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Class Information
Number: 257/E21.591
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Interconnections, comprising conductors and dielectrics, for carrying current between separate components within device (epo) > Characterized by formation and post treatment of dielectrics, e.g., planarizing (epo) > Modifying pattern or conductivity of conductive members, e.g., formation of alloys, reduction of contact resistances (epo)
Description: This subclass is indented under subclass E21.582. This subclass is substantially the same in scope as ECLA classification H01L21/768C8.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7595556 |
Semiconductor device and method for manufacturing the same |
Sep. 29, 2009 |
| 7576003 |
Dual liner capping layer interconnect structure and method |
Aug. 18, 2009 |
| 7569467 |
Semiconductor device and manufacturing method thereof |
Aug. 4, 2009 |
| 7566964 |
Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structures |
Jul. 28, 2009 |
| 7507666 |
Manufacture method for semiconductor device having concave portions filled with conductor containing Cu as its main composition |
Mar. 24, 2009 |
| 7498600 |
Variable resistance random access memory device and a method of fabricating the same |
Mar. 3, 2009 |
| 7491575 |
Fabricating zinc oxide semiconductor using hydrolysis |
Feb. 17, 2009 |
| 7442644 |
Method for manufacturing nitride semiconductor wafer or nitride semiconductor device; nitride semiconductor wafer or nitride semiconductor device made by the same; and laser irradiating appara |
Oct. 28, 2008 |
| 7435679 |
Alloyed underlayer for microelectronic interconnects |
Oct. 14, 2008 |
| 7432198 |
Semiconductor devices and methods of forming interconnection lines therein |
Oct. 7, 2008 |
| 7382042 |
COF flexible printed wiring board and method of producing the wiring board |
Jun. 3, 2008 |
| 7319052 |
Alloying method, and wiring forming method, display device forming method, and image display unit fabricating method |
Jan. 15, 2008 |
| 7307018 |
Method of fabricating conductive lines |
Dec. 11, 2007 |
| 7279380 |
Method of forming a chalcogenide memory cell having an ultrasmall cross-sectional area and a chalcogenide memory cell produced by the method |
Oct. 9, 2007 |
| 7229917 |
Film formation method and apparatus for semiconductor process |
Jun. 12, 2007 |
| 7198989 |
Method of producing a COF flexible printed wiring board |
Apr. 3, 2007 |
| 7183209 |
Semiconductor device and manufacturing method thereof |
Feb. 27, 2007 |
| 7154180 |
Electronic device, method of manufacture of the same, and sputtering target |
Dec. 26, 2006 |
| 7098539 |
Electronic device, method of manufacture of the same, and sputtering target |
Aug. 29, 2006 |
| 7074709 |
Localized doping and/or alloying of metallization for increased interconnect performance |
Jul. 11, 2006 |
| 7049227 |
Method for alloying a wiring portion for a image display device |
May. 23, 2006 |
| 7041584 |
Method of manufacturing semiconductor device and the semiconductor device |
May. 9, 2006 |
| 7033930 |
Interconnect structures in a semiconductor device and processes of formation |
Apr. 25, 2006 |
| 7022598 |
Method of producing multilayer interconnection structure |
Apr. 4, 2006 |
| 7011990 |
Alloying method using laser irradiation for a light emitting device |
Mar. 14, 2006 |
| 7008827 |
Alloy method using laser irradiation |
Mar. 7, 2006 |
| 6995471 |
Self-passivated copper interconnect structure |
Feb. 7, 2006 |
| 6957624 |
Apparatus and a method for forming an alloy layer over a substrate |
Oct. 25, 2005 |
| 6955984 |
Surface treatment of metal interconnect lines |
Oct. 18, 2005 |
| 6953741 |
Methods of fabricating contacts for semiconductor devices utilizing a pre-flow process |
Oct. 11, 2005 |
| 6949832 |
Semiconductor device including dissimilar element-diffused metal layer and manufacturing method thereof |
Sep. 27, 2005 |
| 6946383 |
Method for forming wiring structure which includes annealing conductive film before and after removal of a portion of the conductive film |
Sep. 20, 2005 |
| 6946387 |
Semiconductor device and method for manufacturing the same |
Sep. 20, 2005 |
| 6933190 |
Semiconductor device having a capacitor with rare metal electrode |
Aug. 23, 2005 |
| 6921712 |
Process for producing integrated circuits including reduction using gaseous organic compounds |
Jul. 26, 2005 |
| 6911405 |
Semiconductor device and method of manufacturing the same |
Jun. 28, 2005 |
| 6908857 |
Method of manufacturing semiconductor device |
Jun. 21, 2005 |
| 6903017 |
Integrated circuit metallization using a titanium/aluminum alloy |
Jun. 7, 2005 |
| 6887795 |
Method of growing electrical conductors |
May. 3, 2005 |
| 6879017 |
Methods and structures for metal interconnections in integrated circuits |
Apr. 12, 2005 |
| 6878628 |
In situ reduction of copper oxide prior to silicon carbide deposition |
Apr. 12, 2005 |
| 6878574 |
Alloying method for a image display device using laser irradiation |
Apr. 12, 2005 |
| 6869873 |
Copper silicide passivation for improved reliability |
Mar. 22, 2005 |
| 6864169 |
Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device |
Mar. 8, 2005 |
| 6861758 |
Structure and manufacturing process of localized shunt to reduce electromigration failure of copper dual damascene process |
Mar. 1, 2005 |
| 6849535 |
Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device |
Feb. 1, 2005 |
| 6849537 |
Method of suppressing void formation in a metal line |
Feb. 1, 2005 |
| 6841473 |
Manufacturing an integrated circuit with low solubility metal-conductor interconnect cap |
Jan. 11, 2005 |
| 6833321 |
Method of making a semiconductor device that has copper damascene interconnects with enhanced electromigration reliability |
Dec. 21, 2004 |
| 6815330 |
Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device |
Nov. 9, 2004 |
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