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Class Information
Number: 257/E21.705
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Assembly of devices consisting of solid-state components formed in or on a common substrate; assembly of integrated circuit devices (epo)
Description: This subclass is indented under subclass E21.532. This subclass is substantially the same in scope as ECLA classification H01L21/98.

Patents under this class:
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Patent Number Title Of Patent Date Issued
5614277 Monolithic electronic modules--fabrication and structures Mar. 25, 1997
5612513 Article and method of manufacturing an enclosed electrical circuit using an encapsulant Mar. 18, 1997
5609772 Cube maskless lead open process using chemical mechanical polish/lead-tip expose process Mar. 11, 1997
5605662 Active programmable electronic devices for molecular biological analysis and diagnostics Feb. 25, 1997
5596226 Semiconductor chip having a chip metal layer and a transfer metal and corresponding electronic module Jan. 21, 1997
5591678 Process of manufacturing a microelectric device using a removable support substrate and etch-stop Jan. 7, 1997
5592018 Membrane dielectric isolation IC fabrication Jan. 7, 1997
5592007 Membrane dielectric isolation transistor fabrication Jan. 7, 1997
5588205 Method of manufacturing a high density integrated circuit module having complex electrical interconnect rails Dec. 31, 1996
5583335 Method of making an eye tracking system having an active matrix display Dec. 10, 1996
5581877 Method of fabrication of a circuit board adapted to receive a single in-line module Dec. 10, 1996
5580687 Contact stepper printed lithography method Dec. 3, 1996
5571741 Membrane dielectric isolation IC fabrication Nov. 5, 1996
5567653 Process for aligning etch masks on an integrated circuit surface using electromagnetic energy Oct. 22, 1996
5567654 Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging Oct. 22, 1996
5568617 Processor element having a plurality of processors which communicate with each other and selectively use a common bus Oct. 22, 1996
5564181 Method of fabricating a laminated substrate assembly chips-first multichip module Oct. 15, 1996
5563084 Method of making a three-dimensional integrated circuit Oct. 8, 1996
5561071 DNA and DNA technology for the construction of networks to be used in chip construction and chip production (DNA-chips) Oct. 1, 1996
5557120 Wafer joined optoelectronic integrated circuits Sep. 17, 1996
5547906 Methods for producing integrated circuit devices Aug. 20, 1996
5545281 Method of bonding circuit boards Aug. 13, 1996
5545291 Method for fabricating self-assembling microstructures Aug. 13, 1996
5539976 System for manufacture of hybrid integrated circuit Jul. 30, 1996
5539550 Liquid crystal display having adhered circuit tiles Jul. 23, 1996
5537738 Methods of mechanical and electrical substrate connection Jul. 23, 1996
5533664 Method of manufacturing a semiconductor device Jul. 9, 1996
5532519 Cube wireability enhancement with chip-to-chip alignment and thickness control Jul. 2, 1996
5532518 Electrical connect and method of fabrication for semiconductor cube technology Jul. 2, 1996
5528825 Method of manufacture of hybrid integrated circuit Jun. 25, 1996
5529950 Method for manufacturing a cubically integrated circuit arrangement Jun. 25, 1996
5521434 Semiconductor chip and electronic module with integrated surface interconnects/components May. 28, 1996
5517754 Fabrication processes for monolithic electronic modules May. 21, 1996
5517057 Electronic modules with interconnected surface metallization layers May. 14, 1996
5510273 Process of mounting semiconductor chips in a full-width-array image Apr. 23, 1996
5499124 Polysilicon transistors formed on an insulation layer which is adjacent to a liquid crystal material Mar. 12, 1996
5489554 Method of making a 3-dimensional circuit assembly having electrical contacts that extend through the IC layer Feb. 6, 1996
5478781 Polyimide-insulated cube package of stacked semiconductor device chips Dec. 26, 1995
5477065 Lateral thin film thyristor with bevel Dec. 19, 1995
5472914 Wafer joined optoelectronic integrated circuits and method Dec. 5, 1995
5466634 Electronic modules with interconnected surface metallization layers and fabrication methods therefore Nov. 14, 1995
5466634 Electronic modules with interconnected surface metallization layers and fabrication methods therefore Nov. 14, 1995
5455455 Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby Oct. 3, 1995
5453405 Method of making light emitting diode bars and arrays Sep. 26, 1995
5446314 Low profile metal-ceramic-metal packaging Aug. 29, 1995
5432318 Apparatus for segmenting stacked IC chips Jul. 11, 1995
5428885 Method of making a multilayer hybrid circuit Jul. 4, 1995
5427638 Low temperature reaction bonding Jun. 27, 1995
5423119 Method for manufacturing a hybrid circuit charge-coupled device image sensor Jun. 13, 1995
5419806 Method for manufacturing a three-dimensional circuit apparatus May. 30, 1995

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