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Class Information
Number: 257/E21.596
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Interconnections, comprising conductors and dielectrics, for carrying current between separate components within device (epo) > Characterized by formation and post treatment of dielectrics, e.g., planarizing (epo) > Modifying pattern or conductivity of conductive members, e.g., formation of alloys, reduction of contact resistances (epo) > Modifying pattern (epo) > Using laser, e.g., laser cutting, laser direct writing, laser repair (epo)
Description: This subclass is indented under subclass E21.595. This subclass is substantially the same in scope as ECLA classification H01L21/768C8L2.

Patents under this class:
1 2 3 4 5 6

Patent Number Title Of Patent Date Issued
8685834 Fabrication method of package structure with simplified encapsulation structure and simplified wiring Apr. 1, 2014
8664089 Semiconductor die singulation method Mar. 4, 2014
8617964 Laser processing method Dec. 31, 2013
8564026 Chip, method for producing a chip and device for laser ablation Oct. 22, 2013
8549733 Method of forming a transducer assembly Oct. 8, 2013
8536025 Resized wafer with a negative photoresist ring and design structures thereof Sep. 17, 2013
8482018 Light emitting device and method for fabricating the same Jul. 9, 2013
8461020 Device processing method Jun. 11, 2013
8455332 Method and apparatus for manufacturing LED devices using laser scribing Jun. 4, 2013
8445361 Method of dividing a semiconductor wafer having semiconductor and metal layers into separate devices May. 21, 2013
8435869 Method for manufacturing semiconductor device May. 7, 2013
8431467 Laser working method Apr. 30, 2013
8415232 Dividing method for wafer having die bonding film attached to the back side thereof Apr. 9, 2013
8378252 Method and apparatus for hybrid resolution feedback of a motion stage Feb. 19, 2013
8349673 Method of producing plurality of organic transistors using laser patterning Jan. 8, 2013
8349700 Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor device Jan. 8, 2013
8334169 Integrated circuit packaging system and method of manufacture thereof Dec. 18, 2012
8324636 Method and apparatus for manufacturing LED devices using laser scribing Dec. 4, 2012
8318536 Utilizing aperture with phase shift feature in forming microvias Nov. 27, 2012
8227977 Structure for repairing a line defect of an organic light emitting display and a method of repairing the defect Jul. 24, 2012
8211749 Integrated circuit package system with waferscale spacer Jul. 3, 2012
8178425 Optical device wafer processing method May. 15, 2012
8158490 Method for producing group III nitride-based compound semiconductor device Apr. 17, 2012
8158493 Laser-based material processing methods and systems Apr. 17, 2012
8153476 Electronic component and method of manufacturing the same Apr. 10, 2012
8124454 Die separation Feb. 28, 2012
8115191 Self-constrained anisotropic germanium nanostructure from electroplating Feb. 14, 2012
8043969 Method for manufacturing semiconductor device Oct. 25, 2011
8026154 Laser working method Sep. 27, 2011
8026158 Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window Sep. 27, 2011
8017521 Semiconductor package having through-hole vias on saw streets formed with partial saw Sep. 13, 2011
7998840 Wafer laser processing method and apparatus Aug. 16, 2011
7993975 Method of manufacturing semiconductor device including mounting and dicing chips Aug. 9, 2011
7989313 Method and apparatus for creating RFID devices Aug. 2, 2011
7972903 Semiconductor device having wiring line and manufacturing method thereof Jul. 5, 2011
7955906 Methods and systems for thermal-based laser processing a multi-material device Jun. 7, 2011
7952176 Integrated circuit packaging system and method of manufacture thereof May. 31, 2011
7947574 Laser processing method and semiconductor chip May. 24, 2011
7943518 Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip May. 17, 2011
7939913 Semiconductor device May. 10, 2011
7939430 Laser processing method May. 10, 2011
7915139 CVD flowable gap fill Mar. 29, 2011
7910475 Method for forming low dielectric constant fluorine-doped layers Mar. 22, 2011
7897488 Dividing method for wafer having film on the front side thereof Mar. 1, 2011
7892891 Die separation Feb. 22, 2011
7888236 Semiconductor device and fabrication methods thereof Feb. 15, 2011
7859110 Solder resist material, wiring board using the solder resist material, and semiconductor package Dec. 28, 2010
7851264 Semiconductor device singulation method Dec. 14, 2010
7829439 Laser beam processing method for making a semiconductor device Nov. 9, 2010
7821104 Package device having crack arrest feature and method of forming Oct. 26, 2010

1 2 3 4 5 6

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