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Class Information
Number: 257/E21.59
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Interconnections, comprising conductors and dielectrics, for carrying current between separate components within device (epo) > Characterized by formation and post treatment of dielectrics, e.g., planarizing (epo) > Local interconnects; local pads (epo)
Description: This subclass is indented under subclass E21.582. This subclass is substantially the same in scope as ECLA classification H01L21/768C10.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6235576 |
Method for manufacturing a cylindrical capacitor |
May. 22, 2001 |
| 6235632 |
Tungsten plug formation |
May. 22, 2001 |
| 6236091 |
Method of forming a local interconnect with improved etch selectivity of silicon dioxide/silicide |
May. 22, 2001 |
| 6228711 |
Method of fabricating dynamic random access memory |
May. 8, 2001 |
| 6228738 |
Methods of forming capacitors structures and DRAM cells |
May. 8, 2001 |
| 6228761 |
Method of forming a local interconnect with improved etch selectivity of silicon dioxide/silicide |
May. 8, 2001 |
| 6229167 |
Semiconductor device and method of manufacturing the same |
May. 8, 2001 |
| 6225675 |
Integrated circuitry, methods of fabricating integrated circuitry, methods of forming local interconnects, and methods of forming conductive lines |
May. 1, 2001 |
| 6223432 |
Method of forming dual conductive plugs |
May. 1, 2001 |
| 6225160 |
Method of manufacturing bottom electrode of capacitor |
May. 1, 2001 |
| 6225216 |
Method of forming a local interconnect with improved etch selectivity of silicon dioxide/silicide |
May. 1, 2001 |
| 6218271 |
Method of forming a landing pad on the drain and source of a MOS transistor |
Apr. 17, 2001 |
| 6210979 |
Method for fabricating ferroelectric capacitor improving adhesive strength between upper electrode and capping layer without polymer in FRAM device |
Apr. 3, 2001 |
| 6211054 |
Method of forming a conductive line and method of forming a local interconnect |
Apr. 3, 2001 |
| 6211079 |
Method for fabricating interconnects of a dynamic random access memory (DRAM) |
Apr. 3, 2001 |
| 6211556 |
Eliminating buried contact trench in MOSFET devices having self-aligned silicide |
Apr. 3, 2001 |
| 6207514 |
Method for forming borderless gate structures and apparatus formed thereby |
Mar. 27, 2001 |
| 6207515 |
Method of fabricating buried source to shrink chip size in memory array |
Mar. 27, 2001 |
| 6207539 |
Semiconductor device having field isolating film of which upper surface is flat and method thereof |
Mar. 27, 2001 |
| 6207543 |
Metallization technique for gate electrodes and local interconnects |
Mar. 27, 2001 |
| 6207574 |
Method for fabricating a DRAM cell storage node |
Mar. 27, 2001 |
| 6207575 |
Local interconnect etch characterization using AFM |
Mar. 27, 2001 |
| 6207997 |
Thin film transistor for antistatic circuit and method for fabricating the same |
Mar. 27, 2001 |
| 6204121 |
Method for bottom electrode of capacitor |
Mar. 20, 2001 |
| 6204144 |
Method for forming a metal capacitor with two metal electrodes |
Mar. 20, 2001 |
| 6200821 |
Method for fabricating ferroelectric random access memory device |
Mar. 13, 2001 |
| 6200871 |
High performance self-aligned silicide process for sub-half-micron semiconductor technologies |
Mar. 13, 2001 |
| 6201303 |
Method of forming a local interconnect with improved etch selectivity of silicon dioxide/silicide |
Mar. 13, 2001 |
| 6201726 |
Ferroelectric memory device structure useful for preventing hydrogen line degradation |
Mar. 13, 2001 |
| 6197696 |
Method for forming interconnection structure |
Mar. 6, 2001 |
| 6194313 |
Method for reducing recess for the formation of local interconnect and or plug trench fill for etchback process |
Feb. 27, 2001 |
| 6190953 |
Semiconductor device and method for producing same |
Feb. 20, 2001 |
| 6190957 |
Method of forming a ferroelectric device |
Feb. 20, 2001 |
| 6190962 |
Method of fabricating capacitor |
Feb. 20, 2001 |
| 6190990 |
Method for manufacturing the storage node of a capacitor on a semiconductor wafer |
Feb. 20, 2001 |
| 6187626 |
Forming a semi-recessed capacitor structure in an inter-polysilicon dielectric |
Feb. 13, 2001 |
| 6187689 |
Manufacture of semiconductor device with fine patterns |
Feb. 13, 2001 |
| 6184073 |
Process for forming a semiconductor device having an interconnect or conductive film electrically insulated from a conductive member or region |
Feb. 6, 2001 |
| 6184076 |
DRAM contact process by localized etch-stop removal |
Feb. 6, 2001 |
| 6180449 |
Depletion compensated polysilicon electrodes |
Jan. 30, 2001 |
| 6180475 |
Transistor formation with local interconnect overetch immunity |
Jan. 30, 2001 |
| 6180494 |
Integrated circuitry, methods of fabricating integrated circuitry, methods of forming local interconnects, and methods of forming conductive lines |
Jan. 30, 2001 |
| 6180970 |
Microelectronic devices including ferroelectric capacitors with lower electrodes extending into contact holes |
Jan. 30, 2001 |
| 6180976 |
Thin-film capacitors and methods for forming the same |
Jan. 30, 2001 |
| 6177304 |
Self-aligned contact process using a poly-cap mask |
Jan. 23, 2001 |
| 6177328 |
Methods of forming capacitors methods of forming DRAM cells, and integrated circuits incorporating structures and DRAM cell structures |
Jan. 23, 2001 |
| 6174735 |
Method of manufacturing ferroelectric memory device useful for preventing hydrogen line degradation |
Jan. 16, 2001 |
| 6174781 |
Dual damascene process for capacitance fabrication of DRAM |
Jan. 16, 2001 |
| 6174782 |
Method of fabricating lower electrode of capacitor |
Jan. 16, 2001 |
| 6174803 |
Integrated circuit device interconnection techniques |
Jan. 16, 2001 |
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