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Class Information
Number: 257/E23.001
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo)
Description: This main group provides for preformed physical means to cover or protect semiconductor or other solid state devices, electrical interconnection of such devices and lead elements for facilitating electrical interconnection of the chips or dies via intermediate (e.g., jumper) connections to other devices or components, and marks applied to chips or dies such as test patterns or alignment marks. This subclass is substantially the same in scope as ECLA classification H01L23/00.
Sub-classes under this class:
| Class Number |
Class Name |
Patents |
| 257/E23.01 |
Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) |
161 |
| 257/E23.141 |
Arrangements for conducting electric current within device in operation from one component to another, interconnections, e.g., wires, lead frames (epo) |
155 |
| 257/E23.08 |
Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) |
243 |
| 257/E23.18 |
Containers; seals (epo) |
18 |
| 257/E23.002 |
Details not otherwise provided for, e.g., protection against moisture (epo) |
254 |
| 257/E23.116 |
Encapsulations, e.g., encapsulating layers, coatings, e.g., for protection (epo) |
62 |
| 257/E23.135 |
Fillings or auxiliary members in containers or encapsulations, e.g., centering rings (epo) |
236 |
| 257/E23.179 |
Marks applied to semiconductor devices or parts, e.g., registration marks, test patterns, alignment structures, wafer maps (epo) |
1,198 |
| 257/E23.003 |
Mountings, e.g., nondetachable insulating substrates (epo) |
43 |
| 257/E23.194 |
Protection against mechanical damage (epo) |
212 |
| 257/E23.114 |
Protection against radiation, e.g., light, electromagnetic waves (epo) |
641 |
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618837 |
Method for fabricating high aspect ratio MEMS device with integrated circuit on the same substrate using post-CMOS process |
Nov. 17, 2009 |
| 7619304 |
Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof |
Nov. 17, 2009 |
| 7615842 |
Inductor integrated chip |
Nov. 10, 2009 |
| 7612443 |
Inter-chip communication |
Nov. 3, 2009 |
| 7602052 |
Semiconductor device |
Oct. 13, 2009 |
| 7595220 |
Image sensor package and fabrication method thereof |
Sep. 29, 2009 |
| 7582958 |
Semiconductor package |
Sep. 1, 2009 |
| 7572671 |
Stacked module systems and methods |
Aug. 11, 2009 |
| 7573125 |
Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods |
Aug. 11, 2009 |
| 7569411 |
Metal MEMS devices and methods of making same |
Aug. 4, 2009 |
| 7566632 |
Lock and key structure for three-dimensional chip connection and process thereof |
Jul. 28, 2009 |
| 7564125 |
Electronic array and methods for fabricating same |
Jul. 21, 2009 |
| 7550843 |
Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member |
Jun. 23, 2009 |
| 7545017 |
Wafer level package for surface acoustic wave device and fabrication method thereof |
Jun. 9, 2009 |
| 7528005 |
Method of manufacturing chip size package semiconductor device without intermediate substrate |
May. 5, 2009 |
| 7524753 |
Semiconductor device having through electrode and method of manufacturing the same |
Apr. 28, 2009 |
| 7524754 |
Interconnect shunt used for current distribution and reliability redundancy |
Apr. 28, 2009 |
| 7521283 |
Manufacturing method of chip integrated substrate |
Apr. 21, 2009 |
| 7521289 |
Package having dummy package substrate and method of fabricating the same |
Apr. 21, 2009 |
| 7518227 |
Multiple die stack apparatus employing T-shaped interposer elements |
Apr. 14, 2009 |
| 7514793 |
Metal interconnection lines of semiconductor devices and methods of forming the same |
Apr. 7, 2009 |
| 7514291 |
Methods relating to singulating semiconductor wafers and wafer scale assemblies |
Apr. 7, 2009 |
| 7508052 |
Crack protection for silicon die |
Mar. 24, 2009 |
| 7479407 |
Digital and RF system and method therefor |
Jan. 20, 2009 |
| 7479693 |
Arrangement of conductive connectors in a power semiconductor device |
Jan. 20, 2009 |
| 7473992 |
Multi-layer interconnection circuit module and manufacturing method thereof |
Jan. 6, 2009 |
| 7468549 |
Method for producing a package for an electronic circuit and a substrate for a package |
Dec. 23, 2008 |
| 7449752 |
Post passivation interconnection schemes on top of the IC chips |
Nov. 11, 2008 |
| 7442576 |
Placement of absorbing material in a semiconductor device |
Oct. 28, 2008 |
| 7436047 |
Wafer having scribe lanes suitable for sawing process, reticle used in manufacturing the same, and method of manufacturing the same |
Oct. 14, 2008 |
| 7429797 |
Electronic device and carrier substrate |
Sep. 30, 2008 |
| 7425462 |
Methods relating to the reconstruction of semiconductor wafers for wafer-level processing |
Sep. 16, 2008 |
| 7420267 |
Image sensor assembly and method for fabricating the same |
Sep. 2, 2008 |
| 7417324 |
Semiconductor device and method for manufacturing the same |
Aug. 26, 2008 |
| 7417309 |
Circuit device and portable device with symmetrical arrangement |
Aug. 26, 2008 |
| 7416910 |
Pyramid socket suspension |
Aug. 26, 2008 |
| 7411304 |
Semiconductor interconnect having conductive spring contacts |
Aug. 12, 2008 |
| 7408251 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET |
Aug. 5, 2008 |
| 7405474 |
Low cost thermally enhanced semiconductor package |
Jul. 29, 2008 |
| 7400046 |
Semiconductor device with guard rings that are formed in each of the plural wiring layers |
Jul. 15, 2008 |
| 7387913 |
3D optoelectronic micro system |
Jun. 17, 2008 |
| 7378721 |
Chip on lead frame for small package speed sensor |
May. 27, 2008 |
| 7378727 |
Memory device and a method of forming a memory device |
May. 27, 2008 |
| 7378748 |
Solid-state imaging device and method for manufacturing the same |
May. 27, 2008 |
| 7372135 |
Multi-chip image sensor module |
May. 13, 2008 |
| 7372142 |
Vertical conduction power electronic device package and corresponding assembling method |
May. 13, 2008 |
| 7368749 |
Method of detecting misalignment of ion implantation area |
May. 6, 2008 |
| 7368809 |
Pillar grid array package |
May. 6, 2008 |
| 7365429 |
Semiconductor device and method for manufacturing the same |
Apr. 29, 2008 |
| 7348210 |
Post bump passivation for soft error protection |
Mar. 25, 2008 |
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