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Class Information
Number: 257/E23.002
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Details not otherwise provided for, e.g., protection against moisture (epo)
Description: This subclass is indented under subclass E23.001. This subclass is substantially the same in scope as ECLA classification H01L23/00V.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615845 |
Active shielding of conductors in MEMS devices |
Nov. 10, 2009 |
| 7608910 |
Semiconductor ESD device and methods of protecting a semiconductor device |
Oct. 27, 2009 |
| 7602065 |
Seal ring in semiconductor device |
Oct. 13, 2009 |
| 7573135 |
Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film |
Aug. 11, 2009 |
| 7566915 |
Guard ring extension to prevent reliability failures |
Jul. 28, 2009 |
| 7554184 |
Image sensor chip package |
Jun. 30, 2009 |
| 7550850 |
Semiconductor device |
Jun. 23, 2009 |
| 7547576 |
Solder wall structure in flip-chip technologies |
Jun. 16, 2009 |
| 7538045 |
Coating process to enable electrophoretic deposition |
May. 26, 2009 |
| 7528464 |
Semiconductor device and method for manufacturing the same |
May. 5, 2009 |
| 7504284 |
Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices |
Mar. 17, 2009 |
| 7495327 |
Chip stacking structure |
Feb. 24, 2009 |
| 7495254 |
Test structure and method for detecting and studying crystal lattice dislocation defects in integrated circuit devices |
Feb. 24, 2009 |
| 7453128 |
Semiconductor device and method for fabricating the same |
Nov. 18, 2008 |
| 7436047 |
Wafer having scribe lanes suitable for sawing process, reticle used in manufacturing the same, and method of manufacturing the same |
Oct. 14, 2008 |
| 7435993 |
High temperature, high voltage SiC void-less electronic package |
Oct. 14, 2008 |
| 7427803 |
Electromagnetic shielding using through-silicon vias |
Sep. 23, 2008 |
| 7411257 |
Semiconductor device having guard ring and manufacturing method thereof |
Aug. 12, 2008 |
| 7408259 |
Sheet to form a protective film for chips |
Aug. 5, 2008 |
| 7405459 |
Semiconductor device comprising porous film |
Jul. 29, 2008 |
| 7405455 |
Semiconductor constructions and transistor gates |
Jul. 29, 2008 |
| 7393716 |
Encapsulated organic semiconductor device and method |
Jul. 1, 2008 |
| 7390742 |
Method for producing a rewiring printed circuit board |
Jun. 24, 2008 |
| 7385277 |
Semiconductor chip and method of fabricating the same |
Jun. 10, 2008 |
| 7348594 |
Test structures and models for estimating the yield impact of dishing and/or voids |
Mar. 25, 2008 |
| 7307337 |
Resin-molded semiconductor device having posts with bumps and method for fabricating the same |
Dec. 11, 2007 |
| 7307350 |
Integrated circuit chip bonding sheet and integrated circuit package |
Dec. 11, 2007 |
| 7285862 |
Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film |
Oct. 23, 2007 |
| 7282776 |
Method and structure for coupling two microcircuits |
Oct. 16, 2007 |
| 7233045 |
Semiconductor device and system |
Jun. 19, 2007 |
| 7224056 |
Back-face and edge interconnects for lidded package |
May. 29, 2007 |
| 7151050 |
Method for fabricating electrical connection structure of circuit board |
Dec. 19, 2006 |
| 7112886 |
Packaging structure with a plurality of drill holes formed directly below an underfill layer |
Sep. 26, 2006 |
| 7091583 |
Method and structure for prevention leakage of substrate strip |
Aug. 15, 2006 |
| 7091605 |
Highly moisture-sensitive electronic device element and method for fabrication |
Aug. 15, 2006 |
| 7067923 |
Semiconductor device having hall-effect and manufacturing method thereof |
Jun. 27, 2006 |
| 7049685 |
Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices |
May. 23, 2006 |
| 7030476 |
Rectifier diode device |
Apr. 18, 2006 |
| 7019400 |
Semiconductor device having multilayer interconnection structure and method for manufacturing the device |
Mar. 28, 2006 |
| 7015069 |
Method of manufacturing a semiconductor device and a semiconductor device |
Mar. 21, 2006 |
| 7009292 |
Package type semiconductor device |
Mar. 7, 2006 |
| 7002256 |
Semiconductor device having wiring patterns and dummy patterns covered with insulating layer |
Feb. 21, 2006 |
| 6998712 |
Semiconductor device and method for manufacturing the same |
Feb. 14, 2006 |
| 6984857 |
Hydrogen barrier for protecting ferroelectric capacitors in a semiconductor device and methods for fabricating the same |
Jan. 10, 2006 |
| 6979595 |
Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices |
Dec. 27, 2005 |
| 6972488 |
Semiconductor device in which a semiconductor chip mounted on a printed circuit is sealed with a molded resin |
Dec. 6, 2005 |
| 6958530 |
Rectification chip terminal structure |
Oct. 25, 2005 |
| 6949822 |
Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance |
Sep. 27, 2005 |
| 6940712 |
Electronic device substrate assembly with multilayer impermeable barrier and method of making |
Sep. 6, 2005 |
| 6940157 |
High frequency semiconductor module, high frequency semiconductor device and manufacturing method for the same |
Sep. 6, 2005 |
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