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Class Information
Number: 257/E21.614
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components or integrated circuits formed in, or on, common substrate (epo) > With subsequent division of substrate into plural individual devices (epo) > To produce devices each consisting of plurality of components, e.g., integrated circuits (epo) > Substrate being semiconductor, using silicon technology (epo) > Three-dimensional integrated circuits stacked in different levels (epo)
Description: This subclass is indented under subclass E21.606. This subclass is substantially the same in scope as ECLA classification H01L21/822B.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7626252 |
Multi-chip electronic package and cooling system |
Dec. 1, 2009 |
| 7615856 |
Integrated antenna type circuit apparatus |
Nov. 10, 2009 |
| 7608918 |
Semiconductor device |
Oct. 27, 2009 |
| 7589375 |
Non-volatile memory devices including etching protection layers and methods of forming the same |
Sep. 15, 2009 |
| 7563645 |
Electronic package having a folded package substrate |
Jul. 21, 2009 |
| 7545049 |
Electronic parts packaging structure |
Jun. 9, 2009 |
| 7545029 |
Stack microelectronic assemblies |
Jun. 9, 2009 |
| 7528477 |
Castellation wafer level packaging of integrated circuit chips |
May. 5, 2009 |
| 7507614 |
Image sensor applied with device isolation technique for reducing dark signals and fabrication method thereof |
Mar. 24, 2009 |
| 7495276 |
Radio frequency arrangement, method for producing a radio frequency arrangement and use of the radio frequency arrangement |
Feb. 24, 2009 |
| 7494846 |
Design techniques for stacking identical memory dies |
Feb. 24, 2009 |
| 7473581 |
Wafer stacking package method |
Jan. 6, 2009 |
| 7439594 |
Stacked non-volatile memory with silicon carbide-based amorphous silicon thin film transistors |
Oct. 21, 2008 |
| 7410884 |
3D integrated circuits using thick metal for backside connections and offset bumps |
Aug. 12, 2008 |
| 7375419 |
Stacked mass storage flash memory package |
May. 20, 2008 |
| 7375420 |
Large area transducer array |
May. 20, 2008 |
| 7368337 |
Semiconductor device and manufacturing method thereof |
May. 6, 2008 |
| 7355271 |
Flexible assembly of stacked chips |
Apr. 8, 2008 |
| 7354809 |
Method for double-sided processing of thin film transistors |
Apr. 8, 2008 |
| 7355273 |
Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods |
Apr. 8, 2008 |
| 7345370 |
Wiring patterns formed by selective metal plating |
Mar. 18, 2008 |
| 7335558 |
Method of manufacturing NAND flash memory device |
Feb. 26, 2008 |
| 7335974 |
Multi stack packaging chip and method of manufacturing the same |
Feb. 26, 2008 |
| 7312487 |
Three dimensional integrated circuit |
Dec. 25, 2007 |
| 7304375 |
Castellation wafer level packaging of integrated circuit chips |
Dec. 4, 2007 |
| 7298037 |
Stacked integrated circuit package-in-package system with recessed spacer |
Nov. 20, 2007 |
| 7298038 |
Integrated circuit package system including die stacking |
Nov. 20, 2007 |
| 7262506 |
Stacked mass storage flash memory package |
Aug. 28, 2007 |
| 7247933 |
Thin multiple semiconductor die package |
Jul. 24, 2007 |
| 7211488 |
Method of forming inter-dielectric layer in semiconductor device |
May. 1, 2007 |
| 7211472 |
Method for producing a multichip module and multichip module |
May. 1, 2007 |
| 7157787 |
Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices |
Jan. 2, 2007 |
| 7126212 |
Three dimensional device integration method and integrated device |
Oct. 24, 2006 |
| 7075501 |
Head mounted display system |
Jul. 11, 2006 |
| 7071565 |
Patterning three dimensional structures |
Jul. 4, 2006 |
| 7042756 |
Configurable storage device |
May. 9, 2006 |
| 7030459 |
Three-dimensional memory structure and manufacturing method thereof |
Apr. 18, 2006 |
| 6998683 |
TFT-based common gate CMOS inverters, and computer systems utilizing novel CMOS inverters |
Feb. 14, 2006 |
| 6995455 |
Semiconductor device |
Feb. 7, 2006 |
| 6992349 |
Rail stack array of charge storage devices and method of making same |
Jan. 31, 2006 |
| 6964896 |
Methods of forming semiconductor logic circuitry, and semiconductor logic circuit constructions |
Nov. 15, 2005 |
| 6947305 |
Method for fabricating and identifying integrated circuits and self-identifying integrated circuits |
Sep. 20, 2005 |
| 6943067 |
Three-dimensional integrated semiconductor devices |
Sep. 13, 2005 |
| 6927431 |
Semiconductor circuit constructions |
Aug. 9, 2005 |
| 6919935 |
Method of forming an active matrix display |
Jul. 19, 2005 |
| 6917076 |
Semiconductor device, a method of manufacturing the semiconductor device and a method of deleting information from the semiconductor device |
Jul. 12, 2005 |
| 6906940 |
Plane decoding method and device for three dimensional memories |
Jun. 14, 2005 |
| 6900667 |
Logic constructions and electronic devices |
May. 31, 2005 |
| 6897506 |
Systems and methods using non-volatile memory cells |
May. 24, 2005 |
| 6894392 |
Scaleable integrated data processing device |
May. 17, 2005 |
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