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Class Information
Number: 257/E21.586
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Interconnections, comprising conductors and dielectrics, for carrying current between separate components within device (epo) > Characterized by formation and post treatment of dielectrics, e.g., planarizing (epo) > Filling of holes, grooves, vias or trenches with conductive material (epo) > By selective deposition of conductive material in vias, e.g., selective chemical vapor deposition on semiconductor material, plating (epo)
Description: This subclass is indented under subclass E21.585. This subclass is substantially the same in scope as ECLA classification H01L21/768C4B.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618887 |
Semiconductor device with a metal line and method of forming the same |
Nov. 17, 2009 |
| 7605070 |
Semiconductor device having contact plug formed in double structure by using epitaxial stack and metal layer and method for fabricating the same |
Oct. 20, 2009 |
| 7598170 |
Plasma-enhanced ALD of tantalum nitride films |
Oct. 6, 2009 |
| 7598163 |
Post-seed deposition process |
Oct. 6, 2009 |
| 7592254 |
Methods for coating and filling high aspect ratio recessed features |
Sep. 22, 2009 |
| 7592258 |
Metallization layer of a semiconductor device having differently thick metal lines and a method of forming the same |
Sep. 22, 2009 |
| 7579271 |
Method for forming low dielectric constant fluorine-doped layers |
Aug. 25, 2009 |
| 7579276 |
Substrate processing apparatus and method of manufacturing semiconductor device |
Aug. 25, 2009 |
| 7572723 |
Micropad for bonding and a method therefor |
Aug. 11, 2009 |
| 7563717 |
Method for fabricating a semiconductor device |
Jul. 21, 2009 |
| 7563718 |
Method for forming tungsten layer of semiconductor device and method for forming tungsten wiring layer using the same |
Jul. 21, 2009 |
| 7547632 |
Methods of forming metal layers in the fabrication of semiconductor devices |
Jun. 16, 2009 |
| 7544605 |
Method of making a contact on a backside of a die |
Jun. 9, 2009 |
| 7521361 |
Method for manufacturing wiring substrate |
Apr. 21, 2009 |
| 7517782 |
Method of forming a metal layer over a patterned dielectric by wet chemical deposition including an electroless and a powered phase |
Apr. 14, 2009 |
| 7517800 |
Semiconductor device and manufacturing method thereof |
Apr. 14, 2009 |
| 7485574 |
Methods of forming a metal line in a semiconductor device |
Feb. 3, 2009 |
| 7482289 |
Methods and apparatus for depositing tantalum metal films to surfaces and substrates |
Jan. 27, 2009 |
| 7473930 |
Use of patterned CNT arrays for display purposes |
Jan. 6, 2009 |
| 7470617 |
Treating a liner layer to reduce surface oxides |
Dec. 30, 2008 |
| 7470619 |
Interconnect with high aspect ratio plugged vias |
Dec. 30, 2008 |
| 7468317 |
Method of forming metal line of semiconductor device |
Dec. 23, 2008 |
| 7446366 |
Process sequence for doped silicon fill of deep trenches |
Nov. 4, 2008 |
| 7446415 |
Method for filling electrically different features |
Nov. 4, 2008 |
| 7416975 |
Method of forming contact layers on substrates |
Aug. 26, 2008 |
| 7413978 |
Substrate, electro-optical device, electronic apparatus, method of forming substrate, method of forming electro-optical device, and method of forming electronic apparatus |
Aug. 19, 2008 |
| 7407884 |
Method for forming an aluminum contact |
Aug. 5, 2008 |
| 7402517 |
Method and apparatus for selective deposition of materials to surfaces and substrates |
Jul. 22, 2008 |
| 7393755 |
Dummy fill for integrated circuits |
Jul. 1, 2008 |
| 7384867 |
Formation of composite tungsten films |
Jun. 10, 2008 |
| 7375014 |
Methods of electrochemically treating semiconductor substrates |
May. 20, 2008 |
| 7371682 |
Production method for electronic component and electronic component |
May. 13, 2008 |
| 7368379 |
Multi-layer interconnect structure for semiconductor devices |
May. 6, 2008 |
| 7344977 |
Method of electroplating a substance over a semiconductor substrate |
Mar. 18, 2008 |
| 7344986 |
Plating solution, semiconductor device and method for manufacturing the same |
Mar. 18, 2008 |
| 7341945 |
Method of fabricating semiconductor device |
Mar. 11, 2008 |
| 7329582 |
Methods for fabricating a semiconductor device, which include selectively depositing an electrically conductive material |
Feb. 12, 2008 |
| 7314827 |
Method of manufacturing semiconductor device |
Jan. 1, 2008 |
| 7312149 |
Copper plating of semiconductor devices using single intermediate low power immersion step |
Dec. 25, 2007 |
| 7247560 |
Selective deposition of double damascene metal |
Jul. 24, 2007 |
| 7238610 |
Method and apparatus for selective deposition |
Jul. 3, 2007 |
| 7226860 |
Method and apparatus for fabricating metal layer |
Jun. 5, 2007 |
| 7189638 |
Method for manufacturing metal structure using trench |
Mar. 13, 2007 |
| 7189650 |
Method and apparatus for copper film quality enhancement with two-step deposition |
Mar. 13, 2007 |
| 7169700 |
Metal interconnect features with a doping gradient |
Jan. 30, 2007 |
| 7144811 |
Method of forming a protective layer over Cu filled semiconductor features |
Dec. 5, 2006 |
| 7067351 |
Selectively-etched nanochannel electrophoretic and electrochemical devices |
Jun. 27, 2006 |
| 7060555 |
Semiconductor device and method of manufacturing the same |
Jun. 13, 2006 |
| 7060543 |
Method of forming a conductive line for a semiconductor device using a carbon nanotube and semiconductor device manufactured using the method |
Jun. 13, 2006 |
| 7051934 |
Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recesses |
May. 30, 2006 |
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