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Class Information
Number: 257/E21.641
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components or integrated circuits formed in, or on, common substrate (epo) > With subsequent division of substrate into plural individual devices (epo) > To produce devices each consisting of plurality of components, e.g., integrated circuits (epo) > Substrate being semiconductor, using silicon technology (epo) > Field-effect technology (epo) > Mis technology (epo) > Complementary field-effect transistors, e.g., cmos (epo) > Interconnection or wiring or contact manufacturing related aspects (epo)
Description: This subclass is indented under subclass E21.632. This subclass is substantially the same in scope as ECLA classification H01L21/8238T.

Patents under this class:
1 2 3 4 5 6

Patent Number Title Of Patent Date Issued
8709862 Vanadium, cobalt and strontium additives for use in aluminum back solar cell contacts Apr. 29, 2014
8647977 Methods of forming interconnects Feb. 11, 2014
8642464 Method of manufacturing semiconductor device Feb. 4, 2014
8581387 Through wire interconnect (TWI) having bonded connection and encapsulating polymer layer Nov. 12, 2013
8563425 Selective local interconnect to gate in a self aligned local interconnect process Oct. 22, 2013
8535966 Horizontal coplanar switches and methods of manufacture Sep. 17, 2013
8525247 Non-volatile memory device having variable resistance element Sep. 3, 2013
8507375 Alignment tolerant semiconductor contact and method Aug. 13, 2013
8502383 Integrated circuit including detection circuit to detect electrical energy delivered by a thermoelectric material Aug. 6, 2013
8466451 Single gate inverter nanowire mesh Jun. 18, 2013
8460981 Use of contacts to create differential stresses on devices Jun. 11, 2013
8435876 Method of manufacturing semiconductor device May. 7, 2013
8431968 Electromigration resistant standard cell device Apr. 30, 2013
8404523 Method for fabricating stacked semiconductor system with encapsulated through wire interconnects (TWI) Mar. 26, 2013
8404585 Preventing breakage of long metal signal conductors on semiconductor substrates Mar. 26, 2013
8390098 Semiconductor device providing a first electrical conductor and a second electrical conductor in one through hole and method for manufacturing the same Mar. 5, 2013
8373262 Source driver, method for manufacturing same, and liquid crystal module Feb. 12, 2013
8373177 Light emitting diode (LED) light source and manufacturing method for the same Feb. 12, 2013
8362569 Semiconductor device and semiconductor device fabrication method Jan. 29, 2013
8329572 Semiconductor device and method for fabricating the same Dec. 11, 2012
8304908 Semiconductor device having a multilevel interconnect structure and method for fabricating the same Nov. 6, 2012
8299455 Semiconductor structures having improved contact resistance Oct. 30, 2012
8278718 Stressed barrier plug slot contact structure for transistor performance enhancement Oct. 2, 2012
8278204 Methods for forming wiring and manufacturing thin film transistor and droplet discharging method Oct. 2, 2012
8258059 High voltage-resistant semiconductor device and method of manufacturing high voltage-resistant semiconductor device Sep. 4, 2012
8216928 Methods for fabricating semiconductor devices having local contacts Jul. 10, 2012
8217484 Image sensor and method of fabricating the same Jul. 10, 2012
8217510 Semiconductor module system having stacked components with encapsulated through wire interconnects (TWI) Jul. 10, 2012
8169077 Dielectric interconnect structures and methods for forming the same May. 1, 2012
8143651 Nested and isolated transistors with reduced impedance difference Mar. 27, 2012
8124469 High-efficiency filler cell with switchable, integrated buffer capacitance for high frequency applications Feb. 28, 2012
8120183 Method of forming top electrode for capacitor and interconnection in integrated passive device (IPD) Feb. 21, 2012
8120167 System with semiconductor components having encapsulated through wire interconnects (TWI) Feb. 21, 2012
8119519 Semiconductor device manufacturing method Feb. 21, 2012
8119512 Method for fabricating semiconductor device with damascene bit line Feb. 21, 2012
8114706 Selective removal of gold from a lead frame Feb. 14, 2012
8105874 Memory circuit arrangement and method for the production thereof Jan. 31, 2012
8105940 Power distribution in a vertically integrated circuit Jan. 31, 2012
8084794 Semiconductor device and manufacturing method thereof Dec. 27, 2011
8084308 Single gate inverter nanowire mesh Dec. 27, 2011
8076236 SRAM bit cell with self-aligned bidirectional local interconnects Dec. 13, 2011
8072070 Low fabrication cost, fine pitch and high reliability solder bump Dec. 6, 2011
8022547 Non-volatile memory cells including small volume electrical contact regions Sep. 20, 2011
8004085 Semiconductor device and method of manufacturing semiconductor device Aug. 23, 2011
7999388 Preventing breakage of long metal signal conductors on semiconductor substrates Aug. 16, 2011
7964970 Technique for enhancing transistor performance by transistor specific contact design Jun. 21, 2011
7956466 Structure for interconnect structure containing various capping materials for electrical fuse and other related applications Jun. 7, 2011
7935623 Semiconductor device and method for fabricating the same May. 3, 2011
7902063 Methods for discretized formation of masking and capping layers on a substrate Mar. 8, 2011
7902581 Semiconductor device comprising a contact structure based on copper and tungsten Mar. 8, 2011

1 2 3 4 5 6

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