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Browse by Category: Main > Physics
Class Information
Number: 257/E21.589
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Interconnections, comprising conductors and dielectrics, for carrying current between separate components within device (epo) > Characterized by formation and post treatment of dielectrics, e.g., planarizing (epo) > By forming conductive members before deposition of protective insulating material, e.g., pillars, studs (epo)
Description: This subclass is indented under subclass E21.582. This subclass is substantially the same in scope as ECLA classification H01L21/768C6.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8680677 Carbon nanotube-based conductive connections for integrated circuit devices Mar. 25, 2014
8653657 Semiconductor chip, method of manufacturing semiconductor chip, and semiconductor device Feb. 18, 2014
8642446 Semiconductor device and method of forming protective structure around semiconductor die for localized planarization of insulating layer Feb. 4, 2014
8586469 Metal layer end-cut flow Nov. 19, 2013
8518816 Method for making electrical interconnections with carbon nanotubes Aug. 27, 2013
8501615 Metal bump formation Aug. 6, 2013
8486824 Enhancing metal/low-K interconnect reliability using a protection layer Jul. 16, 2013
8455298 Method for forming self-aligned phase-change semiconductor diode memory Jun. 4, 2013
8440557 Method for fabricating a semiconductor device by considering the extinction coefficient during etching of an interlayer insulating film May. 14, 2013
8395230 Semiconductor device and method of manufacturing the same Mar. 12, 2013
8367473 Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereof Feb. 5, 2013
8330272 Microelectronic packages with dual or multiple-etched flip-chip connectors Dec. 11, 2012
8304919 Integrated circuit system with stress redistribution layer and method of manufacture thereof Nov. 6, 2012
8288850 Method for packaging micromachined devices Oct. 16, 2012
8242014 Method for manufacturing a semiconductor device having an interconnect structure and a reinforcing insulating film Aug. 14, 2012
8216936 Low capacitance electrical connection via Jul. 10, 2012
8207058 Electron beam induced deposition of interface to carbon nanotube Jun. 26, 2012
8173536 Semiconductor device and method of forming column interconnect structure to reduce wafer stress May. 8, 2012
8138607 Metal fill structures for reducing parasitic capacitance Mar. 20, 2012
8125091 Wire bonding over active circuits Feb. 28, 2012
8110924 Semiconductor device and method for manufacturing same Feb. 7, 2012
8071471 Packaging conductive structure and method for manufacturing the same Dec. 6, 2011
8072070 Low fabrication cost, fine pitch and high reliability solder bump Dec. 6, 2011
8067310 Semiconductor device and method for manufacturing of same Nov. 29, 2011
8053269 Method of forming display device that includes removing mask to form opening in insulating film Nov. 8, 2011
8044517 Electronic component comprising predominantly organic functional materials and a method for the production thereof Oct. 25, 2011
8008186 Semiconductor device and method of fabricating the same Aug. 30, 2011
7994541 Semiconductor device and metal line fabrication method of the same Aug. 9, 2011
7960258 Method for fabricating nanoscale thermoelectric device Jun. 14, 2011
7893421 Phase change memory device capable of satisfying reset current characteristic and contact resistance characteristic Feb. 22, 2011
7871918 Manufacturing method of contact structure Jan. 18, 2011
7847401 Methods, systems and structures for forming semiconductor structures incorporating high-temperature processing steps Dec. 7, 2010
7795135 Method for producing a layer arrangement Sep. 14, 2010
7786007 Method and apparatus of stress relief in semiconductor structures Aug. 31, 2010
7772128 Semiconductor system with surface modification Aug. 10, 2010
7709949 Densely packed metal segments patterned in a semiconductor die May. 4, 2010
7709325 Method of forming ring electrode May. 4, 2010
7671382 Semiconductor device with thermoplastic resin to reduce warpage Mar. 2, 2010
7670874 Plated pillar package formation Mar. 2, 2010
7632709 Method of manufacturing wafer level package Dec. 15, 2009
7625766 Methods of forming carbon nanotubes and methods of fabricating integrated circuitry Dec. 1, 2009
7595265 Semiconductor device and method for forming a metal line in the semiconductor device Sep. 29, 2009
7585758 Interconnect layers without electromigration Sep. 8, 2009
7582935 Methods for manufacturing SOI substrate using wafer bonding and complementary high voltage bipolar transistor using the SOI substrate Sep. 1, 2009
7575998 Semiconductor device and metal line fabrication method of the same Aug. 18, 2009
7572723 Micropad for bonding and a method therefor Aug. 11, 2009
7563718 Method for forming tungsten layer of semiconductor device and method for forming tungsten wiring layer using the same Jul. 21, 2009
7557030 Method for fabricating a recess gate in a semiconductor device Jul. 7, 2009
7491639 Method of manufacturing a semiconductor device and semiconductor obtained by means of such a method Feb. 17, 2009
7338867 Semiconductor device having contact pads and method for manufacturing the same Mar. 4, 2008

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