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Class Information
Number: 257/E21.599
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components or integrated circuits formed in, or on, common substrate (epo) > With subsequent division of substrate into plural individual devices (epo)
Description: This subclass is indented under subclass E21.598. This subclass is substantially the same in scope as ECLA classification H01L21/78.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 8710658 |
Under bump passive components in wafer level packaging |
Apr. 29, 2014 |
| 8710859 |
Method for testing multi-chip stacked packages |
Apr. 29, 2014 |
| 8703582 |
Laser processing method |
Apr. 22, 2014 |
| 8703584 |
Dicing tape-integrated film for semiconductor back surface |
Apr. 22, 2014 |
| 8692367 |
Wafer-level packaged device having self-assembled resilient leads |
Apr. 8, 2014 |
| 8691702 |
Method and apparatus for plasma dicing a semi-conductor wafer |
Apr. 8, 2014 |
| 8692394 |
Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor device |
Apr. 8, 2014 |
| 8685839 |
Workpiece dividing method |
Apr. 1, 2014 |
| 8685834 |
Fabrication method of package structure with simplified encapsulation structure and simplified wiring |
Apr. 1, 2014 |
| 8679895 |
Method of making thin-wafer current sensors |
Mar. 25, 2014 |
| 8679945 |
Backgrind process for integrated circuit wafers |
Mar. 25, 2014 |
| 8680653 |
Wafer and a method of dicing a wafer |
Mar. 25, 2014 |
| 8673743 |
Wafer dividing method |
Mar. 18, 2014 |
| 8673742 |
Method for manufacturing semiconductor device |
Mar. 18, 2014 |
| 8669646 |
Apparatus and method for grounding an IC package lid for EMI reduction |
Mar. 11, 2014 |
| 8664748 |
Package-level integrated circuit connection without top metal pads or bonding wire |
Mar. 4, 2014 |
| 8664042 |
Method for fabrication of configurable systems |
Mar. 4, 2014 |
| 8658436 |
Method for separating and transferring IC chips |
Feb. 25, 2014 |
| 8652938 |
Thermally releasable sheet-integrated film for semiconductor back surface, method of collecting semiconductor element, and method of producing semiconductor device |
Feb. 18, 2014 |
| 8647924 |
Semiconductor package and method of packaging semiconductor devices |
Feb. 11, 2014 |
| 8642447 |
Semiconductor wafer and manufacturing method of semiconductor device |
Feb. 4, 2014 |
| 8637351 |
Methods for making micro needles and applications thereof |
Jan. 28, 2014 |
| 8633089 |
Die bonding method utilizing rotary wafer table |
Jan. 21, 2014 |
| 8633091 |
Chip package and fabrication method thereof |
Jan. 21, 2014 |
| 8633581 |
Semiconductor device |
Jan. 21, 2014 |
| 8629532 |
Semiconductor wafer with assisting dicing structure and dicing method thereof |
Jan. 14, 2014 |
| 8629043 |
Methods for de-bonding carriers |
Jan. 14, 2014 |
| 8624351 |
Package structure and method for making the same |
Jan. 7, 2014 |
| 8609512 |
Method for laser singulation of chip scale packages on glass substrates |
Dec. 17, 2013 |
| 8609515 |
Dicing die bonding film, semiconductor wafer, and semiconductor device |
Dec. 17, 2013 |
| 8603351 |
Working method for cutting |
Dec. 10, 2013 |
| 8604584 |
Semiconductor device and method of manufacturing semiconductor device |
Dec. 10, 2013 |
| 8604620 |
Semiconductor structure having lateral through silicon via |
Dec. 10, 2013 |
| 8597980 |
Method for bonding of chips on wafers |
Dec. 3, 2013 |
| 8597963 |
Manufacture of light emitting devices with phosphor wavelength conversion |
Dec. 3, 2013 |
| 8592252 |
Semiconductor device and method of forming through hole vias in die extension region around periphery of die |
Nov. 26, 2013 |
| 8580612 |
Chip assembly |
Nov. 12, 2013 |
| 8580656 |
Process for inhibiting corrosion and removing contaminant from a surface during wafer dicing and composition useful therefor |
Nov. 12, 2013 |
| 8581263 |
Laser-induced flaw formation in nitride semiconductors |
Nov. 12, 2013 |
| 8575758 |
Laser-assisted cleaving of a reconstituted wafer for stacked die assemblies |
Nov. 5, 2013 |
| 8569085 |
Photoelectrochemical etching for chip shaping of light emitting diodes |
Oct. 29, 2013 |
| 8569108 |
Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die |
Oct. 29, 2013 |
| 8563358 |
Method of producing a chip package, and chip package |
Oct. 22, 2013 |
| 8564113 |
Electrostatic chucking of an insulator handle substrate |
Oct. 22, 2013 |
| 8563349 |
Method of forming semiconductor device |
Oct. 22, 2013 |
| 8557682 |
Multi-layer mask for substrate dicing by laser and plasma etch |
Oct. 15, 2013 |
| 8558330 |
Deep well process for MEMS pressure sensor |
Oct. 15, 2013 |
| 8551792 |
Dicing a semiconductor wafer |
Oct. 8, 2013 |
| 8551817 |
Semiconductor substrate cutting method |
Oct. 8, 2013 |
| 8552498 |
Semiconductor device and method for manufacturing the same |
Oct. 8, 2013 |
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