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Class Information
Number: 257/E21.586
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Interconnections, comprising conductors and dielectrics, for carrying current between separate components within device (epo) > Characterized by formation and post treatment of dielectrics, e.g., planarizing (epo) > Filling of holes, grooves, vias or trenches with conductive material (epo) > By selective deposition of conductive material in vias, e.g., selective chemical vapor deposition on semiconductor material, plating (epo)
Description: This subclass is indented under subclass E21.585. This subclass is substantially the same in scope as ECLA classification H01L21/768C4B.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7416975 |
Method of forming contact layers on substrates |
Aug. 26, 2008 |
| 7413978 |
Substrate, electro-optical device, electronic apparatus, method of forming substrate, method of forming electro-optical device, and method of forming electronic apparatus |
Aug. 19, 2008 |
| 7407884 |
Method for forming an aluminum contact |
Aug. 5, 2008 |
| 7402517 |
Method and apparatus for selective deposition of materials to surfaces and substrates |
Jul. 22, 2008 |
| 7393755 |
Dummy fill for integrated circuits |
Jul. 1, 2008 |
| 7384867 |
Formation of composite tungsten films |
Jun. 10, 2008 |
| 7375014 |
Methods of electrochemically treating semiconductor substrates |
May. 20, 2008 |
| 7371682 |
Production method for electronic component and electronic component |
May. 13, 2008 |
| 7368379 |
Multi-layer interconnect structure for semiconductor devices |
May. 6, 2008 |
| 7344986 |
Plating solution, semiconductor device and method for manufacturing the same |
Mar. 18, 2008 |
| 7344977 |
Method of electroplating a substance over a semiconductor substrate |
Mar. 18, 2008 |
| 7341945 |
Method of fabricating semiconductor device |
Mar. 11, 2008 |
| 7329582 |
Methods for fabricating a semiconductor device, which include selectively depositing an electrically conductive material |
Feb. 12, 2008 |
| 7314827 |
Method of manufacturing semiconductor device |
Jan. 1, 2008 |
| 7312149 |
Copper plating of semiconductor devices using single intermediate low power immersion step |
Dec. 25, 2007 |
| 7247560 |
Selective deposition of double damascene metal |
Jul. 24, 2007 |
| 7238610 |
Method and apparatus for selective deposition |
Jul. 3, 2007 |
| 7226860 |
Method and apparatus for fabricating metal layer |
Jun. 5, 2007 |
| 7189650 |
Method and apparatus for copper film quality enhancement with two-step deposition |
Mar. 13, 2007 |
| 7189638 |
Method for manufacturing metal structure using trench |
Mar. 13, 2007 |
| 7169700 |
Metal interconnect features with a doping gradient |
Jan. 30, 2007 |
| 7144811 |
Method of forming a protective layer over Cu filled semiconductor features |
Dec. 5, 2006 |
| 7067351 |
Selectively-etched nanochannel electrophoretic and electrochemical devices |
Jun. 27, 2006 |
| 7060543 |
Method of forming a conductive line for a semiconductor device using a carbon nanotube and semiconductor device manufactured using the method |
Jun. 13, 2006 |
| 7060555 |
Semiconductor device and method of manufacturing the same |
Jun. 13, 2006 |
| 7051934 |
Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recesses |
May. 30, 2006 |
| 7049231 |
Methods of forming capacitors |
May. 23, 2006 |
| 7008872 |
Use of conductive electrolessly deposited etch stop layers, liner layers and via plugs in interconnect structures |
Mar. 7, 2006 |
| 7005379 |
Semiconductor processing methods for forming electrical contacts |
Feb. 28, 2006 |
| 6998339 |
Method of forming conductor wiring pattern |
Feb. 14, 2006 |
| 6992389 |
Barrier for interconnect and method |
Jan. 31, 2006 |
| 6964922 |
Methods for forming metal interconnections for semiconductor devices having multiple metal depositions |
Nov. 15, 2005 |
| 6958547 |
Interconnect structures containing conductive electrolessly deposited etch stop layers, liner layers, and via plugs |
Oct. 25, 2005 |
| 6955983 |
Methods of forming metal interconnections of semiconductor devices by treating a barrier metal layer |
Oct. 18, 2005 |
| 6946387 |
Semiconductor device and method for manufacturing the same |
Sep. 20, 2005 |
| 6933231 |
Methods of forming conductive interconnects, and methods of depositing nickel |
Aug. 23, 2005 |
| 6933222 |
Microcircuit fabrication and interconnection |
Aug. 23, 2005 |
| 6933225 |
Graded thin films |
Aug. 23, 2005 |
| 6933228 |
Method of manufacturing of contact plug in a contact hole on a silicon substrate |
Aug. 23, 2005 |
| 6933230 |
Method for making interconnects and diffusion barriers in integrated circuits |
Aug. 23, 2005 |
| 6921551 |
Plating method and apparatus for controlling deposition on predetermined portions of a workpiece |
Jul. 26, 2005 |
| 6916733 |
Method for fabricating contact pad of semiconductor device |
Jul. 12, 2005 |
| 6908853 |
Method of fabricating a semiconductor device having reduced contact resistance |
Jun. 21, 2005 |
| 6905588 |
Packaging deposition methods |
Jun. 14, 2005 |
| 6905950 |
Growing copper vias or lines within a patterned resist using a copper seed layer |
Jun. 14, 2005 |
| 6903011 |
Displacement method to grow cu overburden |
Jun. 7, 2005 |
| 6893957 |
Method of forming a dual damascene interconnect by selective metal deposition |
May. 17, 2005 |
| 6878617 |
Method of forming copper wire on semiconductor device |
Apr. 12, 2005 |
| 6879044 |
Structure for contact formation using a silicon-germanium alloy |
Apr. 12, 2005 |
| 6867473 |
Plating a conductive material on a dielectric material |
Mar. 15, 2005 |
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