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Class Information
Number: 257/E21.599
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components or integrated circuits formed in, or on, common substrate (epo) > With subsequent division of substrate into plural individual devices (epo)
Description: This subclass is indented under subclass E21.598. This subclass is substantially the same in scope as ECLA classification H01L21/78.










Sub-classes under this class:

Class Number Class Name Patents
257/E21.6 Involving separation of active layers from substrate (epo) 58
257/E21.602 To produce devices each consisting of plurality of components, e.g., integrated circuits (epo) 183
257/E21.7 Substrate is nonsemiconductor body, e.g., insulating body (epo) 71


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

Patent Number Title Of Patent Date Issued
8710658 Under bump passive components in wafer level packaging Apr. 29, 2014
8710859 Method for testing multi-chip stacked packages Apr. 29, 2014
8703582 Laser processing method Apr. 22, 2014
8703584 Dicing tape-integrated film for semiconductor back surface Apr. 22, 2014
8692367 Wafer-level packaged device having self-assembled resilient leads Apr. 8, 2014
8691702 Method and apparatus for plasma dicing a semi-conductor wafer Apr. 8, 2014
8692394 Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor device Apr. 8, 2014
8685839 Workpiece dividing method Apr. 1, 2014
8685834 Fabrication method of package structure with simplified encapsulation structure and simplified wiring Apr. 1, 2014
8679895 Method of making thin-wafer current sensors Mar. 25, 2014
8679945 Backgrind process for integrated circuit wafers Mar. 25, 2014
8680653 Wafer and a method of dicing a wafer Mar. 25, 2014
8673743 Wafer dividing method Mar. 18, 2014
8673742 Method for manufacturing semiconductor device Mar. 18, 2014
8669646 Apparatus and method for grounding an IC package lid for EMI reduction Mar. 11, 2014
8664748 Package-level integrated circuit connection without top metal pads or bonding wire Mar. 4, 2014
8664042 Method for fabrication of configurable systems Mar. 4, 2014
8658436 Method for separating and transferring IC chips Feb. 25, 2014
8652938 Thermally releasable sheet-integrated film for semiconductor back surface, method of collecting semiconductor element, and method of producing semiconductor device Feb. 18, 2014
8647924 Semiconductor package and method of packaging semiconductor devices Feb. 11, 2014
8642447 Semiconductor wafer and manufacturing method of semiconductor device Feb. 4, 2014
8637351 Methods for making micro needles and applications thereof Jan. 28, 2014
8633089 Die bonding method utilizing rotary wafer table Jan. 21, 2014
8633091 Chip package and fabrication method thereof Jan. 21, 2014
8633581 Semiconductor device Jan. 21, 2014
8629532 Semiconductor wafer with assisting dicing structure and dicing method thereof Jan. 14, 2014
8629043 Methods for de-bonding carriers Jan. 14, 2014
8624351 Package structure and method for making the same Jan. 7, 2014
8609512 Method for laser singulation of chip scale packages on glass substrates Dec. 17, 2013
8609515 Dicing die bonding film, semiconductor wafer, and semiconductor device Dec. 17, 2013
8603351 Working method for cutting Dec. 10, 2013
8604584 Semiconductor device and method of manufacturing semiconductor device Dec. 10, 2013
8604620 Semiconductor structure having lateral through silicon via Dec. 10, 2013
8597980 Method for bonding of chips on wafers Dec. 3, 2013
8597963 Manufacture of light emitting devices with phosphor wavelength conversion Dec. 3, 2013
8592252 Semiconductor device and method of forming through hole vias in die extension region around periphery of die Nov. 26, 2013
8580612 Chip assembly Nov. 12, 2013
8580656 Process for inhibiting corrosion and removing contaminant from a surface during wafer dicing and composition useful therefor Nov. 12, 2013
8581263 Laser-induced flaw formation in nitride semiconductors Nov. 12, 2013
8575758 Laser-assisted cleaving of a reconstituted wafer for stacked die assemblies Nov. 5, 2013
8569085 Photoelectrochemical etching for chip shaping of light emitting diodes Oct. 29, 2013
8569108 Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die Oct. 29, 2013
8563358 Method of producing a chip package, and chip package Oct. 22, 2013
8564113 Electrostatic chucking of an insulator handle substrate Oct. 22, 2013
8563349 Method of forming semiconductor device Oct. 22, 2013
8557682 Multi-layer mask for substrate dicing by laser and plasma etch Oct. 15, 2013
8558330 Deep well process for MEMS pressure sensor Oct. 15, 2013
8551792 Dicing a semiconductor wafer Oct. 8, 2013
8551817 Semiconductor substrate cutting method Oct. 8, 2013
8552498 Semiconductor device and method for manufacturing the same Oct. 8, 2013

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