| |
 |
|
Class Information
Number: 257/E21.705
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Assembly of devices consisting of solid-state components formed in or on a common substrate; assembly of integrated circuit devices (epo)
Description: This subclass is indented under subclass E21.532. This subclass is substantially the same in scope as ECLA classification H01L21/98.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7582499 |
Photo sensor and a method for manufacturing thereof |
Sep. 1, 2009 |
| 7575948 |
Method for operating photosensitive device |
Aug. 18, 2009 |
| 7550833 |
Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereof |
Jun. 23, 2009 |
| 7545047 |
Semiconductor device with a wiring substrate and method for producing the same |
Jun. 9, 2009 |
| 7528053 |
Three-dimensional package and method of making the same |
May. 5, 2009 |
| 7521784 |
System for coupling wire to semiconductor region |
Apr. 21, 2009 |
| 7521349 |
Fundamental cell, semiconductor integrated circuit device, wiring method and wiring apparatus |
Apr. 21, 2009 |
| 7521267 |
Thermal inkjet printhead processing with silicon etching |
Apr. 21, 2009 |
| 7517713 |
Solid-state image sensor and method for manufacturing thereof as well as semiconductor device and method for manufacturing thereof |
Apr. 14, 2009 |
| 7518223 |
Semiconductor devices and semiconductor device assemblies including a nonconfluent spacer layer |
Apr. 14, 2009 |
| 7514276 |
Aligning stacked chips using resistance assistance |
Apr. 7, 2009 |
| 7510900 |
Methods of forming a double pinned photodiode |
Mar. 31, 2009 |
| 7491625 |
Gang flipping for IC packaging |
Feb. 17, 2009 |
| 7491579 |
Composable system-in-package integrated circuits and process of composing the same |
Feb. 17, 2009 |
| 7473586 |
Method of forming flip-chip bump carrier type package |
Jan. 6, 2009 |
| 7462517 |
Electro-optical device and semiconductor circuit |
Dec. 9, 2008 |
| 7435626 |
Rearrangement sheet, semiconductor device and method of manufacturing thereof |
Oct. 14, 2008 |
| 7422914 |
Fabrication method of semiconductor integrated circuit device |
Sep. 9, 2008 |
| 7396775 |
Method for manufacturing semiconductor device |
Jul. 8, 2008 |
| 7341890 |
Circuit board with built-in electronic component and method for manufacturing the same |
Mar. 11, 2008 |
| 7332736 |
Article comprising gated field emission structures with centralized nanowires and method for making the same |
Feb. 19, 2008 |
| 7309907 |
Semiconductor device card methods of initializing checking the authenticity and the identity thereof |
Dec. 18, 2007 |
| 7303984 |
Semiconductor substrate structure and processing method thereof |
Dec. 4, 2007 |
| 7297561 |
Pattern for improved visual inspection of semiconductor devices |
Nov. 20, 2007 |
| 7294531 |
Wafer level chip stack method |
Nov. 13, 2007 |
| 7291519 |
Methods of forming transistor constructions |
Nov. 6, 2007 |
| 7253091 |
Process for assembling three-dimensional systems on a chip and structure thus obtained |
Aug. 7, 2007 |
| 7242099 |
Chip package with multiple chips connected by bumps |
Jul. 10, 2007 |
| 7217595 |
Sealed three dimensional metal bonded integrated circuits |
May. 15, 2007 |
| 7214568 |
Semiconductor device configured for reducing post-fabrication damage |
May. 8, 2007 |
| 7199449 |
Wafer backside removal to complete through-holes and provide wafer singulation during the formation of a semiconductor device |
Apr. 3, 2007 |
| 7196466 |
Organic Electroluminescence device suppressing brightness unevenness |
Mar. 27, 2007 |
| 7176072 |
Strained silicon devices transfer to glass for display applications |
Feb. 13, 2007 |
| 7074696 |
Semiconductor circuit module and method for fabricating semiconductor circuit modules |
Jul. 11, 2006 |
| 7070851 |
Web process interconnect in electronic assemblies |
Jul. 4, 2006 |
| 7067338 |
Method of manufacturing a display device including forming electric connections on a substrate, conductor patterns on a second substrate and coupling the connections |
Jun. 27, 2006 |
| 7067926 |
Semiconductor chip and method for manufacturing the same |
Jun. 27, 2006 |
| 7060528 |
Method for mounting a semiconductor element to an interposer by compression bonding |
Jun. 13, 2006 |
| 7060224 |
Methods for the electronic, homogeneous assembly and fabrication of devices |
Jun. 13, 2006 |
| 7060526 |
Wafer level methods for fabricating multi-dice chip scale semiconductor components |
Jun. 13, 2006 |
| 7056813 |
Methods of forming backside connections on a wafer stack |
Jun. 6, 2006 |
| 7056810 |
Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance |
Jun. 6, 2006 |
| 7049697 |
Process for making fine pitch connections between devices and structure made by the process |
May. 23, 2006 |
| 7049528 |
Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module |
May. 23, 2006 |
| 7045446 |
Semiconductor device fabrication method |
May. 16, 2006 |
| 7045443 |
Method for manufacturing semiconductor device, semiconductor device, circuit board, and electronic apparatus |
May. 16, 2006 |
| 7045390 |
Stacked die package |
May. 16, 2006 |
| 7042105 |
Methods for dicing wafer stacks to provide access to interior structures |
May. 9, 2006 |
| 7041516 |
Multi chip module assembly |
May. 9, 2006 |
| 7037760 |
Fabrication method of semiconductor integrated circuit device |
May. 2, 2006 |
|
|
|
