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Class Information
Number: 257/E23.002
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Details not otherwise provided for, e.g., protection against moisture (epo)
Description: This subclass is indented under subclass E23.001. This subclass is substantially the same in scope as ECLA classification H01L23/00V.

Patents under this class:
1 2 3 4 5 6 7 8 9

Patent Number Title Of Patent Date Issued
8710595 Semiconductor device Apr. 29, 2014
8692246 Leakage measurement structure having through silicon vias Apr. 8, 2014
8686533 Isolation structure Apr. 1, 2014
8680524 Method of arranging pads in semiconductor device, semiconductor memory device using the method, and processing system having mounted therein the semiconductor memory device Mar. 25, 2014
8659018 Semiconductor device and integrated semiconductor device Feb. 25, 2014
8648444 Wafer scribe line structure for improving IC reliability Feb. 11, 2014
8647892 Inline process control structures Feb. 11, 2014
8642446 Semiconductor device and method of forming protective structure around semiconductor die for localized planarization of insulating layer Feb. 4, 2014
8633590 Semiconductor device and method for manufacturing the same Jan. 21, 2014
8618618 Semiconductor device Dec. 31, 2013
8614110 Method for fabricating a dual-crystalline silicon suspension system using pre-fabricated cavities Dec. 24, 2013
8610156 Light emitting device package Dec. 17, 2013
8610282 Semiconductor device and method of manufacturing the same Dec. 17, 2013
8604515 Bidirectional protection component Dec. 10, 2013
8604592 Semiconductor device Dec. 10, 2013
8587089 Seal ring structure with polyimide layer adhesion Nov. 19, 2013
8575731 Semiconductor device with a balun Nov. 5, 2013
8564104 Passivation layer structure of semiconductor device and method for forming the same Oct. 22, 2013
8558243 Micro device array for transfer to a receiving substrate Oct. 15, 2013
8552523 Semiconductor device and method for manufacturing Oct. 8, 2013
8552436 Light emitting diode structure Oct. 8, 2013
8552536 Flexible integrated circuit device layers and processes Oct. 8, 2013
8546933 Semiconductor apparatus including resin case Oct. 1, 2013
8546928 Micromechanical housing comprising at least two cavities having different internal pressure and/or different gas compositions and method for the production thereof Oct. 1, 2013
8541851 MEMS package Sep. 24, 2013
8536710 Semiconductor device and manufacturing method thereof Sep. 17, 2013
8525167 Laminated chips package, semiconductor substrate and method of manufacturing the laminated chips package Sep. 3, 2013
8519480 Electrostatic discharge protection device Aug. 27, 2013
8513110 Processes and structures for beveled slope integrated circuits for interconnect fabrication Aug. 20, 2013
8508002 Semiconductor device Aug. 13, 2013
8502304 Semiconductor substrate and semiconductor chip Aug. 6, 2013
8492846 Stress-generating shallow trench isolation structure having dual composition Jul. 23, 2013
8487411 Multiple patterning using improved patternable low-.kappa. dielectric materials Jul. 16, 2013
8482072 Semiconductor die with integrated electro-static discharge device Jul. 9, 2013
8476740 Sheet for protecting surface of semiconductor wafer, semiconductor device manufacturing method and semiconductor wafer protection method using sheet Jul. 2, 2013
8461681 Layered structure for corrosion resistant interconnect contacts Jun. 11, 2013
8450846 Method and system for communicating via flip-chip die and package waveguides May. 28, 2013
8445961 Measuring floating body voltage in silicon-on-insulator (SOI) metal-oxide-semiconductor-field-effect-transistor (MOSFET) May. 21, 2013
8436466 Method and system for intra-chip waveguide communication May. 7, 2013
8436449 Chip package and method for fabricating the same May. 7, 2013
8436352 Semiconductor integrated circuit May. 7, 2013
8421073 Test structures for through silicon vias (TSVs) of three dimensional integrated circuit (3DIC) Apr. 16, 2013
8421224 Semiconductor chip having double bump structure and smart card including the same Apr. 16, 2013
8399956 Semiconductor devices and methods of manufacture thereof Mar. 19, 2013
8357931 Flip chip semiconductor die internal signal access system and method Jan. 22, 2013
8349746 Microelectronic structure including a low k dielectric and a method of controlling carbon distribution in the structure Jan. 8, 2013
8324688 Electrostatic discharge protection device for high voltage operation Dec. 4, 2012
8319286 System and method for input pin ESD protection with floating and/or biased polysilicon regions Nov. 27, 2012
8310062 Stacked semiconductor package Nov. 13, 2012
8299531 CMOS ESD clamp with input and separate output voltage terminal for ESD protection Oct. 30, 2012

1 2 3 4 5 6 7 8 9

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