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Class Information
Number: 257/E21.705
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Assembly of devices consisting of solid-state components formed in or on a common substrate; assembly of integrated circuit devices (epo)
Description: This subclass is indented under subclass E21.532. This subclass is substantially the same in scope as ECLA classification H01L21/98.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8664755 Power module package and method for manufacturing the same Mar. 4, 2014
8586465 Through silicon via dies and packages Nov. 19, 2013
8586983 Semiconductor chip embedded with a test circuit Nov. 19, 2013
8587088 Side-mounted controller and methods for making the same Nov. 19, 2013
8580596 Front end micro cavity Nov. 12, 2013
8546193 Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure Oct. 1, 2013
8525278 MEMS device having chip scale packaging Sep. 3, 2013
8518796 Semiconductor die connection system and method Aug. 27, 2013
8476111 Integrated circuit packaging system with intra substrate die and method of manufacture thereof Jul. 2, 2013
8471376 Integrated circuit packaging configurations Jun. 25, 2013
8470642 High density chip packages, methods of forming, and systems including same Jun. 25, 2013
8435835 Semiconductor device and method of forming base leads from base substrate as standoff for stacking semiconductor die May. 7, 2013
8436463 Packaging substrate structure with electronic component embedded therein and method for manufacture of the same May. 7, 2013
8409926 Semiconductor device and method of forming insulating layer around semiconductor die Apr. 2, 2013
8394672 Method of manufacturing and assembling semiconductor chips with offset pads Mar. 12, 2013
8384231 Method of forming a semiconductor die Feb. 26, 2013
8378481 Semiconductor module with micro-buffers Feb. 19, 2013
8372689 Wafer-level semiconductor device packages with three-dimensional fan-out and manufacturing methods thereof Feb. 12, 2013
8368195 Semiconductor device including arrangement to control connection height and alignment between a plurity of stacked semiconductor chips Feb. 5, 2013
8362602 Layered chip package and method of manufacturing same Jan. 29, 2013
8349648 Semiconductor device and method of forming RF FEM with IC filter and IPD filter over substrate Jan. 8, 2013
8350358 Techniques for placement of active and passive devices within a chip Jan. 8, 2013
8283208 Method and apparatus for fabricating integrated circuit device using self-organizing function Oct. 9, 2012
8283769 Modular low stress package technology Oct. 9, 2012
8264075 Stacked-die package including substrate-ground coupling Sep. 11, 2012
8247845 Electrostatic discharge (ESD) protection circuit placement in semiconductor devices Aug. 21, 2012
8222723 Electric module having a conductive pattern layer Jul. 17, 2012
8207607 Semiconductor device with resin mold Jun. 26, 2012
8193092 Semiconductor devices including a through-substrate conductive member with an exposed end and methods of manufacturing such semiconductor devices Jun. 5, 2012
8183696 Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads May. 22, 2012
8183678 Semiconductor device having an interposer May. 22, 2012
8168471 Semiconductor device and manufacturing method of a semiconductor device May. 1, 2012
8163596 Stackable electronic package and method of making same Apr. 24, 2012
8159075 Semiconductor chip stack and manufacturing method thereof Apr. 17, 2012
8148790 Thin-film lid MEMS devices and methods Apr. 3, 2012
8133823 Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate Mar. 13, 2012
8129255 Firm, insulating and electrically conducting connection of processed semiconductor wafers Mar. 6, 2012
8115267 Semiconductor device and fabrication method of the same Feb. 14, 2012
8110930 Die backside metallization and surface activated bonding for stacked die packages Feb. 7, 2012
8097491 Chip structure having redistribution layer and fabrication method thereof Jan. 17, 2012
8093718 Chip structure and stacked structure of chips Jan. 10, 2012
8088645 3D smart power module Jan. 3, 2012
8067816 Techniques for placement of active and passive devices within a chip Nov. 29, 2011
8039304 Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structures Oct. 18, 2011
8039305 Method for bonding semiconductor wafers and method for manufacturing semiconductor device Oct. 18, 2011
8021923 Semiconductor package having through-hole vias on saw streets formed with partial saw Sep. 20, 2011
8017501 Semiconductor package having through-hole vias on saw streets formed with partial saw Sep. 13, 2011
7998792 Semiconductor device assemblies, electronic devices including the same and assembly methods Aug. 16, 2011
7994041 Method of manufacturing stacked semiconductor package using improved technique of forming through via Aug. 9, 2011
7981788 Semiconductor device and a manufacturing method of the same Jul. 19, 2011

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