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Class Information
Number: 257/E21.602
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components or integrated circuits formed in, or on, common substrate (epo) > With subsequent division of substrate into plural individual devices (epo) > To produce devices each consisting of plurality of components, e.g., integrated circuits (epo)
Description: This subclass is indented under subclass E21.599. This subclass is substantially the same in scope as ECLA classification H01L21/82.










Sub-classes under this class:

Class Number Class Name Patents
257/E21.603 Substrate is semiconductor, using combination of semiconductor substrates, e.g., diamond, sic, si, group iii-v compound, and/or group ii-vi compound semiconductor substrates (epo) 60
257/E21.604 Substrate is semiconductor, using diamond technology (epo) 1
257/E21.605 Substrate is semiconductor, using sic technology (epo) 35
257/E21.606 Substrate being semiconductor, using silicon technology (epo) 60
257/E21.697 Substrate is group iii-v semiconductor (epo) 215
257/E21.698 Substrate is group ii-vi semiconductor (epo) 11
257/E21.699 Substrate is semiconductor other than diamond, sic, si, group iii-v compound, or group ii-vi compound (epo) 17


Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8710481 Non-volatile memory cell containing a nano-rail electrode Apr. 29, 2014
8674333 Variable-resistance material memories and methods Mar. 18, 2014
8673741 Etching a laser-cut semiconductor before dicing a die attach film (DAF) or other material layer Mar. 18, 2014
8624300 Contact integration for three-dimensional stacking semiconductor devices Jan. 7, 2014
8617963 Integrated circuit wafer dicing method Dec. 31, 2013
8618607 Semiconductor devices formed on a continuous active region with an isolating conductive structure positioned between such semiconductor devices, and methods of making same Dec. 31, 2013
8609526 Preventing UBM oxidation in bump formation processes Dec. 17, 2013
8604615 Semiconductor device including a stack of semiconductor chips, underfill material and molding material Dec. 10, 2013
8598016 In-situ deposited mask layer for device singulation by laser scribing and plasma etch Dec. 3, 2013
8586392 Display device and manufacturing method thereof Nov. 19, 2013
8587985 Memory array with graded resistance lines Nov. 19, 2013
8569734 Forming resistive random access memories together with fuse arrays Oct. 29, 2013
8546864 Three dimensional memory and methods of forming the same Oct. 1, 2013
8542513 Arrays of vertically stacked tiers of non-volatile cross point memory cells, methods of forming arrays of vertically stacked tiers of non-volatile cross point memory cells, and methods of read Sep. 24, 2013
8507363 Laser and plasma etch wafer dicing using water-soluble die attach film Aug. 13, 2013
8492260 Processes of forming an electronic device including a feature in a trench Jul. 23, 2013
8411477 Arrays of vertically stacked tiers of non-volatile cross point memory cells, methods of forming arrays of vertically stacked tiers of non-volatile cross point memory cells, and methods of read Apr. 2, 2013
8399986 Method for performing parallel stochastic assembly Mar. 19, 2013
8399307 Interconnects for stacked non-volatile memory device and method Mar. 19, 2013
8394681 Transistor layout for manufacturing process control Mar. 12, 2013
8390331 Flexible CMOS library architecture for leakage power and variability reduction Mar. 5, 2013
8349624 Method for fabricating semiconductor device Jan. 8, 2013
8338812 Vertical spacer electrodes for variable-resistance material memories and vertical spacer variable-resistance material memory cells Dec. 25, 2012
8339849 Semiconductor device and layout method for the semiconductor device Dec. 25, 2012
8334579 Schottky diode Dec. 18, 2012
8325529 Bit-line connections for non-volatile storage Dec. 4, 2012
8314014 Laser processing apparatus and laser processing method Nov. 20, 2012
8309441 Process for eliminating delamination between amorphous silicon layers Nov. 13, 2012
8293580 Method of forming package-on-package and device related thereto Oct. 23, 2012
8247845 Electrostatic discharge (ESD) protection circuit placement in semiconductor devices Aug. 21, 2012
8222091 Damascene method of making a nonvolatile memory device Jul. 17, 2012
8211756 3D chip-stack with fuse-type through silicon via Jul. 3, 2012
8193521 Resistive memory cell fabrication methods and devices Jun. 5, 2012
8188564 Semiconductor device having a planarizing film formed in a region of a step portion May. 29, 2012
8168478 Method for producing a matrix of individual electronic components and matrix produced thereby May. 1, 2012
8158446 Semiconductor device and method of manufacturing the same Apr. 17, 2012
8124521 Electrical through contact Feb. 28, 2012
8119501 Method for separating a semiconductor wafer into individual semiconductor dies using an implanted impurity Feb. 21, 2012
8084300 RF shielding for a singulated laminate semiconductor device package Dec. 27, 2011
8080447 Method of manufacturing semiconductor device including exposing a dicing line on a wafer Dec. 20, 2011
8067268 Stacked integrated circuit package system and method for manufacturing thereof Nov. 29, 2011
8058656 Method for producing a matrix of individual electronic components and matrix produced thereby Nov. 15, 2011
8048728 Display device, method for manufacturing display device, and SOI substrate Nov. 1, 2011
8048795 Self-assembly pattern for semiconductor integrated circuit Nov. 1, 2011
8021933 Integrated circuit including structures arranged at different densities and method of forming the same Sep. 20, 2011
7985990 Transistor layout for manufacturing process control Jul. 26, 2011
7972907 Via configurable architecture for customization of analog circuitry in a semiconductor device Jul. 5, 2011
7964475 Semiconductor wafer, method of manufacturing the same and semiconductor device Jun. 21, 2011
7935552 Ink composition and method of fabricating liquid crystal display device using the same May. 3, 2011
7923351 Manufacturing method of semiconductor devices Apr. 12, 2011

1 2 3 4










 
 
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