350 Integrated circuit chip bonding sheet and integrated circuit package Dec. 11, 2007
7285862 Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film Oct. 23, 2007
7282776 Method and structure for coupling two microcircuits Oct. 16, 2007
7233045 Semiconductor device and system Jun. 19, 2007
7224056 Back-face and edge interconnects for lidded package May. 29, 2007
7151050 Method for fabricating electrical connection structure of circuit board Dec. 19, 2006
7112886 Packaging structure with a plurality of drill holes formed directly below an underfill layer Sep. 26, 2006
7091605 Highly moisture-sensitive electronic device element and method for fabrication Aug. 15, 2006
7091583 Method and structure for prevention leakage of substrate strip Aug. 15, 2006
7067923 Semiconductor device having hall-effect and manufacturing method thereof Jun. 27, 2006
7049685 Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices May. 23, 2006
7030476 Rectifier diode device Apr. 18, 2006
7019400 Semiconductor device having multilayer interconnection structure and method for manufacturing the device Mar. 28, 2006
7015069 Method of manufacturing a semiconductor device and a semiconductor device Mar. 21, 2006

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