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Class Information
Number: 257/E21.591
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Interconnections, comprising conductors and dielectrics, for carrying current between separate components within device (epo) > Characterized by formation and post treatment of dielectrics, e.g., planarizing (epo) > Modifying pattern or conductivity of conductive members, e.g., formation of alloys, reduction of contact resistances (epo)
Description: This subclass is indented under subclass E21.582. This subclass is substantially the same in scope as ECLA classification H01L21/768C8.










Sub-classes under this class:

Class Number Class Name Patents
257/E21.592 By altering solid-state characteristics of conductive members, e.g., fuses, in situ oxidation, laser melting (epo) 486
257/E21.593 By forming silicide of refractory metal (epo) 333
257/E21.594 By using super-conducting material (epo) 16
257/E21.595 Modifying pattern (epo) 106


Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8669177 Semiconductor device and method for manufacturing semiconductor device Mar. 11, 2014
8610289 Semiconductor component and method for producing a metal-semiconductor contact Dec. 17, 2013
8471356 Programmable anti-fuse structures with conductive material islands Jun. 25, 2013
8329514 Methods for forming antifuses with curved breakdown regions Dec. 11, 2012
8298905 Method for forming functional element using metal-to-insulator transition material, functional element formed by method, method for producing functional device, and functional device produced Oct. 30, 2012
8288276 Method of forming an interconnect structure including a metallic interfacial layer located at a bottom via portion Oct. 16, 2012
8164098 Semiconductor element, organic transistor, light-emitting device, and electronic device Apr. 24, 2012
8159814 Method of operating transistors and structures thereof for improved reliability and lifetime Apr. 17, 2012
8076778 Method for preventing Al-Cu bottom damage using TiN liner Dec. 13, 2011
8008186 Semiconductor device and method of fabricating the same Aug. 30, 2011
8003527 Manufacturing method of semiconductor device Aug. 23, 2011
8003536 Electromigration resistant aluminum-based metal interconnect structure Aug. 23, 2011
8003453 Self-aligned process for nanotube/nanowire FETs Aug. 23, 2011
7977791 Selective formation of boron-containing metal cap pre-layer Jul. 12, 2011
7977766 Trench anti-fuse structures for a programmable integrated circuit Jul. 12, 2011
7964491 Method of forming metal wiring of nonvolatile memory device Jun. 21, 2011
7964506 Two step copper electroplating process with anneal for uniform across wafer deposition and void free filling on ruthenium coated wafers Jun. 21, 2011
7888254 Semiconductor device having a refractory metal containing film and method for manufacturing the same Feb. 15, 2011
7843062 Thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperature Nov. 30, 2010
7838423 Method of forming capping structures on one or more material layer surfaces Nov. 23, 2010
7799684 Two step process for uniform across wafer deposition and void free filling on ruthenium coated wafers Sep. 21, 2010
7781318 Semiconductor device and method of manufacturing the same Aug. 24, 2010
7709401 Method of making thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperature May. 4, 2010
7659198 In-situ deposition for Cu hillock suppression Feb. 9, 2010
7651943 Forming diffusion barriers by annealing copper alloy layers Jan. 26, 2010
7629249 Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods Dec. 8, 2009
7595556 Semiconductor device and method for manufacturing the same Sep. 29, 2009
7576003 Dual liner capping layer interconnect structure and method Aug. 18, 2009
7569467 Semiconductor device and manufacturing method thereof Aug. 4, 2009
7566964 Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structures Jul. 28, 2009
7507666 Manufacture method for semiconductor device having concave portions filled with conductor containing Cu as its main composition Mar. 24, 2009
7498600 Variable resistance random access memory device and a method of fabricating the same Mar. 3, 2009
7491575 Fabricating zinc oxide semiconductor using hydrolysis Feb. 17, 2009
7442644 Method for manufacturing nitride semiconductor wafer or nitride semiconductor device; nitride semiconductor wafer or nitride semiconductor device made by the same; and laser irradiating appara Oct. 28, 2008
7435679 Alloyed underlayer for microelectronic interconnects Oct. 14, 2008
7432198 Semiconductor devices and methods of forming interconnection lines therein Oct. 7, 2008
7382042 COF flexible printed wiring board and method of producing the wiring board Jun. 3, 2008
7319052 Alloying method, and wiring forming method, display device forming method, and image display unit fabricating method Jan. 15, 2008
7307018 Method of fabricating conductive lines Dec. 11, 2007
7279380 Method of forming a chalcogenide memory cell having an ultrasmall cross-sectional area and a chalcogenide memory cell produced by the method Oct. 9, 2007
7229917 Film formation method and apparatus for semiconductor process Jun. 12, 2007
7198989 Method of producing a COF flexible printed wiring board Apr. 3, 2007
7183209 Semiconductor device and manufacturing method thereof Feb. 27, 2007
7154180 Electronic device, method of manufacture of the same, and sputtering target Dec. 26, 2006
7098539 Electronic device, method of manufacture of the same, and sputtering target Aug. 29, 2006
7074709 Localized doping and/or alloying of metallization for increased interconnect performance Jul. 11, 2006
7049227 Method for alloying a wiring portion for a image display device May. 23, 2006
7041584 Method of manufacturing semiconductor device and the semiconductor device May. 9, 2006
7033930 Interconnect structures in a semiconductor device and processes of formation Apr. 25, 2006
7022598 Method of producing multilayer interconnection structure Apr. 4, 2006

1 2 3 4 5 6 7










 
 
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