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Class Information
Number: 257/E21.614
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components or integrated circuits formed in, or on, common substrate (epo) > With subsequent division of substrate into plural individual devices (epo) > To produce devices each consisting of plurality of components, e.g., integrated circuits (epo) > Substrate being semiconductor, using silicon technology (epo) > Three-dimensional integrated circuits stacked in different levels (epo)
Description: This subclass is indented under subclass E21.606. This subclass is substantially the same in scope as ECLA classification H01L21/822B.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8709938 3D IC method and device Apr. 29, 2014
8703597 Method for fabrication of a semiconductor device and structure Apr. 22, 2014
8664042 Method for fabrication of configurable systems Mar. 4, 2014
8652877 Method of manufacturing layered chip package Feb. 18, 2014
8625381 Stacked semiconductor device Jan. 7, 2014
8574982 Implementing eDRAM stacked FET structure Nov. 5, 2013
8574929 Method to form a 3D semiconductor device and structure Nov. 5, 2013
8563979 Method for producing display device Oct. 22, 2013
8558297 MRAM cell structure Oct. 15, 2013
8546188 Bow-balanced 3D chip stacking Oct. 1, 2013
8546250 Method of fabricating vertical integrated semiconductor device with multiple continuous single crystal silicon layers vertically separated from one another Oct. 1, 2013
8536634 Memory device transistors Sep. 17, 2013
8530350 Apparatuses including stair-step structures and methods of forming the same Sep. 10, 2013
8513058 Semiconductor device and method for producing the same Aug. 20, 2013
8513121 Semiconductor memory device and manufacturing method thereof Aug. 20, 2013
8513791 Compact multi-port CAM cell implemented in 3D vertical integration Aug. 20, 2013
8481420 Integrated circuit packaging system with lead frame stacking module and method of manufacture thereof Jul. 9, 2013
8482957 Three dimensionally stacked non volatile memory units Jul. 9, 2013
8471306 Double-sided integrated circuit chips Jun. 25, 2013
8466008 Stacked semiconductor package and stacking method thereof Jun. 18, 2013
8461035 Method for fabrication of a semiconductor device and structure Jun. 11, 2013
8461693 Substrate arrangement Jun. 11, 2013
8446015 Semiconductor device and method for manufacturing thereof May. 21, 2013
8445322 Method of fabricating semiconductor package May. 21, 2013
8440542 Semiconductor device and structure May. 14, 2013
8441112 Method of manufacturing layered chip package May. 14, 2013
8436414 Non-volatile semiconductor stacked memory device having two semiconductor pillars in a through hole and method for manufacturing same May. 7, 2013
8432028 Integrated circuit packaging system with package-on-package and method of manufacture thereof Apr. 30, 2013
8426947 Laminated semiconductor wafer, laminated chip package and method of manufacturing the same Apr. 23, 2013
8427865 Semiconductor storage device Apr. 23, 2013
8426921 Three-dimensional integrated circuits and techniques for fabrication thereof Apr. 23, 2013
8421087 Semiconductor module including a switch and non-central diode Apr. 16, 2013
8395191 Semiconductor device and structure Mar. 12, 2013
8395252 Integrated MEMS and CMOS package and method Mar. 12, 2013
8389333 Semiconductor device and method of forming EWLB package containing stacked semiconductor die electrically connected through conductive vias formed in encapsulant around die Mar. 5, 2013
8383458 Integrated circuit package system employing an offset stacked configuration and method for manufacturing thereof Feb. 26, 2013
8373237 Transistor and method of manufacturing the same Feb. 12, 2013
8354300 Reducing susceptibility to electrostatic discharge damage during die-to-die bonding for 3-D packaged integrated circuits Jan. 15, 2013
8349650 Multi-layered integrated circuit and apparatus with thermal management and method Jan. 8, 2013
8343814 Compact multi-port cam cell implemented in 3D vertical integration Jan. 1, 2013
8324070 Semiconductor device and method for manufacturing the same Dec. 4, 2012
8298940 Semiconductor memory device and manufacturing method thereof Oct. 30, 2012
8298931 Dual damascene with amorphous carbon for 3D deep via/trench application Oct. 30, 2012
8294159 Method for fabrication of a semiconductor device and structure Oct. 23, 2012
8274102 Semiconductor device Sep. 25, 2012
8258517 Semiconductor device having driving transistors Sep. 4, 2012
8258563 Multi-layer memory devices Sep. 4, 2012
8247864 Amorphous silicon MONOS or MAS memory cell structure with OTP function Aug. 21, 2012
8247895 4D device process and structure Aug. 21, 2012
8241989 Integrated circuit with stacked devices Aug. 14, 2012

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