Resources Contact Us Home
Browse by Category: Main > Physics
Class Information
Number: 257/E23.001
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo)
Description: This main group provides for preformed physical means to cover or protect semiconductor or other solid state devices, electrical interconnection of such devices and lead elements for facilitating electrical interconnection of the chips or dies via intermediate (e.g., jumper) connections to other devices or components, and marks applied to chips or dies such as test patterns or alignment marks. This subclass is substantially the same in scope as ECLA classification H01L23/00.

Sub-classes under this class:

Class Number Class Name Patents
257/E23.01 Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) 605
257/E23.141 Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) 551
257/E23.08 Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) 399
257/E23.18 Containers; seals (epo) 89
257/E23.002 Details not otherwise provided for, e.g., protection against moisture (epo) 414
257/E23.116 Encapsulations, e.g., encapsulating layers, coatings, e.g., for protection (epo) 241
257/E23.135 Fillings or auxiliary members in containers or encapsulations, e.g., centering rings (epo) 260
257/E23.179 Marks applied to semiconductor devices or parts, e.g., registration marks, test patterns, alignment structures, wafer maps (epo) 1,492
257/E23.003 Mountings, e.g., nondetachable insulating substrates (epo) 124
257/E23.194 Protection against mechanical damage (epo) 305
257/E23.114 Protection against radiation, e.g., light, electromagnetic waves (epo) 803

Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8710544 Isolated SCR ESD device Apr. 29, 2014
8703539 Multiple die packaging interposer structure and method Apr. 22, 2014
8703542 Wafer-level packaging mechanisms Apr. 22, 2014
8704353 Thermal management of stacked semiconductor chips with electrically non-functional interconnects Apr. 22, 2014
8704365 Integrated circuit packaging system having a cavity Apr. 22, 2014
8685796 Electronic device and method of manufacturing the same Apr. 1, 2014
8680662 Wafer level edge stacking Mar. 25, 2014
8680551 High power ultraviolet light sources and method of fabricating the same Mar. 25, 2014
8680666 Bond wireless power module with double-sided single device cooling and immersion bath cooling Mar. 25, 2014
8673700 Superjunction structures for power devices and methods of manufacture Mar. 18, 2014
8647976 Semiconductor package having test pads on top and bottom substrate surfaces and method of testing same Feb. 11, 2014
8648472 Semiconductor device Feb. 11, 2014
8633520 Semiconductor device Jan. 21, 2014
8624620 Test system and write wafer Jan. 7, 2014
8618541 Semiconductor apparatus Dec. 31, 2013
8618669 Combination substrate Dec. 31, 2013
8610266 Semiconductor device for radio frequency applications and method for making the same Dec. 17, 2013
8604574 Transparent photodetector Dec. 10, 2013
8597964 Manufacturing method of LED package structure Dec. 3, 2013
8592983 Method of integrating a plurality of benzocyclobutene layers with a substrate and an associated device Nov. 26, 2013
8587105 Semiconductor device Nov. 19, 2013
8574965 Semiconductor chip device with liquid thermal interface material Nov. 5, 2013
8569870 Integrated circuit packaging system with shielding spacer and method of manufacture thereof Oct. 29, 2013
8546926 Power converter Oct. 1, 2013
8546950 Semiconductor package and manufacturing method thereof Oct. 1, 2013
8541873 Microelectronic packages having cavities for receiving microelectronic elements Sep. 24, 2013
8541874 Semiconductor device Sep. 24, 2013
8536694 Semiconductor device Sep. 17, 2013
8535546 Method of manufacturing multilayer wiring substrate Sep. 17, 2013
8531034 Semiconductor package and package on package having the same Sep. 10, 2013
8525328 Power device package structure Sep. 3, 2013
8513821 Overlay mark assistant feature Aug. 20, 2013
8508031 Electronic device and method of producing the same Aug. 13, 2013
8497586 Package module structure for high power device with metal substrate and method of manufacturing the same Jul. 30, 2013
8497572 Semiconductor module and method of manufacturing the same Jul. 30, 2013
8497148 MEMS devices and methods of forming same Jul. 30, 2013
8487372 Trench MOSFET layout with trenched floating gates and trenched channel stop gates in termination Jul. 16, 2013
8487448 Method for producing chip packages, and chip package produced in this way Jul. 16, 2013
8476739 Graphene grown substrate and electronic/photonic integrated circuits using same Jul. 2, 2013
8466539 MRAM device and method of assembling same Jun. 18, 2013
8466551 Semiconductor device Jun. 18, 2013
8461671 Miniature packaging for discrete circuit components Jun. 11, 2013
8455302 Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device Jun. 4, 2013
8455996 Wafer level packaging method and a packaging structure using thereof Jun. 4, 2013
8456000 Semiconductor module and an electronic system including the same Jun. 4, 2013
8420410 Techniques providing fiducial markers for failure analysis Apr. 16, 2013
8410594 Inter-stacking module system Apr. 2, 2013
8410610 Connecting terminals with conductive terminal-forming members having terminal portions extending in different directions Apr. 2, 2013
8404522 Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device Mar. 26, 2013
8405078 Test device and a semiconductor integrated circuit device Mar. 26, 2013

1 2 3 4 5 6 7

  Recently Added Patents
PVD coated tool
Method for delivering a volatile material
Zero-copy network and file offload for web and application servers
Determination and presentation of package pricing offers in response to customer interest in a product
(Meth)acrylic resin composition, imidized (meth)acrylic resin composition, and film obtained by molding them
Method and apparatus for controlling the use of data stored on a media sample
Subscribing to content
  Randomly Featured Patents
Electronic device fabrication
Pre-fabricated dome house
Coaxial spray nozzle injector
Catalyst for production of a polyurethane resin and method for producing a polyurethane resin
Multi-frame videotext recognition
Remote control signal processing circuit for a microcomputer
Optical device for generating pulsed light
Process for production of cephalosporins
Expansible table
Semiconductor memory and method for driving the same