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Class Information
Number: 257/E21.601
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components or integrated circuits formed in, or on, common substrate (epo) > With subsequent division of substrate into plural individual devices (epo) > Involving separation of active layers from substrate (epo) > Leaving reusable substrate, e.g., epitaxial lift-off process (epo)
Description: This subclass is indented under subclass E21.6. This subclass is substantially the same in scope as ECLA classification H01L21/78B2.










Patents under this class:

Patent Number Title Of Patent Date Issued
8603896 Method for transferring a monocrystalline semiconductor layer onto a support substrate Dec. 10, 2013
8367518 Epitaxial lift off stack having a multi-layered handle and methods thereof Feb. 5, 2013
8324083 Method for producing group III nitride compound semiconductor element Dec. 4, 2012
8314011 Epitaxial lift off stack having a non-uniform handle and methods thereof Nov. 20, 2012
8309432 Epitaxial lift off stack having a universally shrunk handle and methods thereof Nov. 13, 2012
8158490 Method for producing group III nitride-based compound semiconductor device Apr. 17, 2012
8153475 Back-end processes for substrates re-use Apr. 10, 2012
8067294 Method of manufacturing semiconductor device including protective film Nov. 29, 2011
8058152 Method for manufacturing integrated circuit Nov. 15, 2011
8039353 Semiconductor device and manufacturing method of semiconductor device Oct. 18, 2011
8026152 Separation method of semiconductor device Sep. 27, 2011
8003492 Epitaxial lift off stack having a unidirectionally shrunk handle and methods thereof Aug. 23, 2011
7932111 Substrate removal process for high light extraction LEDs Apr. 26, 2011
7820529 Method for manufacturing integrated circuit Oct. 26, 2010
7776715 Reverse construction memory cell Aug. 17, 2010
7588969 Method for manufacturing semiconductor device, and semiconductor device Sep. 15, 2009
7579262 Different embedded strain layers in PMOS and NMOS transistors and a method of forming the same Aug. 25, 2009
7528055 Method of producing a nitride semiconductor device and nitride semiconductor device May. 5, 2009
7442623 Method for manufacturing bonded substrate and bonded substrate manufactured by the method Oct. 28, 2008
6048411 Silicon-on-silicon hybrid wafer assembly Apr. 11, 2000
6013563 Controlled cleaning process Jan. 11, 2000
6010579 Reusable substrate for thin film separation Jan. 4, 2000
5985742 Controlled cleavage process and device for patterned films Nov. 16, 1999











 
 
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