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Class Information
Number: 257/E21.656
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components or integrated circuits formed in, or on, common substrate (epo) > With subsequent division of substrate into plural individual devices (epo) > To produce devices each consisting of plurality of components, e.g., integrated circuits (epo) > Substrate being semiconductor, using silicon technology (epo) > Field-effect technology (epo) > Mis technology (epo) > Dynamic random access memory structures (dram) (epo) > Characterized by type of capacitor (epo) > Characterized by data lines (epo)
Description: This subclass is indented under subclass E21.646. This subclass is substantially the same in scope as ECLA classification H01L21/8242D.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7074669 |
Semiconductor integrated circuit device with capacitor of crown structure and method of manufacturing the same |
Jul. 11, 2006 |
| 7057224 |
Semiconductor memory having an arrangement of memory cells |
Jun. 6, 2006 |
| 7002866 |
Semiconductor memory device |
Feb. 21, 2006 |
| 6977421 |
Semiconductor constructions |
Dec. 20, 2005 |
| 6974993 |
Double-sided capacitor structure for a semiconductor device and a method for forming the structure |
Dec. 13, 2005 |
| 6974987 |
Semiconductor device |
Dec. 13, 2005 |
| 6965140 |
Semiconductor device including storage capacitor |
Nov. 15, 2005 |
| 6958505 |
Integrated circuit including active components and at least one passive component associated fabrication method |
Oct. 25, 2005 |
| 6955959 |
Method of making a memory structure having a multilayered contact and a storage capacitor with a composite dielectric layer of crystalized niobium pentoxide and tantalum pentoxide films |
Oct. 18, 2005 |
| 6949429 |
Semiconductor memory device and method for manufacturing the same |
Sep. 27, 2005 |
| 6943076 |
Semiconductor device and method of manufacturing the same |
Sep. 13, 2005 |
| 6934206 |
Test structure for detecting bridging of DRAM capacitors |
Aug. 23, 2005 |
| 6930324 |
Device architecture and process for improved vertical memory arrays |
Aug. 16, 2005 |
| 6924193 |
Capacitor |
Aug. 2, 2005 |
| 6900546 |
Semiconductor memory device and method for manufacturing the same |
May. 31, 2005 |
| 6898109 |
Semiconductor memory device in which bit lines connected to dynamic memory cells extend left and right of sense amplifier column |
May. 24, 2005 |
| 6893915 |
Semiconductor device having barrier layer between ruthenium layer and metal layer and method for manufacturing the same |
May. 17, 2005 |
| 6887720 |
Ferroelectric memory device and method of forming the same |
May. 3, 2005 |
| 6852628 |
Method of insulating interconnects, and memory cell array with insulated interconnects |
Feb. 8, 2005 |
| 6849387 |
Method for integrating copper process and MIM capacitor for embedded DRAM |
Feb. 1, 2005 |
| 6833577 |
Semiconductor device |
Dec. 21, 2004 |
| 6826069 |
Interleaved wordline architecture |
Nov. 30, 2004 |
| 6806123 |
Methods of forming isolation regions associated with semiconductor constructions |
Oct. 19, 2004 |
| 6794247 |
Method of fabricating a semiconductor memory device having resistor |
Sep. 21, 2004 |
| 6791132 |
Memory semiconductor device with reduced sense amplifier area |
Sep. 14, 2004 |
| 6790725 |
Double-sided capacitor structure for a semiconductor device and a method for forming the structure |
Sep. 14, 2004 |
| 6787472 |
Utilization of disappearing silicon hard mask for fabrication of semiconductor structures |
Sep. 7, 2004 |
| 6788552 |
Method and apparatus for reducing substrate bias voltage drop |
Sep. 7, 2004 |
| 6784026 |
Microelectronic die including low RC under-layer interconnects |
Aug. 31, 2004 |
| 6781181 |
Layout of a folded bitline DRAM with a borderless bitline |
Aug. 24, 2004 |
| 6777735 |
Semiconductor memory device having a metal plug or a landing pad |
Aug. 17, 2004 |
| 6770973 |
Semiconductor apparatus including a multi-layer wiring configuration and manufacturing method therefor |
Aug. 3, 2004 |
| 6770930 |
Semiconductor device having MIM structure capacitor |
Aug. 3, 2004 |
| 6768663 |
Semiconductor device array having dense memory cell array and hierarchical bit line scheme |
Jul. 27, 2004 |
| 6734060 |
Semiconductor integrated circuit device and process for manufacturing |
May. 11, 2004 |
| 6727542 |
Semiconductor memory device and method for manufacturing the same |
Apr. 27, 2004 |
| 6717196 |
Ferroelectric memory device |
Apr. 6, 2004 |
| 6716679 |
Methods of forming fuse box guard rings for integrated circuit devices |
Apr. 6, 2004 |
| 6690054 |
Capacitor |
Feb. 10, 2004 |
| 6689693 |
Methods for utilization of disappearing silicon hard mask for fabrication of semiconductor structures |
Feb. 10, 2004 |
| 6687146 |
Interleaved wordline architecture |
Feb. 3, 2004 |
| 6680501 |
Semiconductor device |
Jan. 20, 2004 |
| 6674111 |
Semiconductor device having a logic transistor therein |
Jan. 6, 2004 |
| 6661700 |
Semiconductor memory device |
Dec. 9, 2003 |
| 6645842 |
Semiconductor integrated circuit device, semiconductor integrated circuit wiring method, and cell arranging method |
Nov. 11, 2003 |
| 6642135 |
Method for forming semiconductor memory device having a fuse |
Nov. 4, 2003 |
| 6639263 |
Semiconductor device with copper wiring connected to storage capacitor |
Oct. 28, 2003 |
| 6638817 |
Method for fabricating dram cell array not requiring a device isolation layer between cells |
Oct. 28, 2003 |
| 6635515 |
Method of manufacturing a semiconductor device having signal line above main ground or main VDD line |
Oct. 21, 2003 |
| 6624515 |
Microelectronic die including low RC under-layer interconnects |
Sep. 23, 2003 |
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